Takanori Okita

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Kanagawa, JP

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and manufacturing method therefor
- Patent number 10,037,966
- Issue date Jul 31, 2018
- Renesas Electronics Corporation
- Toshihiro Iwasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor device
- Patent number 8,975,119
- Issue date Mar 10, 2015
- Renesas Electronics Corporation
- Katsuhito Kamachi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultrasonic wire bonding method for a semiconductor device
- Patent number 8,569,163
- Issue date Oct 29, 2013
- Renesas Electronics Corporation
- Masahiko Sekihara
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
- Publication number 20170092614
- Publication date Mar 30, 2017
- RENESAS ELECTRONICS CORPORATION
- Toshihiro IWASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20130244381
- Publication date Sep 19, 2013
- RENESAS ELECTRONICS CORPORATION
- Katsuhito KAMACHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ultrasonic Wire Bonding Method for a Semiconductor Device
- Publication number 20120164795
- Publication date Jun 28, 2012
- RENESAS ELECTRONICS CORPORATION
- Masahiko Sekihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
- Publication number 20120098126
- Publication date Apr 26, 2012
- Renesas Electronics Corporation
- Toshihiro IWASAKI
- H01 - BASIC ELECTRIC ELEMENTS