Takanori SUGIYAMA

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Matsumoto, JP

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Patents Grantslast 30 patents

Information Patent Grant
Wire bonding tool including a wedge tool
- Patent number 11,121,114
- Issue date Sep 14, 2021
- Fuji Electric Co., Ltd.
- Takanori Sugiyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Terminal structure and semiconductor module
- Patent number 10,886,205
- Issue date Jan 5, 2021
- Fuji Electric Co., Ltd.
- Takanori Sugiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module and resin case
- Patent number 10,109,543
- Issue date Oct 23, 2018
- Fuji Electric Co., Ltd.
- Takanori Sugiyama
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20210358827
- Publication date Nov 18, 2021
- Fuji Electric Co., Ltd.
- Takanori SUGIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TERMINAL STRUCTURE AND SEMICONDUCTOR MODULE
- Publication number 20190348349
- Publication date Nov 14, 2019
- Fuji Electric Co., Ltd.
- Takanori SUGIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WEDGE TOOL AND WEDGE BONDING METHOD
- Publication number 20190088616
- Publication date Mar 21, 2019
- Fuji Electric Co., Ltd.
- Takanori SUGIYAMA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR MODULE AND RESIN CASE
- Publication number 20160276234
- Publication date Sep 22, 2016
- Fuji Electric Co., Ltd.
- Takanori SUGIYAMA
- H01 - BASIC ELECTRIC ELEMENTS