Takao Kamoshima

Person

Hyogo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 10,490,445
- Issue date Nov 26, 2019
- Renesas Electronics Corporation
- Takao Kamoshima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having metal contacts formed in an interlayer...
- Patent number 8,203,210
- Issue date Jun 19, 2012
- Renesas Electronics Corporation
- Takeshi Furusawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a semiconductor device
- Patent number 6,740,564
- Issue date May 25, 2004
- Renesas Technology Corp.
- Takao Kamoshima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device and semiconductor device
- Patent number 6,645,863
- Issue date Nov 11, 2003
- Mitsubishi Denki Kabushiki Kaisha
- Hiroki Takewaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for manufacturing semiconductor device
- Patent number 6,503,836
- Issue date Jan 7, 2003
- Mitsubishi Denki Kabushiki Kaisha
- Takeru Matsuoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 6,214,723
- Issue date Apr 10, 2001
- Mitsubishi Denki Kabushiki Kaisha
- Takao Kamoshima
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20180090365
- Publication date Mar 29, 2018
- RENESAS ELECTRONICS CORPORATION
- Takao KAMOSHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20130241067
- Publication date Sep 19, 2013
- RENESAS ELECTRONICS CORPORATION
- Takeshi FURUSAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20120289032
- Publication date Nov 15, 2012
- Renesas Electronics Corporation
- Takeshi FURUSAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20110001246
- Publication date Jan 6, 2011
- Renesas Electronics Corporation
- Takeshi FURUSAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20100314620
- Publication date Dec 16, 2010
- Renesas Electronics Corporation
- Takeshi FURUSAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20090184424
- Publication date Jul 23, 2009
- RENESAS TECHNOLOGY CORP.
- Takeshi Furusawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20080230847
- Publication date Sep 25, 2008
- Takeshi Furusawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnection structure
- Publication number 20070029677
- Publication date Feb 8, 2007
- Renesas Technology Corp.
- Takao Kamoshima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20040207085
- Publication date Oct 21, 2004
- RENESAS TECHNOLOGY CORP.
- Yasuhisa Fujii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnection structure
- Publication number 20040173905
- Publication date Sep 9, 2004
- RENESAS TECHNOLOGY CORP.
- Takao Kamoshima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20040130033
- Publication date Jul 8, 2004
- Renesas Technology Corp.
- Takeshi Masamitsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device including a capacitor
- Publication number 20040036098
- Publication date Feb 26, 2004
- Mitsubishi Denki Kabushiki Kaisha
- Noriaki Fujiki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wiring structure
- Publication number 20040017279
- Publication date Jan 29, 2004
- Mitsubishi Denki Kabushiki Kaisha
- Takao Kamoshima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for manufacturing a semiconductor device
- Publication number 20030100178
- Publication date May 29, 2003
- Takao Kamoshima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing semiconductor device and semiconductor device
- Publication number 20020177325
- Publication date Nov 28, 2002
- Mitsubishi Denki Kabushiki Kaisha
- Hiroki Takewaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20020093097
- Publication date Jul 18, 2002
- Mitsubishi Denki Kabushiki Kaisha
- Takao Kamoshima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contact structure, semiconductor device and manufacturing method th...
- Publication number 20020081836
- Publication date Jun 27, 2002
- Mitsubishi Denki Kabushiki Kaisha
- Hiroki Takewaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for manufacturing semiconductor device
- Publication number 20020019134
- Publication date Feb 14, 2002
- Mitsubishi Denki Kabushiki Kaisha
- Takeru Matsuoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20010017415
- Publication date Aug 30, 2001
- Mitsubishi Denki Kabushiki Kaisha
- Takao Kamoshima
- H01 - BASIC ELECTRIC ELEMENTS

Takao Kamoshima

Person

Patents Grantslast 30 patents

Semiconductor device and method of manufacturing the same

Semiconductor device having metal contacts formed in an interlayer...

Method for manufacturing a semiconductor device

Method of manufacturing semiconductor device and semiconductor device

Method and apparatus for manufacturing semiconductor device

Method of manufacturing a semiconductor device

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

Interconnection structure

Semiconductor device and method of manufacturing the same

Interconnection structure

Semiconductor device

Semiconductor device including a capacitor

Wiring structure

Method for manufacturing a semiconductor device

Method of manufacturing semiconductor device and semiconductor device

Semiconductor device

Contact structure, semiconductor device and manufacturing method th...

Method and apparatus for manufacturing semiconductor device

Semiconductor device and manufacturing method thereof