Takao Matsushita

Person

Osaka, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method for separating protective tape, and apparatus using the same
- Patent number 7,789,988
- Issue date Sep 7, 2010
- Nitto Denko Corporation
- Masayuki Yamamoto
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Semiconductor wafer transport method and semiconductor wafer transp...
- Patent number 7,078,262
- Issue date Jul 18, 2006
- Nitto Denko Corporation
- Masayuki Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Automatic semiconductor wafer applying apparatus
- Patent number 6,249,943
- Issue date Jun 26, 2001
- Nitto Denko Corporation
- Takao Matsushita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resist removing apparatus and method
- Patent number 6,235,144
- Issue date May 22, 2001
- Nitto Denko Corporation
- Masayuki Yamamoto
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Resist removing method
- Patent number 6,099,675
- Issue date Aug 8, 2000
- Nitto Denko Corporation
- Masayuki Yamamoto
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method and apparatus for peeling protective adhesive tape from semi...
- Patent number 5,891,298
- Issue date Apr 6, 1999
- Nitto Denko Corporation
- Shigeji Kuroda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resist removing apparatus
- Patent number 5,759,336
- Issue date Jun 2, 1998
- Nitto Denko Corporation
- Masayuki Yamamoto
- B08 - CLEANING
Information Patent Grant
Process for peeling protective film off a wafer
- Patent number 5,009,735
- Issue date Apr 23, 1991
- Nitto Denko Corporation
- Minoru Ametani
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Sticking and cutoff device for adhering adhesive tape on thin articles
- Patent number 4,865,677
- Issue date Sep 12, 1989
- Nitto Electric Industrial Co., Ltd.
- Takao Matsushita
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ULTRAVIOLET IRRADIATION METHOD AND APPARATUS USING THE SAME
- Publication number 20090095418
- Publication date Apr 16, 2009
- Masayuki Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for separating protective tape, and apparatus using the same
- Publication number 20070284038
- Publication date Dec 13, 2007
- Nitto Denko Corporation
- Masayuki Yamamoto
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Semiconductor wafer transport method and semiconductor wafer transp...
- Publication number 20030133762
- Publication date Jul 17, 2003
- Masayuki Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS

Takao Matsushita

Person

Patents Grantslast 30 patents

Method for separating protective tape, and apparatus using the same

Semiconductor wafer transport method and semiconductor wafer transp...

Automatic semiconductor wafer applying apparatus

Resist removing apparatus and method

Resist removing method

Method and apparatus for peeling protective adhesive tape from semi...

Resist removing apparatus

Process for peeling protective film off a wafer

Sticking and cutoff device for adhering adhesive tape on thin articles

Patents Applicationslast 30 patents

ULTRAVIOLET IRRADIATION METHOD AND APPARATUS USING THE SAME

Method for separating protective tape, and apparatus using the same

Semiconductor wafer transport method and semiconductor wafer transp...