Takao Nishimura

Person

Kawasaki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Stacked semiconductor chips having double adhesive insulating layer...
- Patent number 8,841,776
- Issue date Sep 23, 2014
- Fujitsu Semiconductor Limited
- Takao Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 8,810,043
- Issue date Aug 19, 2014
- Fujitsu Semiconductor Limited
- Takao Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method including deformation of supporting board to a...
- Patent number 8,748,229
- Issue date Jun 10, 2014
- Fujitsu Semiconductor Limited
- Takao Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board for flip-chip mounting, mounting structure of electron...
- Patent number 8,659,168
- Issue date Feb 25, 2014
- Fujitsu Semiconductor Limited
- Takao Nishimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Relay board and semiconductor device having the relay board
- Patent number 8,404,980
- Issue date Mar 26, 2013
- Fujitsu Semiconductor Limited
- Takao Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for mounting electronic components
- Patent number 8,230,590
- Issue date Jul 31, 2012
- Fujitsu Semiconductor Limited
- Takao Nishimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device suitable for a stacked structure
- Patent number 8,216,934
- Issue date Jul 10, 2012
- Fujitsu Semiconductor Limited
- Eiji Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and plural semiconductor elements with suppres...
- Patent number 8,198,728
- Issue date Jun 12, 2012
- Fujitsu Semiconductor Limited
- Takao Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method for the same
- Patent number 8,134,240
- Issue date Mar 13, 2012
- Fujitsu Semiconductor Limited
- Takao Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate and electronic device
- Patent number 8,125,789
- Issue date Feb 28, 2012
- Fujitsu Semiconductor Limited
- Takao Nishimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and manufacturing method of semiconductor device
- Patent number 8,076,769
- Issue date Dec 13, 2011
- Fujitsu Semiconductor Limited
- Takao Nishimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 8,076,785
- Issue date Dec 13, 2011
- Fujitsu Semiconductor Limited
- Takao Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 8,048,719
- Issue date Nov 1, 2011
- Fujitsu Semiconductor Limited
- Takao Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Relay board provided in semiconductor device, semiconductor device,...
- Patent number 7,973,404
- Issue date Jul 5, 2011
- Fujitsu Semiconductor Limited
- Takao Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method of the same
- Patent number 7,906,852
- Issue date Mar 15, 2011
- Fujitsu Semiconductor Limited
- Takao Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device suitable for a stacked structure
- Patent number 7,884,459
- Issue date Feb 8, 2011
- Fujitsu Semiconductor Limited
- Eiji Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board and semiconductor device
- Patent number 7,880,276
- Issue date Feb 1, 2011
- Fujitsu Semiconductor Limited
- Takao Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit substrate and semiconductor device
- Patent number 7,755,203
- Issue date Jul 13, 2010
- Fujitsu Semiconductor Limited
- Takao Nishimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 7,687,319
- Issue date Mar 30, 2010
- Fujitsu Microelectronics Limited
- Takao Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a bump formed over an electrode pad
- Patent number 7,679,188
- Issue date Mar 16, 2010
- Fujitsu Microelectronics Limited
- Takao Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device sealed with electrical insulation sealing member
- Patent number 7,528,460
- Issue date May 5, 2009
- Fujitsu Microelectronics Limited
- Takao Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked-type semiconductor device
- Patent number 7,217,993
- Issue date May 15, 2007
- Fujitsu Limited
- Takao Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor device
- Patent number 7,049,692
- Issue date May 23, 2006
- Fujitsu Limited
- Takao Nishimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 6,960,827
- Issue date Nov 1, 2005
- Fujitsu Limited
- Takao Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 6,781,241
- Issue date Aug 24, 2004
- Fujitsu Limited
- Takao Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor device and method of producing the same
- Patent number 6,777,799
- Issue date Aug 17, 2004
- Fujitsu Limited
- Katsuhito Kikuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor device and method of producing the same
- Patent number 6,621,169
- Issue date Sep 16, 2003
- Fujitsu Limited
- Katsuhito Kikuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having cap
- Patent number 6,239,486
- Issue date May 29, 2001
- Fujitsu Limited
- Nobutaka Shimizu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SEMICONDUCTOR...
- Publication number 20120322202
- Publication date Dec 20, 2012
- FUJITSU SEMICONDUCTOR LIMITED
- Takao Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20110278723
- Publication date Nov 17, 2011
- FUJITSU SEMICONDUCTOR LIMITED
- Takao Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE SUITABLE FOR A STACKED STRUCTURE
- Publication number 20110092065
- Publication date Apr 21, 2011
- FUJITSU SEMICONDUCTOR LIMITED
- Eiji YOSHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELAY BOARD AND SEMICONDUCTOR DEVICE HAVING THE RELAY BOARD
- Publication number 20100258926
- Publication date Oct 14, 2010
- FUJITSU SEMICONDUCTOR LIMITED (Formerly Fujitsu Microelectronics Limited)
- Takao Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR THE SAME
- Publication number 20090321927
- Publication date Dec 31, 2009
- Fujitsu Microelectronics Limited
- Takao Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SEMICONDUCTOR...
- Publication number 20090309239
- Publication date Dec 17, 2009
- Fujitsu Microelectronics Limited
- Takao Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20090243092
- Publication date Oct 1, 2009
- Fujitsu Microelectronics Limited
- Takao NISHIMURA
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20090191702
- Publication date Jul 30, 2009
- FUJITSU LIMITED
- Takao Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20090057891
- Publication date Mar 5, 2009
- Fujitsu Limited
- Takao Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE SUITABLE FOR A STACKED STRUCTURE
- Publication number 20090008798
- Publication date Jan 8, 2009
- Fujitsu Limited
- Eiji Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN SEALING METHOD, MOLD FOR RESIN SEALING, AND RESIN SEALING APP...
- Publication number 20080230950
- Publication date Sep 25, 2008
- Fujitsu Limited
- Takao NISHIMURA
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
WIRING BOARD, MOUNTING STRUCTURE FOR ELECTRONIC COMPONENTS, AND SEM...
- Publication number 20080224325
- Publication date Sep 18, 2008
- Fujitsu Limited
- Takao NISHIMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE AND ELECTRONIC DEVICE
- Publication number 20080223608
- Publication date Sep 18, 2008
- Fujitsu Limited
- Takao NISHIMURA
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
METHOD FOR MOUNTING ELECTRONIC COMPONENTS
- Publication number 20080196245
- Publication date Aug 21, 2008
- Fujitsu Limited
- Takao Nishimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20080188058
- Publication date Aug 7, 2008
- Fujitsu Limited
- Takao Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND SEMICONDUCTOR DEVICE
- Publication number 20080179738
- Publication date Jul 31, 2008
- Fujitsu Limited
- Takao NISHIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of producing the same
- Publication number 20080150120
- Publication date Jun 26, 2008
- Fujitsu Limited
- Takao Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20080150157
- Publication date Jun 26, 2008
- Fujitsu Limited
- Takao Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit substrate and semiconductor device
- Publication number 20080042300
- Publication date Feb 21, 2008
- FUJITSU LIMITED
- Takao Nishimura
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Semiconductor device and manufacturing method for the same
- Publication number 20080023831
- Publication date Jan 31, 2008
- FUJITSU LIMITED
- Takao Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method for the same
- Publication number 20070182019
- Publication date Aug 9, 2007
- FUJITSU LIMITED
- Takao Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20070170600
- Publication date Jul 26, 2007
- FUJITSU LIMITED
- Takao Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Relay board provided in semiconductor device, semiconductor device,...
- Publication number 20070132102
- Publication date Jun 14, 2007
- FUJITSU LIMITED
- Takao Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Relay board and semiconductor device having the relay board
- Publication number 20070075437
- Publication date Apr 5, 2007
- FUJITSU LIMITED
- Takao Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20060289972
- Publication date Dec 28, 2006
- FUJITSU LIMITED
- Takao Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device, three-dimensional semiconductor device, and m...
- Publication number 20050167812
- Publication date Aug 4, 2005
- FUJITSU LIMITED
- Eiji Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked-type semiconductor device
- Publication number 20050006745
- Publication date Jan 13, 2005
- FUJITSU LIMITED
- Takao Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing methods thereof
- Publication number 20040188855
- Publication date Sep 30, 2004
- FUJITSU LIMITED
- Takao Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked semiconductor device
- Publication number 20040178508
- Publication date Sep 16, 2004
- FUJITSU LIMITED
- Takao Nishimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Stacked semiconductor device and method of producing the same
- Publication number 20040051119
- Publication date Mar 18, 2004
- FUJITSU LIMITED
- Katsuhito Kikuma
- H01 - BASIC ELECTRIC ELEMENTS

Takao Nishimura

Person

Patents Grantslast 30 patents

Stacked semiconductor chips having double adhesive insulating layer...

Semiconductor device

Manufacturing method including deformation of supporting board to a...

Wiring board for flip-chip mounting, mounting structure of electron...

Relay board and semiconductor device having the relay board

Method for mounting electronic components

Semiconductor device suitable for a stacked structure

Semiconductor device and plural semiconductor elements with suppres...

Semiconductor device and manufacturing method for the same

Wiring substrate and electronic device

Semiconductor device and manufacturing method of semiconductor device

Semiconductor device

Semiconductor device and manufacturing method thereof

Relay board provided in semiconductor device, semiconductor device,...

Semiconductor device and manufacturing method of the same

Semiconductor device suitable for a stacked structure

Wiring board and semiconductor device

Circuit substrate and semiconductor device

Semiconductor device and manufacturing method thereof

Semiconductor device having a bump formed over an electrode pad

Semiconductor device sealed with electrical insulation sealing member

Stacked-type semiconductor device

Stacked semiconductor device

Semiconductor device and manufacturing method thereof

Semiconductor device and manufacturing method thereof

Stacked semiconductor device and method of producing the same

Stacked semiconductor device and method of producing the same

Semiconductor device having cap

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SEMICONDUCTOR...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE SUITABLE FOR A STACKED STRUCTURE

RELAY BOARD AND SEMICONDUCTOR DEVICE HAVING THE RELAY BOARD

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR THE SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SEMICONDUCTOR...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE SUITABLE FOR A STACKED STRUCTURE

RESIN SEALING METHOD, MOLD FOR RESIN SEALING, AND RESIN SEALING APP...

WIRING BOARD, MOUNTING STRUCTURE FOR ELECTRONIC COMPONENTS, AND SEM...

WIRING SUBSTRATE AND ELECTRONIC DEVICE

METHOD FOR MOUNTING ELECTRONIC COMPONENTS

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

WIRING BOARD AND SEMICONDUCTOR DEVICE

Semiconductor device and method of producing the same

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

Circuit substrate and semiconductor device

Semiconductor device and manufacturing method for the same

Semiconductor device and manufacturing method for the same

Semiconductor device and manufacturing method thereof

Relay board provided in semiconductor device, semiconductor device,...

Relay board and semiconductor device having the relay board

Semiconductor device

Semiconductor device, three-dimensional semiconductor device, and m...

Stacked-type semiconductor device

Semiconductor device and manufacturing methods thereof

Stacked semiconductor device

Stacked semiconductor device and method of producing the same