Takao Ohno

Person

Yokohama, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device suitable for a stacked structure
- Patent number 8,216,934
- Issue date Jul 10, 2012
- Fujitsu Semiconductor Limited
- Eiji Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Imaging device
- Patent number 8,194,162
- Issue date Jun 5, 2012
- Fujitsu Semiconductor Limited
- Susumu Moriya
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Solid-state imaging device and method of fabricating solid-state im...
- Patent number 7,998,779
- Issue date Aug 16, 2011
- Fujitsu Semiconductor Limited
- Naoyuki Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device suitable for a stacked structure
- Patent number 7,884,459
- Issue date Feb 8, 2011
- Fujitsu Semiconductor Limited
- Eiji Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and stacked semiconductor device that can incr...
- Patent number 7,196,418
- Issue date Mar 27, 2007
- Fujitsu Limited
- Takao Ohno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder jointing system, solder jointing method, semiconductor devic...
- Patent number 6,732,911
- Issue date May 11, 2004
- Fujitsu Limited
- Hirohisa Matsuki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing semiconductor device using heated conveyanc...
- Patent number 6,673,654
- Issue date Jan 6, 2004
- Fujitsu Limited
- Takao Ohno
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE SUITABLE FOR A STACKED STRUCTURE
- Publication number 20110092065
- Publication date Apr 21, 2011
- FUJITSU SEMICONDUCTOR LIMITED
- Eiji YOSHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGING DEVICE
- Publication number 20100231766
- Publication date Sep 16, 2010
- FUJITSU MICROELECTRONICS LIMITED
- Susumu Moriya
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SOLID-STATE IMAGING DEVICE AND METHOD OF FABRICATING SOLID-STATE IM...
- Publication number 20090230493
- Publication date Sep 17, 2009
- Fujitsu Microelectronics Limited
- Naoyuki WATANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE SUITABLE FOR A STACKED STRUCTURE
- Publication number 20090008798
- Publication date Jan 8, 2009
- Fujitsu Limited
- Eiji Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device, three-dimensional semiconductor device, and m...
- Publication number 20050167812
- Publication date Aug 4, 2005
- FUJITSU LIMITED
- Eiji Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and stacked semiconductor device that can incr...
- Publication number 20050161793
- Publication date Jul 28, 2005
- Takao Ohno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing semiconductor device using heated conveyanc...
- Publication number 20030077879
- Publication date Apr 24, 2003
- FUJITSU LIMITED
- Takao Ohno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing semiconductor device from semiconductor waf...
- Publication number 20030073264
- Publication date Apr 17, 2003
- FUJITSU LIMITED
- Koichi Meguro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solder jointing system, solder jointing method, semiconductor devic...
- Publication number 20020130164
- Publication date Sep 19, 2002
- FUJITSU LIMITED
- Hirohisa Matsuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Person

Patents Grantslast 30 patents

Semiconductor device suitable for a stacked structure

Imaging device

Solid-state imaging device and method of fabricating solid-state im...

Semiconductor device suitable for a stacked structure

Semiconductor device and stacked semiconductor device that can incr...

Solder jointing system, solder jointing method, semiconductor devic...

Method of manufacturing semiconductor device using heated conveyanc...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE SUITABLE FOR A STACKED STRUCTURE

IMAGING DEVICE

SOLID-STATE IMAGING DEVICE AND METHOD OF FABRICATING SOLID-STATE IM...

SEMICONDUCTOR DEVICE SUITABLE FOR A STACKED STRUCTURE

Semiconductor device, three-dimensional semiconductor device, and m...

Semiconductor device and stacked semiconductor device that can incr...

Method of manufacturing semiconductor device using heated conveyanc...

Method of manufacturing semiconductor device from semiconductor waf...

Solder jointing system, solder jointing method, semiconductor devic...