TREA

Takao Yoneyama

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  • Sunomata, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Packaging method
    • Patent number 7,470,996
    • Issue date Dec 30, 2008
    • Denso Corporation
    • Takao Yoneyama
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Sensor device
    • Patent number 7,327,004
    • Issue date Feb 5, 2008
    • Denso Corporation
    • Koji Hattori
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Grant

    Sputter-deposited nickel layer
    • Patent number 5,876,861
    • Issue date Mar 2, 1999
    • Nippondenso Company, Ltd.
    • Ichiharu Kondo
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Grant

    Surface treated structure for solder joint
    • Patent number 5,635,764
    • Issue date Jun 3, 1997
    • Nippondenso Co., Ltd.
    • Hisayoshi Fujikawa
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Method of forming electrodes of semiconductor device
    • Patent number 5,360,765
    • Issue date Nov 1, 1994
    • Nippondenso Co., Ltd.
    • Ichiharu Kondo
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    Packaging method
    • Publication number 20070023483
    • Publication date Feb 1, 2007
    • DENSO CORPORATION
    • Takao Yoneyama
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Sensor device
    • Publication number 20060097331
    • Publication date May 11, 2006
    • DENSO CORPORATION
    • Koji Hattori
    • B81 - MICRO-STRUCTURAL TECHNOLOGY