Takaomi Kishimoto

Person

Gunma, JP

People

Patents Grantslast 30 patents

Information Patent Grant
High strength/highly conductive copper alloy plate material and man...
- Patent number 11,753,708
- Issue date Sep 12, 2023
- Tanaka Kikinzoku Kogyo K.K.
- Yusuke Saito
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Silver brazing material and joining method using the silver brazing...
- Patent number 11,638,973
- Issue date May 2, 2023
- Tanaka Kikinzoku Kogyo K.K.
- Takaomi Kishimoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High strength/highly conductive copper alloy plate material and man...
- Patent number 11,505,857
- Issue date Nov 22, 2022
- Tanaka Kikinzoku Kogyo K.K.
- Yusuke Saito
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Ceramic circuit substrate and method for producing ceramic circuit...
- Patent number 10,485,112
- Issue date Nov 19, 2019
- Tanaka Kikinzoku Kogyo K.K.
- Takaomi Kishimoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Contact material suitable for slider for fuel sender, and slider fo...
- Patent number 9,851,237
- Issue date Dec 26, 2017
- Tanaka Kikinzoku Kogyo K.K.
- Takaomi Kishimoto
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Active metal brazing material
- Patent number 9,375,811
- Issue date Jun 28, 2016
- Tanaka Kikinzoku Kogyo K.K.
- Takaomi Kishimoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
BONDING STRUCTURE AND SEMICONDUCTOR DEVICE HAVING THE BONDING STRUC...
- Publication number 20230395551
- Publication date Dec 7, 2023
- Tanaka Kikinzoku Kogyo K.K.
- Takaomi KISHIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH STRENGTH/HIGHLY CONDUCTIVE COPPER ALLOY PLATE MATERIAL AND MAN...
- Publication number 20230110533
- Publication date Apr 13, 2023
- Tanaka Kikinzoku Kogyo K.K.
- Yusuke SAITO
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
HIGH STRENGTH/HIGHLY CONDUCTIVE COPPER ALLOY PLATE MATERIAL AND MAN...
- Publication number 20210285080
- Publication date Sep 16, 2021
- TANAKA KIKINZOKU KOGYO K.K.
- Yusuke SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILVER BRAZING MATERIAL AND JOINING METHOD USING THE SILVER BRAZING...
- Publication number 20210146486
- Publication date May 20, 2021
- Tanaka Kikinzoku Kogyo K.K.
- Takaomi KISHIMOTO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CERAMIC CIRCUIT SUBSTRATE AND METHOD FOR PRODUCING CERAMIC CIRCUIT...
- Publication number 20190150298
- Publication date May 16, 2019
- TANAKA KIKINZOKU KOGYO K.K.
- Takaomi KISHIMOTO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONTACT MATERIAL SUITABLE FOR FUEL SENDER SLIDER, AND FUEL SENDER S...
- Publication number 20150027223
- Publication date Jan 29, 2015
- Tanaka Kikinzoku Kogyo K.K.
- Takaomi Kishimoto
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
ACTIVE METAL BRAZING MATERIAL
- Publication number 20140037492
- Publication date Feb 6, 2014
- Tanaka Kikinzoku Kogyo K.K.
- Takaomi Kishimoto
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...

Takaomi Kishimoto

Person

Patents Grantslast 30 patents

High strength/highly conductive copper alloy plate material and man...

Silver brazing material and joining method using the silver brazing...

High strength/highly conductive copper alloy plate material and man...

Ceramic circuit substrate and method for producing ceramic circuit...

Contact material suitable for slider for fuel sender, and slider fo...

Active metal brazing material

Patents Applicationslast 30 patents

BONDING STRUCTURE AND SEMICONDUCTOR DEVICE HAVING THE BONDING STRUC...

HIGH STRENGTH/HIGHLY CONDUCTIVE COPPER ALLOY PLATE MATERIAL AND MAN...

HIGH STRENGTH/HIGHLY CONDUCTIVE COPPER ALLOY PLATE MATERIAL AND MAN...

SILVER BRAZING MATERIAL AND JOINING METHOD USING THE SILVER BRAZING...

CERAMIC CIRCUIT SUBSTRATE AND METHOD FOR PRODUCING CERAMIC CIRCUIT...

CONTACT MATERIAL SUITABLE FOR FUEL SENDER SLIDER, AND FUEL SENDER S...

ACTIVE METAL BRAZING MATERIAL