Takashi Aoki

Person

Urayasu, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor module and electronic apparatus
- Patent number 11,818,844
- Issue date Nov 14, 2023
- Canon Kabushiki Kaisha
- Yuya Karakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component mounting structure and printed wiring board
- Patent number 9,648,739
- Issue date May 9, 2017
- Canon Kabushiki Kaisha
- Takashi Aoki
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Stacked semiconductor device
- Patent number 9,299,666
- Issue date Mar 29, 2016
- Canon Kabushiki Kaisha
- Takashi Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and stacked semiconductor package
- Patent number 8,803,329
- Issue date Aug 12, 2014
- Canon Kabushiki Kaisha
- Takashi Aoki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser circuit substrate
- Patent number 7,720,119
- Issue date May 18, 2010
- Canon Kabushiki Kaisha
- Takashi Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser driving circuit
- Patent number 7,697,582
- Issue date Apr 13, 2010
- Canon Kabushiki Kaisha
- Takashi Aoki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser circuit substrate
- Patent number 7,436,869
- Issue date Oct 14, 2008
- Canon Kabushiki Kaisha
- Takashi Aoki
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR MODULE AND ELECTRONIC APPARATUS
- Publication number 20220386468
- Publication date Dec 1, 2022
- Canon Kabushiki Kaisha
- Yuya Karakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING COMPONENT, MODULE, APPARATUS, AND METHOD FOR MANUFACTURING M...
- Publication number 20220319737
- Publication date Oct 6, 2022
- Canon Kabushiki Kaisha
- Mitsutoshi Hasegawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE MANUFACTURING METHOD, ELECTRONIC EQUIPMENT MAN...
- Publication number 20220102330
- Publication date Mar 31, 2022
- Canon Kabushiki Kaisha
- Kana Onoko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, PRINTED CIRCUIT BOARD, ELECTRONIC DEVICE, AND...
- Publication number 20200051887
- Publication date Feb 13, 2020
- Canon Kabushiki Kaisha
- Takashi Aoki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT MOUNTING STRUCTURE AND PRINTED WIRING BOARD
- Publication number 20150173195
- Publication date Jun 18, 2015
- Canon Kabushiki Kaisha
- Takashi Aoki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE AND STACKED SEMICONDUCTOR PACKAGE
- Publication number 20130320568
- Publication date Dec 5, 2013
- Canon Kabushiki Kaisha
- Takashi Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DEVICE
- Publication number 20130320569
- Publication date Dec 5, 2013
- Canon Kabushiki Kaisha
- Takashi Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER DRIVING CIRCUIT
- Publication number 20090052485
- Publication date Feb 26, 2009
- Canon Kabushiki Kaisha
- Takashi Aoki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER CIRCUIT SUBSTRATE
- Publication number 20090010289
- Publication date Jan 8, 2009
- Takashi Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Laser circuit substrate
- Publication number 20060132057
- Publication date Jun 22, 2006
- Takashi Aoki
- H01 - BASIC ELECTRIC ELEMENTS

Takashi Aoki

Person

Patents Grantslast 30 patents

Semiconductor module and electronic apparatus

Electronic component mounting structure and printed wiring board

Stacked semiconductor device

Semiconductor package and stacked semiconductor package

Laser circuit substrate

Laser driving circuit

Laser circuit substrate

Patents Applicationslast 30 patents

SEMICONDUCTOR MODULE AND ELECTRONIC APPARATUS

WIRING COMPONENT, MODULE, APPARATUS, AND METHOD FOR MANUFACTURING M...

SEMICONDUCTOR MODULE MANUFACTURING METHOD, ELECTRONIC EQUIPMENT MAN...

SEMICONDUCTOR DEVICE, PRINTED CIRCUIT BOARD, ELECTRONIC DEVICE, AND...

ELECTRONIC COMPONENT MOUNTING STRUCTURE AND PRINTED WIRING BOARD

SEMICONDUCTOR PACKAGE AND STACKED SEMICONDUCTOR PACKAGE

STACKED SEMICONDUCTOR DEVICE

LASER DRIVING CIRCUIT

LASER CIRCUIT SUBSTRATE

Laser circuit substrate