Takashi ARAI

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Nagano-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Wiring substrate and semiconductor device
- Patent number 11,404,362
- Issue date Aug 2, 2022
- Shinko Electric Industries Co., Ltd.
- Takashi Arai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate and semiconductor device
- Patent number 10,892,217
- Issue date Jan 12, 2021
- SHINKO ELECTRIC INDUSTRIES CO., LTD.
- Takashi Arai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTERCONNECT SUBSTRATE AND METHOD OF MAKING THE SAME
- Publication number 20250201718
- Publication date Jun 19, 2025
- Shinko Electric Industries Co., Ltd.
- Takashi ARAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE
- Publication number 20200043841
- Publication date Feb 6, 2020
- Shinko Electric Industries Co., Ltd.
- Takashi ARAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE
- Publication number 20190371715
- Publication date Dec 5, 2019
- Shinko Electric Industries Co., Ltd.
- Takashi ARAI
- H01 - BASIC ELECTRIC ELEMENTS