Takashi Fujii

Person

Kudamatsu-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Plasma processing apparatus
- Patent number 8,926,790
- Issue date Jan 6, 2015
- Hitachi High-Technologies Corporation
- Tsutomu Tetsuka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma processing apparatus
- Patent number 8,747,608
- Issue date Jun 10, 2014
- Hitachi High-Technologies Corporation
- Tatehito Usui
- G01 - MEASURING TESTING
Information Patent Grant
Plasma processing apparatus
- Patent number 8,088,247
- Issue date Jan 3, 2012
- Hitachi High-Technologies Corporation
- Tatehito Usui
- G01 - MEASURING TESTING
Information Patent Grant
Film thickness measuring method of member to be processed using emi...
- Patent number 7,411,684
- Issue date Aug 12, 2008
- Hitachi, Ltd.
- Tatehito Usui
- G01 - MEASURING TESTING
Information Patent Grant
Plasma processing method
- Patent number 7,303,998
- Issue date Dec 4, 2007
- Hitachi High-Technologies Corporation
- Tooru Aramaki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Film thickness measuring method of member to be processed using emi...
- Patent number 7,230,720
- Issue date Jun 12, 2007
- Hitachi, Ltd.
- Tatehito Usui
- G01 - MEASURING TESTING
Information Patent Grant
Method and apparatus for determining endpoint of semiconductor elem...
- Patent number 7,126,697
- Issue date Oct 24, 2006
- Hitachi, Ltd.
- Tatehito Usui
- G01 - MEASURING TESTING
Information Patent Grant
Method and apparatus for determining endpoint of semiconductor elem...
- Patent number 7,009,715
- Issue date Mar 7, 2006
- Hitachi, Ltd.
- Tatehito Usui
- G01 - MEASURING TESTING
Information Patent Grant
Film thickness measuring method of member to be processed using emi...
- Patent number 6,961,131
- Issue date Nov 1, 2005
- OpNext Japan, Inc.
- Tatehito Usui
- G01 - MEASURING TESTING
Information Patent Grant
Method and apparatus for determining endpoint of semiconductor elem...
- Patent number 6,903,826
- Issue date Jun 7, 2005
- Hitachi, Ltd.
- Tatehito Usui
- G01 - MEASURING TESTING
Information Patent Grant
Film thickness measuring method of member to be processed using emi...
- Patent number 6,815,228
- Issue date Nov 9, 2004
- Hitachi, Ltd.
- Tatehito Usui
- G01 - MEASURING TESTING
Information Patent Grant
Process for producing a semiconductor device including etching usin...
- Patent number 6,743,733
- Issue date Jun 1, 2004
- Hitachi, Ltd.
- Hiroyuki Kitsunai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vacuum treatment system and its stage
- Patent number 6,235,146
- Issue date May 22, 2001
- Hitachi, Ltd.
- Masanori Kadotani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma processing apparatus having insulator disposed on inner surf...
- Patent number 6,046,425
- Issue date Apr 4, 2000
- Hitachi, Ltd.
- Tetsunori Kaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma process apparatus including ground electrode with protection...
- Patent number 5,432,315
- Issue date Jul 11, 1995
- Hitachi, Ltd.
- Tetsunori Kaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microwave plasma processing device
- Patent number 5,290,993
- Issue date Mar 1, 1994
- Hitachi, Ltd.
- Tetsunori Kaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for etching
- Patent number 5,110,408
- Issue date May 5, 1992
- Hitachi, Ltd.
- Takashi Fujii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of and apparatus for detecting an end point of plasma treatment
- Patent number 4,615,761
- Issue date Oct 7, 1986
- Hitachi, Ltd.
- Keiji Tada
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
Plasma Processing Apparatus
- Publication number 20120101621
- Publication date Apr 26, 2012
- Tatehito Usui
- G01 - MEASURING TESTING
Information Patent Application
PLASMA PROCESSING APPARATUS
- Publication number 20080216956
- Publication date Sep 11, 2008
- SHIGERU NAKAMOTO
- G01 - MEASURING TESTING
Information Patent Application
PLASMA PROCESSING APPARATUS
- Publication number 20080121344
- Publication date May 29, 2008
- Tooru Aramaki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
FILM THICKNESS MEASURING METHOD OF MEMBER TO BE PROCESSED USING EMI...
- Publication number 20070229845
- Publication date Oct 4, 2007
- Tatehito Usui
- G01 - MEASURING TESTING
Information Patent Application
Plasma processing apparatus
- Publication number 20070202613
- Publication date Aug 30, 2007
- Tatehito Usui
- G01 - MEASURING TESTING
Information Patent Application
Plasma processing apparatus
- Publication number 20070044716
- Publication date Mar 1, 2007
- Tsutomu Tetsuka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Vacuum processing apparatus
- Publication number 20070044914
- Publication date Mar 1, 2007
- Katsuji Matano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for determining endpoint of semiconductor elem...
- Publication number 20060132798
- Publication date Jun 22, 2006
- Tatehito Usui
- G01 - MEASURING TESTING
Information Patent Application
Film thickness measuring method of member to be processed using emi...
- Publication number 20060039008
- Publication date Feb 23, 2006
- Tatehito Usui
- G01 - MEASURING TESTING
Information Patent Application
Plasma processing method
- Publication number 20050242060
- Publication date Nov 3, 2005
- Tooru Aramaki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method and apparatus for determining endpoint of semiconductor elem...
- Publication number 20050062982
- Publication date Mar 24, 2005
- Tatehito Usui
- G01 - MEASURING TESTING
Information Patent Application
Plasma processing apparatus
- Publication number 20050051098
- Publication date Mar 10, 2005
- Tooru Aramaki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Film thickness measuring method of member to be processed using emi...
- Publication number 20050018207
- Publication date Jan 27, 2005
- Tatehito Usui
- G01 - MEASURING TESTING
Information Patent Application
Process for producing semiconductor device
- Publication number 20040194887
- Publication date Oct 7, 2004
- Hiroyuki Kitsunai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for determining endpoint of semiconductor elem...
- Publication number 20030043383
- Publication date Mar 6, 2003
- Tatehito Usui
- G01 - MEASURING TESTING
Information Patent Application
Process for producing semiconductor device
- Publication number 20030040191
- Publication date Feb 27, 2003
- Hiroyuki Kitsunai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Film thickness measuring method of member to be processed using emi...
- Publication number 20020009814
- Publication date Jan 24, 2002
- Tatehito Usui
- G01 - MEASURING TESTING

Takashi Fujii

Person

Patents Grantslast 30 patents

Plasma processing apparatus

Plasma processing apparatus

Plasma processing apparatus

Film thickness measuring method of member to be processed using emi...

Plasma processing method

Film thickness measuring method of member to be processed using emi...

Method and apparatus for determining endpoint of semiconductor elem...

Method and apparatus for determining endpoint of semiconductor elem...

Film thickness measuring method of member to be processed using emi...

Method and apparatus for determining endpoint of semiconductor elem...

Film thickness measuring method of member to be processed using emi...

Process for producing a semiconductor device including etching usin...

Vacuum treatment system and its stage

Plasma processing apparatus having insulator disposed on inner surf...

Plasma process apparatus including ground electrode with protection...

Microwave plasma processing device

Process for etching

Method of and apparatus for detecting an end point of plasma treatment

Patents Applicationslast 30 patents

Plasma Processing Apparatus

PLASMA PROCESSING APPARATUS

PLASMA PROCESSING APPARATUS

FILM THICKNESS MEASURING METHOD OF MEMBER TO BE PROCESSED USING EMI...

Plasma processing apparatus

Plasma processing apparatus

Vacuum processing apparatus

Method and apparatus for determining endpoint of semiconductor elem...

Film thickness measuring method of member to be processed using emi...

Plasma processing method

Method and apparatus for determining endpoint of semiconductor elem...

Plasma processing apparatus

Film thickness measuring method of member to be processed using emi...

Process for producing semiconductor device

Method and apparatus for determining endpoint of semiconductor elem...

Process for producing semiconductor device

Film thickness measuring method of member to be processed using emi...