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Takashi Hinotsu

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  • Okayama, JP
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    FINE SILVER PARTICLE DISPERSION
    • Publication number 20200321139
    • Publication date Oct 8, 2020
    • DOWA ELECTRONICS MATERIALS CO., LTD.
    • Shingo TERAGAWA
    • B22 - CASTING POWDER METALLURGY
  • Information Patent Application

    Fine Silver Particle Dispersion
    • Publication number 20200317935
    • Publication date Oct 8, 2020
    • E I DU PONT DE NEMOURS AND COMPANY
    • Dave Hui
    • C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
  • Information Patent Application

    FINE SILVER PARTICLE DISPERSION
    • Publication number 20190100641
    • Publication date Apr 4, 2019
    • DOWA ELECTRONICS MATERIALS CO., LTD.
    • Shingo TERAGAWA
    • C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
  • Information Patent Application

    FINE SILVER PARTICLE DISPERSION
    • Publication number 20190103200
    • Publication date Apr 4, 2019
    • E I DU PONT DE NEMOURS AND COMPANY
    • Dave Hui
    • B22 - CASTING POWDER METALLURGY
  • Information Patent Application

    FINE SILVER PARTICLE DISPERSING SOLUTION
    • Publication number 20180179409
    • Publication date Jun 28, 2018
    • DOWA ELECTRONICS MATERIALS CO., LTD.
    • Shingo Teragawa
    • B22 - CASTING POWDER METALLURGY
  • Information Patent Application

    BONDING MATERIAL AND BONDING METHOD USING SAME
    • Publication number 20170120395
    • Publication date May 4, 2017
    • DOWA ELECTRONICS MATERIALS CO., LTD.
    • Satoru Kurita
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    FINE SILVER PARTICLE DISPERSING SOLUTION
    • Publication number 20160297982
    • Publication date Oct 13, 2016
    • DOWA ELECTRONICS MATERIALS CO., LTD.
    • Takashi Hinotsu
    • C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
  • Information Patent Application

    METAL NANOPARTICLE DISPERSION, METHOD FOR PRODUCING METAL NANOPARTI...
    • Publication number 20160101486
    • Publication date Apr 14, 2016
    • DOWA ELECTRONICS MATERIALS CO., LTD.
    • Keiichi ENDOH
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    METHOD FOR PRODUCING FINE SILVER PARTICLES
    • Publication number 20150266097
    • Publication date Sep 24, 2015
    • DOWA ELECTRONICS MATERIALS CO., LTD.
    • Tomonori Shibayama
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Application

    BONDING MATERIAL AND BONDED OBJECT PRODUCED USING SAME
    • Publication number 20140113109
    • Publication date Apr 24, 2014
    • DOWA ELECTRONICS MATERIALS CO., LTD.
    • Satoru Kurita
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Application

    LOW-TEMPERATURE SINTERING CONDUCTIVE PASTE, CONDUCTIVE FILM USING T...
    • Publication number 20130153835
    • Publication date Jun 20, 2013
    • DOWA ELECTRONICS MATERIALS CO., LTD.
    • Takashi Hinotsu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Transparent conducting film and manufacturing method thereof
    • Publication number 20080081178
    • Publication date Apr 3, 2008
    • DOWA ELECTRONICS MATERIALS CO., LTD.
    • Takashi Hinotsu
    • C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
  • Information Patent Application

    ITO powder and method for manufacturing same, coating material for...
    • Publication number 20080047466
    • Publication date Feb 28, 2008
    • DOWA ELECTRONICS MATERIALS CO., LTD.
    • Koji Tanoue
    • C01 - INORGANIC CHEMISTRY