Takashi HIRAOKA

Person

  • Hyogo, JP

Patents Grantslast 30 patents

  • Information Patent Grant

    Resin composition for encapsulation

    • Patent number 11,760,870
    • Issue date Sep 19, 2023
    • Nagase Chemtex Corporation
    • Yosuke Oi
    • C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
  • Information Patent Grant

    Curable resin composition and curable sheet

    • Patent number 11,718,770
    • Issue date Aug 8, 2023
    • Nagase Chemtex Corporation
    • Takayuki Hashimoto
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    CURABLE RESIN COMPOSITION AND CURABLE SHEET

    • Publication number 20210403765
    • Publication date Dec 30, 2021
    • Nagase Chemtex Corporation
    • Takayuki HASHIMOTO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    RESIN COMPOSITION FOR SEALING

    • Publication number 20210054187
    • Publication date Feb 25, 2021
    • NAGASE CHEMTEX CORPORATION
    • Yosuke OI
    • C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...