TREA

Takashi Hori

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  • Tokyo, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Solder for use on surfaces coated with nickel by electroless plating
    • Patent number 7,132,020
    • Issue date Nov 7, 2006
    • Senju Metal Industry Co., Ltd.
    • Iwao Nozawa
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Lead-free solder alloys
    • Patent number 6,488,888
    • Issue date Dec 3, 2002
    • Matsushita Electric Industrial Co., Ltd.
    • Toshikazu Murata
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Solder ball container
    • Patent number 6,352,153
    • Issue date Mar 5, 2002
    • Senju Metal Industry Co., Ltd.
    • Fumio Ohashi
    • B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
  • Information Patent Grant

    Lead-free solder alloys
    • Patent number 6,241,942
    • Issue date Jun 5, 2001
    • Matsushita Electric Industrial Co., Ltd.
    • Toshikazu Murata
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents