Takashi Hozumi

Person

Kawasaki-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device including stud bumps as external connection te...
- Patent number 6,541,848
- Issue date Apr 1, 2003
- Fujitsu Limited
- Toshimi Kawahara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer level semiconductor device and method of manufacturing the same
- Patent number 6,515,347
- Issue date Feb 4, 2003
- Fujitsu Limited
- Yasuhiro Shinma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing semiconductor devices having easy separability...
- Patent number 6,511,620
- Issue date Jan 28, 2003
- Fujitsu Limited
- Toshimi Kawahara
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Semiconductor device having increased reliability and method of pro...
- Patent number 6,507,092
- Issue date Jan 14, 2003
- Fujitsu Limited
- Norio Fukasawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of production of the semiconductor...
- Patent number 6,469,370
- Issue date Oct 22, 2002
- Fujitsu Limited
- Toshimi Kawahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and mounting structure
- Patent number 6,329,711
- Issue date Dec 11, 2001
- Fujitsu Limited
- Toshimi Kawahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive composition, semiconductor device using the composition an...
- Patent number 5,844,309
- Issue date Dec 1, 1998
- Fujitsu Limited
- Yukio Takigawa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor device, method of manufacturing semiconductor device...
- Publication number 20030132533
- Publication date Jul 17, 2003
- FUJITSU LIMITED
- Toshimi Kawahara
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Semiconductor device having an organic material layer and method fo...
- Publication number 20020127776
- Publication date Sep 12, 2002
- FUJITSU LIMITED
- Shinsuke Nakajo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING STUD BUMPS AS EXTERNAL CONNECTION TE...
- Publication number 20020105069
- Publication date Aug 8, 2002
- TOSHIMI KAWAHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE KEEPING STRUCTURAL INTEGRITY UNDER HEAT-GENERA...
- Publication number 20010045643
- Publication date Nov 29, 2001
- YOSHITSUGU KATOH
- H01 - BASIC ELECTRIC ELEMENTS

Takashi Hozumi

Person

Patents Grantslast 30 patents

Semiconductor device including stud bumps as external connection te...

Wafer level semiconductor device and method of manufacturing the same

Method of producing semiconductor devices having easy separability...

Semiconductor device having increased reliability and method of pro...

Semiconductor device and method of production of the semiconductor...

Semiconductor device and mounting structure

Adhesive composition, semiconductor device using the composition an...

Patents Applicationslast 30 patents

Semiconductor device, method of manufacturing semiconductor device...

Semiconductor device having an organic material layer and method fo...

SEMICONDUCTOR DEVICE INCLUDING STUD BUMPS AS EXTERNAL CONNECTION TE...

SEMICONDUCTOR DEVICE KEEPING STRUCTURAL INTEGRITY UNDER HEAT-GENERA...