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Takashi Ideno
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Tokyo, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Semiconductor module and method for manufacturing same
Patent number
11,749,581
Issue date
Sep 5, 2023
Fuji Electric Co., Ltd.
Yuhei Nishida
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Producing metal/ceramic circuit board by removing residual silver
Patent number
10,834,823
Issue date
Nov 10, 2020
Dowa Metaltech Co., Ltd.
Takashi Ideno
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
INSULATING SUBSTRATE AND MANUFACTURING METHOD THEREOF
Publication number
20230298961
Publication date
Sep 21, 2023
DOWA METALTECH CO., LTD.
Seiya YUKI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INSULATING SUBSTRATE AND MANUFACTURING METHOD THEREOF
Publication number
20230268245
Publication date
Aug 24, 2023
DOWA METALTECH CO., LTD.
Seiya YUKI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING SAME
Publication number
20200388553
Publication date
Dec 10, 2020
FUJI ELECTRIC CO., LTD.
Yuhei NISHIDA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR PRODUCING METAL/CERAMIC CIRCUIT BOARD
Publication number
20180255645
Publication date
Sep 6, 2018
DOWA METALTECH CO., LTD.
Takashi Ideno
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR