Takashi Imoto

Person

Yokkaichi-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of inspecting the same
- Patent number 11,715,701
- Issue date Aug 1, 2023
- Kioxia Corporation
- Yuusuke Takano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device and semiconductor device
- Patent number 10,312,197
- Issue date Jun 4, 2019
- TOSHIBA MEMORY CORPORATION
- Yuusuke Takano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor manufacturing device and semiconductor manufacturing...
- Patent number 9,824,905
- Issue date Nov 21, 2017
- TOSHIBA MEMORY CORPORATION
- Katsunori Shibuya
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor manufacturing device and semiconductor manufacturing...
- Patent number 9,458,535
- Issue date Oct 4, 2016
- Kabushiki Kaisha Toshiba
- Katsunori Shibuya
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 9,385,090
- Issue date Jul 5, 2016
- Kabushiki Kaisha Toshiba
- Katsunori Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of a conductive shield layer in semiconductor...
- Patent number 9,209,053
- Issue date Dec 8, 2015
- Kabushiki Kaisha Toshiba
- Yoshiaki Goto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 8,896,111
- Issue date Nov 25, 2014
- Kabushiki Kaisha Toshiba
- Akira Tanimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, method for manufacturing semiconductor device...
- Patent number 8,237,295
- Issue date Aug 7, 2012
- Kabushiki Kaisha Toshiba
- Yuichi Sano
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor device and manufacturing method therefor
- Patent number 7,932,605
- Issue date Apr 26, 2011
- Kabushiki Kaisha Toshiba
- Takashi Imoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package having a semiconductor element with a...
- Patent number 7,608,911
- Issue date Oct 27, 2009
- Kabushiki Kaisha Toshiba
- Takashi Imoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a semiconductor device package having a semic...
- Patent number 7,405,159
- Issue date Jul 29, 2008
- Kabushiki Kaisha Toshiba
- Takashi Imoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method therefor
- Patent number 7,352,052
- Issue date Apr 1, 2008
- Kabushiki Kaisha Toshiba
- Takashi Imoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of assembling a semiconductor device
- Patent number 7,298,035
- Issue date Nov 20, 2007
- Kabushiki Kaisha Toshiba
- Ryuji Hosokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical semiconductor module and its manufacturing method
- Patent number 7,255,493
- Issue date Aug 14, 2007
- Kabushiki Kaisha Toshiba
- Hiroshi Hamasaki
- G02 - OPTICS
Information Patent Grant
Semiconductor device package having a semiconductor element with resin
- Patent number 7,202,563
- Issue date Apr 10, 2007
- Kabushiki Kaisha Toshiba
- Takashi Imoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical semiconductor module and its manufacturing method
- Patent number 7,118,294
- Issue date Oct 10, 2006
- Kabushiki Kaisha Toshiba
- Hiroshi Hamasaki
- G02 - OPTICS
Information Patent Grant
Laminated-chip semiconductor device
- Patent number 6,861,738
- Issue date Mar 1, 2005
- Kabushiki Kaisha Toshiba
- Katsuhiko Oyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor laminated module
- Patent number 6,734,541
- Issue date May 11, 2004
- Kabushiki Kaisha Toshiba
- Hiroshi Shimoe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 6,617,678
- Issue date Sep 9, 2003
- Kabushiki Kaisha Toshiba
- Takashi Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Superposed printed substrates and insulating substrates having semi...
- Patent number 6,469,374
- Issue date Oct 22, 2002
- Kabushiki Kaisha Toshiba
- Takashi Imoto
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF INSPECTING THE SAME
- Publication number 20190244912
- Publication date Aug 8, 2019
- Toshiba Memory Corporation
- Yuusuke TAKANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING DEVICE AND SEMICONDUCTOR MANUFACTURING...
- Publication number 20150167157
- Publication date Jun 18, 2015
- KABUSHIKI KAISHA TOSHIBA
- Katsunori SHIBUYA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR APPARATUS
- Publication number 20150170988
- Publication date Jun 18, 2015
- Kabushiki Kaisha Toshiba
- Takeshi WATANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20150171021
- Publication date Jun 18, 2015
- Kabushiki Kaisha Toshiba
- Yuusuke TAKANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING DEVICE AND SEMICONDUCTOR MANUFACTURING...
- Publication number 20150167156
- Publication date Jun 18, 2015
- KABUSHIKI KAISHA TOSHIBA
- Katsunori SHIBUYA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20150171056
- Publication date Jun 18, 2015
- KABUSHIKI KAISHA TOSHIBA
- Yoshiaki Goto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20150171020
- Publication date Jun 18, 2015
- Kabushiki Kaisha Toshiba
- Katsunori SHIBUYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20150171060
- Publication date Jun 18, 2015
- KABUSHIKI KAISHA TOSHIBA
- Yoshiaki Goto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF INSPECTING THE SAME
- Publication number 20150070046
- Publication date Mar 12, 2015
- Kabushiki Kaisha Toshiba
- Yuusuke TAKANO
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140070428
- Publication date Mar 13, 2014
- Kabushiki Kaisha Toshiba
- Akira TANIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20130062758
- Publication date Mar 14, 2013
- Kabushiki Kaisha Toshiba
- Takashi IMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF, AND SEMICOND...
- Publication number 20120286411
- Publication date Nov 15, 2012
- Kabushiki Kaisha Toshiba
- Takeshi Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE
- Publication number 20120153471
- Publication date Jun 21, 2012
- Kabushiki Kaisha Toshiba
- Takeshi WATANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE...
- Publication number 20110309502
- Publication date Dec 22, 2011
- Kabushiki Kaisha Toshiba
- Yuichi SANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS
- Publication number 20110304050
- Publication date Dec 15, 2011
- Kabushiki Kaisha Toshiba
- Takashi IMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20080265443
- Publication date Oct 30, 2008
- KABUSHIKI KAISHA TOSHIBA,
- Takashi Imoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method therefor
- Publication number 20080017973
- Publication date Jan 24, 2008
- Kabushiki Kaisha Toshiba
- Takashi Imoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20070196956
- Publication date Aug 23, 2007
- Kabushiki Kaisha Toshiba
- Takashi Imoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Surface mount type semiconductor device and method of manufacturing...
- Publication number 20060270118
- Publication date Nov 30, 2006
- Hiroyuki Okura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Optical semiconductor module and its manufacturing method
- Publication number 20060215969
- Publication date Sep 28, 2006
- Hiroshi Hamasaki
- G02 - OPTICS
Information Patent Application
Semiconductor device and a method of assembling a semiconductor device
- Publication number 20060055061
- Publication date Mar 16, 2006
- Ryuji Hosokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method therefor
- Publication number 20050253247
- Publication date Nov 17, 2005
- Takashi Imoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20050212145
- Publication date Sep 29, 2005
- Takashi Imoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Optical semiconductor module and its manufacturing method
- Publication number 20050063651
- Publication date Mar 24, 2005
- Hiroshi Hamasaki
- G02 - OPTICS
Information Patent Application
Semiconductor device
- Publication number 20020195698
- Publication date Dec 26, 2002
- Takashi Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor laminated module
- Publication number 20020190368
- Publication date Dec 19, 2002
- Kabushiki Kaishi Toshiba
- Hiroshi Shimoe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Laminated-chip semiconductor device
- Publication number 20020180030
- Publication date Dec 5, 2002
- KABUSHIKI KAISHA TOAHIBA
- Katsuhiko Oyama
- H01 - BASIC ELECTRIC ELEMENTS

Takashi Imoto

Person

Patents Grantslast 30 patents

Semiconductor device and method of inspecting the same

Method of manufacturing semiconductor device and semiconductor device

Semiconductor manufacturing device and semiconductor manufacturing...

Semiconductor manufacturing device and semiconductor manufacturing...

Semiconductor device and method of manufacturing semiconductor device

Manufacturing method of a conductive shield layer in semiconductor...

Semiconductor device and method for manufacturing the same

Semiconductor device, method for manufacturing semiconductor device...

Semiconductor device and manufacturing method therefor

Semiconductor device package having a semiconductor element with a...

Method of fabricating a semiconductor device package having a semic...

Semiconductor device and manufacturing method therefor

Semiconductor device and a method of assembling a semiconductor device

Optical semiconductor module and its manufacturing method

Semiconductor device package having a semiconductor element with resin

Optical semiconductor module and its manufacturing method

Laminated-chip semiconductor device

Semiconductor laminated module

Semiconductor device

Superposed printed substrates and insulating substrates having semi...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD OF INSPECTING THE SAME

SEMICONDUCTOR MANUFACTURING DEVICE AND SEMICONDUCTOR MANUFACTURING...

METHOD OF MANUFACTURING SEMICONDUCTOR APPARATUS

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR MANUFACTURING DEVICE AND SEMICONDUCTOR MANUFACTURING...

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF INSPECTING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF, AND SEMICOND...

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE...

SEMICONDUCTOR APPARATUS

Semiconductor device and method of manufacturing the same

Semiconductor device and manufacturing method therefor

Semiconductor device and method of manufacturing the same

Surface mount type semiconductor device and method of manufacturing...

Optical semiconductor module and its manufacturing method

Semiconductor device and a method of assembling a semiconductor device

Semiconductor device and manufacturing method therefor

Semiconductor device and method of manufacturing the same

Optical semiconductor module and its manufacturing method

Semiconductor device

Semiconductor laminated module

Laminated-chip semiconductor device