Takashi Kasuga

Person

Nagano-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Interconnect substrate having groove around pad
- Patent number 12,191,255
- Issue date Jan 7, 2025
- Shinko Electric Industries Co., Ltd.
- Hikaru Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate and method of manufacturing wiring substrate
- Patent number 11,997,787
- Issue date May 28, 2024
- Shinko Electric Industries Co., Ltd.
- Hikaru Tanaka
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WIRING SUBSTRATE AND METHOD OF MANUFACTURING WIRING SUBSTRATE
- Publication number 20240284593
- Publication date Aug 22, 2024
- Shinko Electric Industries Co., Ltd.
- Hikaru Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT SUBSTRATE AND METHOD OF MAKING THE SAME
- Publication number 20230120515
- Publication date Apr 20, 2023
- Shinko Electric Industries Co., Ltd.
- Hikaru TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD
- Publication number 20230123522
- Publication date Apr 20, 2023
- Shinko Electric Industries Co., Ltd.
- Hikaru TANAKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND MANUFACTURING METHOD OF WIRING BOARD
- Publication number 20230089948
- Publication date Mar 23, 2023
- Shinko Electric Industries Co., Ltd.
- Takashi Kasuga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BUILT-IN COMPONENT BOARD, METHOD OF MANUFACTURING THE BUILT-IN COMP...
- Publication number 20220278045
- Publication date Sep 1, 2022
- SHINKO ELECTRIC INDUSTRIES CO., LTD.
- Takashi Kasuga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND METHOD OF MANUFACTURING WIRING SUBSTRATE
- Publication number 20220225503
- Publication date Jul 14, 2022
- Shinko Electric Industries Co., Ltd.
- Hikaru Tanaka
- H01 - BASIC ELECTRIC ELEMENTS

Takashi Kasuga

Person

Patents Grantslast 30 patents

Interconnect substrate having groove around pad

Wiring substrate and method of manufacturing wiring substrate

Patents Applicationslast 30 patents

WIRING SUBSTRATE AND METHOD OF MANUFACTURING WIRING SUBSTRATE

INTERCONNECT SUBSTRATE AND METHOD OF MAKING THE SAME

WIRING BOARD

WIRING BOARD AND MANUFACTURING METHOD OF WIRING BOARD

BUILT-IN COMPONENT BOARD, METHOD OF MANUFACTURING THE BUILT-IN COMP...

WIRING SUBSTRATE AND METHOD OF MANUFACTURING WIRING SUBSTRATE