Takashi KASUGA

Person

Osaka, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Base material for printed circuit board and printed circuit board
- Patent number 11,013,113
- Issue date May 18, 2021
- Sumitomo Electric Industries, Ltd.
- Motohiko Sugiura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin film, substrate for printed wiring board, and printed wiring...
- Patent number 10,889,086
- Issue date Jan 12, 2021
- Sumitomo Electric Industries, Ltd.
- Kayo Hashizume
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Base material for printed circuit board and printed circuit board
- Patent number 10,842,027
- Issue date Nov 17, 2020
- Sumitomo Electric Industries, Ltd.
- Kazuhiro Miyata
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Substrate for printed circuit board and printed circuit board
- Patent number 10,596,782
- Issue date Mar 24, 2020
- Sumitomo Electric Industries, Ltd.
- Kayo Hashizume
- B32 - LAYERED PRODUCTS
Information Patent Grant
Printed circuit board and electronic component
- Patent number 10,537,020
- Issue date Jan 14, 2020
- Sumitomo Electric Industries, Ltd.
- Kohei Okamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and electronic component
- Patent number 10,537,017
- Issue date Jan 14, 2020
- Sumitomo Electric Industries, Ltd.
- Kohei Okamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal powder, ink, sintered body, substrate for printed circuit boa...
- Patent number 10,307,825
- Issue date Jun 4, 2019
- Sumitomo Electric Industries, Ltd.
- Issei Okada
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Substrate for printed circuit board, printed circuit board, and met...
- Patent number 10,292,265
- Issue date May 14, 2019
- Sumitomo Electric Industries, Ltd.
- Takashi Kasuga
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Substrate for printed wiring board and method for producing the sam...
- Patent number 10,244,627
- Issue date Mar 26, 2019
- Sumitomo Electric Industries, Ltd.
- Kayo Hashizume
- B32 - LAYERED PRODUCTS
Information Patent Grant
Substrate for printed circuit board, printed circuit board, and met...
- Patent number 10,237,976
- Issue date Mar 19, 2019
- Sumitomo Electric Industries, Ltd.
- Takashi Kasuga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate for printed circuit board, printed circuit board, and met...
- Patent number 10,225,931
- Issue date Mar 5, 2019
- Sumitomo Electric Industries, Ltd.
- Kayo Hashizume
- B32 - LAYERED PRODUCTS
Information Patent Grant
Substrate for printed circuit board and method for producing substr...
- Patent number 10,143,083
- Issue date Nov 27, 2018
- Sumitomo Electric Industries, Ltd.
- Motohiko Sugiura
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Substrate for printed circuit board, printed circuit board, and met...
- Patent number 10,076,028
- Issue date Sep 11, 2018
- Sumitomo Electric Industries, Ltd.
- Takashi Kasuga
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate for printed circuit board, printed circuit board, and met...
- Patent number 10,076,032
- Issue date Sep 11, 2018
- Sumitomo Electric Industries, Ltd.
- Takashi Kasuga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate for printed circuit board, printed circuit board, and met...
- Patent number 9,967,976
- Issue date May 8, 2018
- Sumitomo Electric Industries, Ltd.
- Kazuhiro Miyata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Seal structure, method of forming seal structure, wire body, and el...
- Patent number 8,581,118
- Issue date Nov 12, 2013
- Sumitomo Electric Industries, Ltd.
- Takashi Kasuga
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Flexible printed wiring board
- Patent number 8,309,853
- Issue date Nov 13, 2012
- Sumitomo Electric Industries, Ltd.
- Yoshio Oka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of producing metal powder
- Patent number 7,510,592
- Issue date Mar 31, 2009
- Sumitomo Electric Industries, Ltd.
- Masatoshi Majima
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Conductive silver paste and conductive film formed using the same
- Patent number 7,198,736
- Issue date Apr 3, 2007
- Sumitomo Electric Industries, Ltd.
- Takashi Kasuga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
BASE MATERIAL FOR PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD
- Publication number 20210127487
- Publication date Apr 29, 2021
- Sumitomo Electric Industries, Ltd.
- Kenichiro AIKAWA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
BASE MATERIAL FOR PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD
- Publication number 20210022245
- Publication date Jan 21, 2021
- Sumitomo Electric Industries, Ltd.
- Motohiko SUGIURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN FILM, SUBSTRATE FOR PRINTED WIRING BOARD, AND PRINTED WIRING...
- Publication number 20200376810
- Publication date Dec 3, 2020
- Sumitomo Electric Industries, Ltd.
- Kayo HASHIZUME
- B32 - LAYERED PRODUCTS
Information Patent Application
BASE MATERIAL FOR PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD
- Publication number 20200288578
- Publication date Sep 10, 2020
- Sumitomo Electric Industries, Ltd.
- Kazuhiro MIYATA
- B22 - CASTING POWDER METALLURGY
Information Patent Application
PRINTED CIRCUIT BOARD AND ELECTRONIC COMPONENT
- Publication number 20190008035
- Publication date Jan 3, 2019
- Sumitomo Electric Industries, Ltd.
- Kohei OKAMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND ELECTRONIC COMPONENT
- Publication number 20190008037
- Publication date Jan 3, 2019
- Sumitomo Electric Industries, Ltd.
- Kohei OKAMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BASE FILM FOR PRINTED CIRCUIT BOARD, SUBSTRATE FOR PRINTED CIRCUIT...
- Publication number 20180371191
- Publication date Dec 27, 2018
- Sumitomo Electric Industries, Ltd.
- Kayo HASHIZUME
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
COATING DEVICE AND METHOD OF PRODUCING COATED SHEET
- Publication number 20180333739
- Publication date Nov 22, 2018
- Sumitomo Electric Industries, Ltd.
- Kazuhiro MIYATA
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
SUBSTRATE FOR PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD
- Publication number 20180147815
- Publication date May 31, 2018
- Sumitomo Electric Industries, Ltd.
- Kayo HASHIZUME
- B32 - LAYERED PRODUCTS
Information Patent Application
SUBSTRATE FOR PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOARD, AND MET...
- Publication number 20180124925
- Publication date May 3, 2018
- Sumitomo Electric Industries, Ltd.
- Kayo HASHIZUME
- B32 - LAYERED PRODUCTS
Information Patent Application
METAL POWDER, INK, SINTERED BODY, SUBSTRATE FOR PRINTED CIRCUIT BOA...
- Publication number 20180015547
- Publication date Jan 18, 2018
- Sumitomo Electric Industries, Ltd.
- Issei OKADA
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
SUBSTRATE FOR PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOARD, AND MET...
- Publication number 20180014403
- Publication date Jan 11, 2018
- Sumitomo Electric Industries, Ltd.
- Takashi KASUGA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE FOR PRINTED WIRING BOARD AND METHOD FOR PRODUCING THE SAM...
- Publication number 20170347464
- Publication date Nov 30, 2017
- Sumitomo Electric Industries, Ltd.
- Kayo HASHIZUME
- B32 - LAYERED PRODUCTS
Information Patent Application
SUBSTRATE FOR PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOARD, AND MET...
- Publication number 20170347459
- Publication date Nov 30, 2017
- Sumitomo Electric Industries, Ltd.
- Kazuhiro MIYATA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE FOR PRINTED CIRCUIT BOARD AND METHOD FOR PRODUCING SUBSTR...
- Publication number 20170347449
- Publication date Nov 30, 2017
- Sumitomo Electric Industries, Ltd.
- Motohiko SUGIURA
- B82 - NANO-TECHNOLOGY
Information Patent Application
SUBSTRATE FOR PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOARD, AND MET...
- Publication number 20170290150
- Publication date Oct 5, 2017
- Sumitomo Electric Industries, Ltd.
- Takashi KASUGA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE FOR PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOARD, AND MET...
- Publication number 20170127516
- Publication date May 4, 2017
- Sumitomo Electric Industries, Ltd.
- Takashi KASUGA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE FOR PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOARD, AND MET...
- Publication number 20170099732
- Publication date Apr 6, 2017
- Sumitomo Electric Industries, Ltd.
- Takashi KASUGA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING PRINTED WIRING BOARD
- Publication number 20160330850
- Publication date Nov 10, 2016
- Sumitomo Electric Industries, Ltd.
- Yoshio OKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING PRINTED WIRING BOARD
- Publication number 20160330847
- Publication date Nov 10, 2016
- Sumitomo Electric Industries, Ltd.
- Yoshio OKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DOUBLE-SIDED PRINTED WIRING BOARD AND METHOD FOR PRODUCING THE SAME
- Publication number 20140332258
- Publication date Nov 13, 2014
- Yoshifumi Uchida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE FOR PRINTED WIRING BOARD, PRINTED WIRING BOARD, AND METHO...
- Publication number 20140166495
- Publication date Jun 19, 2014
- Sumitomo Electric Industries, Ltd.
- Yoshio OKA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE FOR PRINTED WIRING BOARD, PRINTED WIRING BOARD, AND METHO...
- Publication number 20120031656
- Publication date Feb 9, 2012
- Yoshio Oka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEAL STRUCTURE, METHOD OF FORMING SEAL STRUCTURE, WIRE BODY, AND EL...
- Publication number 20110000712
- Publication date Jan 6, 2011
- Takashi Kasuga
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
FLEXIBLE PRINTED WIRING BOARD
- Publication number 20100116525
- Publication date May 13, 2010
- Yoshio Oka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of producing metal powder
- Publication number 20070089565
- Publication date Apr 26, 2007
- Masatoshi Majima
- B22 - CASTING POWDER METALLURGY
Information Patent Application
Conductive silver paste and conductive film formed using the same
- Publication number 20050194577
- Publication date Sep 8, 2005
- SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Takashi Kasuga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Takashi KASUGA

Person

Patents Grantslast 30 patents

Base material for printed circuit board and printed circuit board

Resin film, substrate for printed wiring board, and printed wiring...

Base material for printed circuit board and printed circuit board

Substrate for printed circuit board and printed circuit board

Printed circuit board and electronic component

Printed circuit board and electronic component

Metal powder, ink, sintered body, substrate for printed circuit boa...

Substrate for printed circuit board, printed circuit board, and met...

Substrate for printed wiring board and method for producing the sam...

Substrate for printed circuit board, printed circuit board, and met...

Substrate for printed circuit board, printed circuit board, and met...

Substrate for printed circuit board and method for producing substr...

Substrate for printed circuit board, printed circuit board, and met...

Substrate for printed circuit board, printed circuit board, and met...

Substrate for printed circuit board, printed circuit board, and met...

Seal structure, method of forming seal structure, wire body, and el...

Flexible printed wiring board

Method of producing metal powder

Conductive silver paste and conductive film formed using the same

Patents Applicationslast 30 patents

BASE MATERIAL FOR PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD

BASE MATERIAL FOR PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD

RESIN FILM, SUBSTRATE FOR PRINTED WIRING BOARD, AND PRINTED WIRING...

BASE MATERIAL FOR PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD

PRINTED CIRCUIT BOARD AND ELECTRONIC COMPONENT

PRINTED CIRCUIT BOARD AND ELECTRONIC COMPONENT

BASE FILM FOR PRINTED CIRCUIT BOARD, SUBSTRATE FOR PRINTED CIRCUIT...

COATING DEVICE AND METHOD OF PRODUCING COATED SHEET

SUBSTRATE FOR PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD

SUBSTRATE FOR PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOARD, AND MET...

METAL POWDER, INK, SINTERED BODY, SUBSTRATE FOR PRINTED CIRCUIT BOA...

SUBSTRATE FOR PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOARD, AND MET...

SUBSTRATE FOR PRINTED WIRING BOARD AND METHOD FOR PRODUCING THE SAM...

SUBSTRATE FOR PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOARD, AND MET...

SUBSTRATE FOR PRINTED CIRCUIT BOARD AND METHOD FOR PRODUCING SUBSTR...

SUBSTRATE FOR PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOARD, AND MET...

SUBSTRATE FOR PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOARD, AND MET...

SUBSTRATE FOR PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOARD, AND MET...

METHOD FOR PRODUCING PRINTED WIRING BOARD

METHOD FOR PRODUCING PRINTED WIRING BOARD

DOUBLE-SIDED PRINTED WIRING BOARD AND METHOD FOR PRODUCING THE SAME

SUBSTRATE FOR PRINTED WIRING BOARD, PRINTED WIRING BOARD, AND METHO...

SUBSTRATE FOR PRINTED WIRING BOARD, PRINTED WIRING BOARD, AND METHO...

SEAL STRUCTURE, METHOD OF FORMING SEAL STRUCTURE, WIRE BODY, AND EL...

FLEXIBLE PRINTED WIRING BOARD

Method of producing metal powder

Conductive silver paste and conductive film formed using the same