Takashi Kataoka

Person

Saitama, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Surface-treated copper foil low-dielectric substrate and copper-cla...
- Patent number 6,969,557
- Issue date Nov 29, 2005
- Mitsui Mining & Smelting Co., Ltd.
- Mitsuyoshi Matsuda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper foil and metal foil with carrier foil for printed wiring boa...
- Patent number 6,902,824
- Issue date Jun 7, 2005
- Mitsui Mining & Smelting Co., Ltd.
- Takuya Yamamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing printed wiring board
- Patent number 6,827,867
- Issue date Dec 7, 2004
- Mitsui Mining & Smelting Co., Ltd.
- Takuya Yamamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing process for printed wiring board
- Patent number 6,716,572
- Issue date Apr 6, 2004
- Mitsui Mining & Smelting Co., Ltd.
- Takuya Yamamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing printed wiring board comprising electrodep...
- Patent number 6,660,406
- Issue date Dec 9, 2003
- Mitsui Mining & Smelting Co., Ltd.
- Takuya Yamamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of producing a surface-treated copper foil
- Patent number 6,585,877
- Issue date Jul 1, 2003
- Mitsui Mining & Smelting Co., Ltd.
- Masakazu Mitsuhashi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of producing a surface-treated copper foil
- Patent number 6,579,437
- Issue date Jun 17, 2003
- Mitsui Mining & Smelting Co., Ltd.
- Masakazu Mitsuhashi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Composite material used in making printed wiring boards
- Patent number 6,548,153
- Issue date Apr 15, 2003
- Mitsui Mining & Smelting Co., Ltd.
- Takashi Kataoka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrodeposited copper foil
- Patent number 6,544,663
- Issue date Apr 8, 2003
- Mitsui Mining & Smelting Co., Ltd.
- Osamu Nakano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Surface-treated copper foil, method of producing the surface-treate...
- Patent number 6,533,915
- Issue date Mar 18, 2003
- Mitsui Mining & Smelting Co., Ltd.
- Masakazu Mitsuhashi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Surface-treated copper foil, method of producing the surface-treate...
- Patent number 6,531,045
- Issue date Mar 11, 2003
- Mitsui Mining & Smelting Co., Ltd.
- Masakazu Mitsuhashi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Making and using an ultra-thin copper foil
- Patent number 6,319,620
- Issue date Nov 20, 2001
- Mitsui Mining & Smelting Co., Ltd.
- Takashi Kataoka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Making and using an ultra-thin copper foil
- Patent number 6,270,889
- Issue date Aug 7, 2001
- Mitsui Mining & Smelting Co., Ltd.
- Takashi Kataoka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Composite foil of aluminum and copper
- Patent number 6,183,880
- Issue date Feb 6, 2001
- Mitsui Mining & Smelting Co., Ltd.
- Junshi Yoshioka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
Surface treatment copper foil for low dielectric substrate, copper...
- Publication number 20040191560
- Publication date Sep 30, 2004
- Mitsuyoshi Matsuda
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Surface treated copper foil, electrodeposited copper foil with carr...
- Publication number 20030148136
- Publication date Aug 7, 2003
- Mitsui Mining & Smelting Co. Ltd.
- Takuya Yamamoto
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Composite material used in making printed wiring boards
- Publication number 20020090497
- Publication date Jul 11, 2002
- Takashi Kataoka
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Manufacturing process for printed wiring board
- Publication number 20020081530
- Publication date Jun 27, 2002
- MITSUI MINING AND SMELTING CO., LTD
- Takuya Yamamoto
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Copper foil and metal foil with carrier foil for printed wiring boa...
- Publication number 20020079133
- Publication date Jun 27, 2002
- Mitsui Mining & Smelting Co. Ltd.
- Takuya Yamamoto
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Making and using an ultra-thin copper foil
- Publication number 20020070120
- Publication date Jun 13, 2002
- Takashi Kataoka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method for manufacturing printed wiring board comprising electrodep...
- Publication number 20020004123
- Publication date Jan 10, 2002
- Takuya Yamamoto
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Method for manufacturing printed wiring board
- Publication number 20010042732
- Publication date Nov 22, 2001
- Takuya Yamamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Metal foil with carrier and method for manufacturing the same
- Publication number 20010019780
- Publication date Sep 6, 2001
- MITSUI MINING AND SMELTING CO., LTD
- Shin-ichi Obata
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Surface-treated copper foil, method of producing the surface-treate...
- Publication number 20010014407
- Publication date Aug 16, 2001
- MITSUI MINING AND SMELTING CO., LTD
- Masakazu Mitsuhashi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Surface-treated copper foil, method of producing the surface-treate...
- Publication number 20010014410
- Publication date Aug 16, 2001
- MITSUI MINING AND SMELTING CO., LTD
- Masakazu Mitsuhashi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Surface-treated copper foil, method of producing the surface-treate...
- Publication number 20010014406
- Publication date Aug 16, 2001
- MITSUI MINING AND SMELTING CO., LTD
- Masakazu Mitsuhashi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Surface -treated copper foil, method of producing the surface-treat...
- Publication number 20010014408
- Publication date Aug 16, 2001
- Mitsui Mining & Smelting Co. Ltd.
- Masakazu Mitsuhashi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Takashi Kataoka

Person

Patents Grantslast 30 patents

Surface-treated copper foil low-dielectric substrate and copper-cla...

Copper foil and metal foil with carrier foil for printed wiring boa...

Method for manufacturing printed wiring board

Manufacturing process for printed wiring board

Method for manufacturing printed wiring board comprising electrodep...

Method of producing a surface-treated copper foil

Method of producing a surface-treated copper foil

Composite material used in making printed wiring boards

Electrodeposited copper foil

Surface-treated copper foil, method of producing the surface-treate...

Surface-treated copper foil, method of producing the surface-treate...

Making and using an ultra-thin copper foil

Making and using an ultra-thin copper foil

Composite foil of aluminum and copper

Patents Applicationslast 30 patents

Surface treatment copper foil for low dielectric substrate, copper...

Surface treated copper foil, electrodeposited copper foil with carr...

Composite material used in making printed wiring boards

Manufacturing process for printed wiring board

Copper foil and metal foil with carrier foil for printed wiring boa...

Making and using an ultra-thin copper foil

Method for manufacturing printed wiring board comprising electrodep...

Method for manufacturing printed wiring board

Metal foil with carrier and method for manufacturing the same

Surface-treated copper foil, method of producing the surface-treate...

Surface-treated copper foil, method of producing the surface-treate...

Surface-treated copper foil, method of producing the surface-treate...

Surface -treated copper foil, method of producing the surface-treat...