Takashi Kitae

Person

Osaka, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic component assembly
- Patent number 9,426,899
- Issue date Aug 23, 2016
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Takashi Kitae
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrode structure and method for forming bump
- Patent number 8,887,383
- Issue date Nov 18, 2014
- Panasonic Corporation
- Yasushi Taniguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip-chip mounting resin composition and bump forming resin composi...
- Patent number 8,709,293
- Issue date Apr 29, 2014
- Panasonic Corporation
- Takashi Kitae
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for connecting between substrates, flip-chip mounting struct...
- Patent number 8,501,583
- Issue date Aug 6, 2013
- Panasonic Corporation
- Takashi Kitae
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bump forming method using self-assembling resin and a wall surface
- Patent number 8,297,488
- Issue date Oct 30, 2012
- Panasonic Corporation
- Seiji Karashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device having semiconductor elements formed inside a...
- Patent number 8,288,778
- Issue date Oct 16, 2012
- Panasonic Corporation
- Seiichi Nakatani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip mounting method and bump forming method
- Patent number 8,283,246
- Issue date Oct 9, 2012
- Panasonic Corporation
- Takashi Kitae
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Transistor having an organic semiconductor with a hollow space
- Patent number 8,193,526
- Issue date Jun 5, 2012
- Panasonic Corporation
- Seiichi Nakatani
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Flip chip connection structure having powder-like conductive substa...
- Patent number 8,097,958
- Issue date Jan 17, 2012
- Panasonic Corporation
- Susumu Sawada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip chip mounting body, flip chip mounting method and flip chip mo...
- Patent number 8,071,425
- Issue date Dec 6, 2011
- Panasonic Corporation
- Seiichi Nakatani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounted body and method for manufacturing the same
- Patent number 8,039,307
- Issue date Oct 18, 2011
- Panasonic Corporation
- Toshiyuki Kojima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip mounting process and flip chip assembly
- Patent number 8,012,801
- Issue date Sep 6, 2011
- Panasonic Corporation
- Seiji Karashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip chip mounting method and bump forming method
- Patent number 7,951,700
- Issue date May 31, 2011
- Panasonic Corporation
- Takashi Kitae
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component mounting method
- Patent number 7,921,551
- Issue date Apr 12, 2011
- Panasonic Corporation
- Yoshihisa Yamashita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for mutually connecting substrates, flip chip mounting body,...
- Patent number 7,919,357
- Issue date Apr 5, 2011
- Panasonic Corporation
- Susumu Sawada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mounted body and method for manufacturing the same
- Patent number 7,911,064
- Issue date Mar 22, 2011
- Panasonic Corporation
- Shingo Komatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump forming method and bump forming apparatus
- Patent number 7,905,011
- Issue date Mar 15, 2011
- Panasonic Corporation
- Yasushi Taniguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip chip mounting method, flip chip mounting apparatus and flip ch...
- Patent number 7,875,496
- Issue date Jan 25, 2011
- Panasonic Corporation
- Seiichi Nakatani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip chip mounting method and method for connecting substrates
- Patent number 7,820,021
- Issue date Oct 26, 2010
- Panasonic Corporation
- Seiji Karashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for forming bumps and solder bump
- Patent number 7,799,607
- Issue date Sep 21, 2010
- Panasonic Corporation
- Seiji Karashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip chip mounting process and flip chip assembly
- Patent number 7,759,162
- Issue date Jul 20, 2010
- Panasonic Corporation
- Seiji Karashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip chip mounting body, flip chip mounting method and flip chip mo...
- Patent number 7,732,920
- Issue date Jun 8, 2010
- Panasonic Corporation
- Seiichi Nakatani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounted body and method for manufacturing the same
- Patent number 7,713,787
- Issue date May 11, 2010
- Panasonic Corporation
- Toshiyuki Kojima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive resin composition, connection method between electrodes...
- Patent number 7,714,444
- Issue date May 11, 2010
- Panasonic Corporation
- Seiichi Nakatani
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component transporting method
- Patent number 7,640,654
- Issue date Jan 5, 2010
- Panasonic Corporation
- Seiichi Nakatani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming conductive pattern and wiring board
- Patent number 7,640,659
- Issue date Jan 5, 2010
- Panasonic Corporation
- Seiji Karashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip chip mounting method and bump forming method
- Patent number 7,638,883
- Issue date Dec 29, 2009
- Panasonic Corporation
- Seiji Karashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming solder bump and method for mounting semiconducto...
- Patent number 7,611,040
- Issue date Nov 3, 2009
- Panasonic Corporation
- Takashi Kitae
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive resin composition, connection method between electrodes...
- Patent number 7,537,961
- Issue date May 26, 2009
- Panasonic Corporation
- Seiichi Nakatani
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip chip mounting method and method for connecting substrates
- Patent number 7,531,385
- Issue date May 12, 2009
- Panasonic Corporation
- Seiji Karashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING THE SAME AND IMAGE D...
- Publication number 20110204366
- Publication date Aug 25, 2011
- PANASONIC CORPORATION
- Seiichi Nakatani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING THE SAME AND IMAGE D...
- Publication number 20110204367
- Publication date Aug 25, 2011
- PANASONIC CORPORATION
- Seiichi Nakatani
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
FLIP CHIP MOUNTING METHOD AND BUMP FORMING METHOD
- Publication number 20110201195
- Publication date Aug 18, 2011
- PANASONIC CORPORATION
- Takashi KITAE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MOUNTED BODY AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20100224986
- Publication date Sep 9, 2010
- PANASONIC CORPORATION
- Toshiyuki Kojima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP MOUNTING BODY, FLIP CHIP MOUNTING METHOD AND FLIP CHIP MO...
- Publication number 20100203675
- Publication date Aug 12, 2010
- PANASONIC CORPORATION
- Seiichi NAKATANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP MOUNTING PROCESS AND FLIP CHIP ASSEMBLY
- Publication number 20100148376
- Publication date Jun 17, 2010
- Seiji Karashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRODE STRUCTURE AND METHOD FOR FORMING BUMP
- Publication number 20100044091
- Publication date Feb 25, 2010
- PANASONIC CORPORATION
- Yasushi Taniguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT ASSEMBLY, ELECTRIC COMPONENT WITH SOLDER BUMP...
- Publication number 20100011572
- Publication date Jan 21, 2010
- Takashi Kitae
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
METHOD FOR CONNECTING BETWEEN SUBSTRATES, FLIP-CHIP MOUNTING STRUCT...
- Publication number 20100007033
- Publication date Jan 14, 2010
- Takashi KITAE
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
METHOD FOR MUTUALLY CONNECTING SUBSTRATES, FLIP CHIP MOUNTING BODY,...
- Publication number 20100001411
- Publication date Jan 7, 2010
- Susumu SAWADA
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
BUMP FORMING METHOD AND BUMP FORMING APPARATUS
- Publication number 20090229120
- Publication date Sep 17, 2009
- Yasushi Taniguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MOUNTED BODY AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20090230546
- Publication date Sep 17, 2009
- Matsushita Electric Industrial Co., Ltd.
- Shingo Komatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Component Mounting Method and Electronic Circuit Device
- Publication number 20090223705
- Publication date Sep 10, 2009
- Yoshihisa Yamashita
- B30 - PRESSES
Information Patent Application
FLIP CHIP MOUNTING METHOD, FLIP CHIP MOUNTING APPARATUS AND FLIP CH...
- Publication number 20090203170
- Publication date Aug 13, 2009
- Matsushita Electric Industrial Co., Ltd.
- Seiichi Nakatani
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
CONDUCTIVE RESIN COMPOSITION, CONNECTION METHOD BETWEEN ELECTRODES...
- Publication number 20090200522
- Publication date Aug 13, 2009
- PANASONIC CORPORATION
- Seiichi NAKATANI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR FORMING CONDUCTIVE PATTERN AND WIRING BOARD
- Publication number 20090133901
- Publication date May 28, 2009
- Seiji Karashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flip chip mounting method and method for connecting substrates
- Publication number 20090126876
- Publication date May 21, 2009
- Matsushita Electric Industrial Co., Ltd.
- Seiji Karashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLIP CHIP MOUNTING METHOD AND METHOD FOR CONNECTING SUBSTRATES
- Publication number 20090115071
- Publication date May 7, 2009
- Seiji Karashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLIP CHIP MOUNTING METHOD AND BUMP FORMING METHOD
- Publication number 20090117688
- Publication date May 7, 2009
- Seiji Karashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTION STRUCTURE AND METHOD OF PRODUCING THE SAME
- Publication number 20090102064
- Publication date Apr 23, 2009
- PANASONIC CORPORATION
- Susumu Sawada
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
FLIP-CHIP MOUNTING BODY AND FLIP-CHIP MOUNTING METHOD
- Publication number 20090085227
- Publication date Apr 2, 2009
- Matsushita Electric Industrial Co., Ltd.
- Tsukasa Shiraishi
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
BUMP FORMING METHOD AND BUMP FORMING APPARATUS
- Publication number 20090078746
- Publication date Mar 26, 2009
- Seiji Karashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLIP CHIP MOUNTING METHOD AND BUMP FORMING METHOD
- Publication number 20090023245
- Publication date Jan 22, 2009
- Matsushita Electric Industrial Co., Ltd.
- Takashi Kitae
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLIP CHIP MOUNTING BODY, FLIP CHIP MOUNTING METHOD AND FLIP CHIP MO...
- Publication number 20090008800
- Publication date Jan 8, 2009
- Matsushita Electric Industrial Co., Ltd.
- Seiichi Nakatani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Component Mounted Body, Electronic Component with Solder...
- Publication number 20090008776
- Publication date Jan 8, 2009
- Takashi Kitae
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flip chip mounting method and bump forming method
- Publication number 20080284046
- Publication date Nov 20, 2008
- Matsushita Electric Industrial Co., Ltd.
- Seiji Karashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Mounted Body and Method for Manufacturing the Same
- Publication number 20080251894
- Publication date Oct 16, 2008
- Matsushita Electric Industrial Co., Ltd.
- Toshiyuki Kojima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Forming Solder Bump and Method for Mounting Semiconducto...
- Publication number 20080197173
- Publication date Aug 21, 2008
- Matsushita Electric Industrial Co., Ltd.
- Takashi Kitae
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Flip-Chip Mounting Resin Composition and Bump Forming Resin Composi...
- Publication number 20080128664
- Publication date Jun 5, 2008
- Takashi Kitae
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Flip Chip Mounting Process and Flip Chip Assembly
- Publication number 20080017995
- Publication date Jan 24, 2008
- Seiji Karashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Takashi Kitae

Person

Patents Grantslast 30 patents

Electronic component assembly

Electrode structure and method for forming bump

Flip-chip mounting resin composition and bump forming resin composi...

Method for connecting between substrates, flip-chip mounting struct...

Bump forming method using self-assembling resin and a wall surface

Semiconductor device having semiconductor elements formed inside a...

Flip chip mounting method and bump forming method

Transistor having an organic semiconductor with a hollow space

Flip chip connection structure having powder-like conductive substa...

Flip chip mounting body, flip chip mounting method and flip chip mo...

Mounted body and method for manufacturing the same

Flip chip mounting process and flip chip assembly

Flip chip mounting method and bump forming method

Electronic component mounting method

Method for mutually connecting substrates, flip chip mounting body,...

Mounted body and method for manufacturing the same

Bump forming method and bump forming apparatus

Flip chip mounting method, flip chip mounting apparatus and flip ch...

Flip chip mounting method and method for connecting substrates

Process for forming bumps and solder bump

Flip chip mounting process and flip chip assembly

Flip chip mounting body, flip chip mounting method and flip chip mo...

Mounted body and method for manufacturing the same

Conductive resin composition, connection method between electrodes...

Electronic component transporting method

Method for forming conductive pattern and wiring board

Flip chip mounting method and bump forming method

Method for forming solder bump and method for mounting semiconducto...

Conductive resin composition, connection method between electrodes...

Flip chip mounting method and method for connecting substrates

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING THE SAME AND IMAGE D...

SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING THE SAME AND IMAGE D...

FLIP CHIP MOUNTING METHOD AND BUMP FORMING METHOD

MOUNTED BODY AND METHOD FOR MANUFACTURING THE SAME

FLIP CHIP MOUNTING BODY, FLIP CHIP MOUNTING METHOD AND FLIP CHIP MO...

FLIP CHIP MOUNTING PROCESS AND FLIP CHIP ASSEMBLY

ELECTRODE STRUCTURE AND METHOD FOR FORMING BUMP

ELECTRONIC COMPONENT ASSEMBLY, ELECTRIC COMPONENT WITH SOLDER BUMP...

METHOD FOR CONNECTING BETWEEN SUBSTRATES, FLIP-CHIP MOUNTING STRUCT...

METHOD FOR MUTUALLY CONNECTING SUBSTRATES, FLIP CHIP MOUNTING BODY,...

BUMP FORMING METHOD AND BUMP FORMING APPARATUS

MOUNTED BODY AND METHOD FOR MANUFACTURING THE SAME

Electronic Component Mounting Method and Electronic Circuit Device

FLIP CHIP MOUNTING METHOD, FLIP CHIP MOUNTING APPARATUS AND FLIP CH...

CONDUCTIVE RESIN COMPOSITION, CONNECTION METHOD BETWEEN ELECTRODES...

METHOD FOR FORMING CONDUCTIVE PATTERN AND WIRING BOARD

Flip chip mounting method and method for connecting substrates

FLIP CHIP MOUNTING METHOD AND METHOD FOR CONNECTING SUBSTRATES

FLIP CHIP MOUNTING METHOD AND BUMP FORMING METHOD

CONNECTION STRUCTURE AND METHOD OF PRODUCING THE SAME

FLIP-CHIP MOUNTING BODY AND FLIP-CHIP MOUNTING METHOD

BUMP FORMING METHOD AND BUMP FORMING APPARATUS

FLIP CHIP MOUNTING METHOD AND BUMP FORMING METHOD

FLIP CHIP MOUNTING BODY, FLIP CHIP MOUNTING METHOD AND FLIP CHIP MO...

Electronic Component Mounted Body, Electronic Component with Solder...

Flip chip mounting method and bump forming method

Mounted Body and Method for Manufacturing the Same

Method for Forming Solder Bump and Method for Mounting Semiconducto...

Flip-Chip Mounting Resin Composition and Bump Forming Resin Composi...

Flip Chip Mounting Process and Flip Chip Assembly