Takashi Kitazawa

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Kumagaya-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Circuit device having funnel shaped lead and method for manufacturi...
- Patent number 8,829,685
- Issue date Sep 9, 2014
- Semiconductor Components Industries, LLC
- Tetsuya Fukushima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with copper wire ball-bonded to electrode pad...
- Patent number 8,692,370
- Issue date Apr 8, 2014
- Semiconductor Components Industries, LLC
- Takashi Kitazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame and method for manufacturing circuit device using the same
- Patent number 8,609,467
- Issue date Dec 17, 2013
- Sanyo Semiconductor Co., Ltd.
- Tetsuya Fukushima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit device
- Patent number 7,332,803
- Issue date Feb 19, 2008
- Sanyo Electric Co., LTD
- Makoto Tsubonoya
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING THE SAME
- Publication number 20110304046
- Publication date Dec 15, 2011
- ON SEMICONDUCTOR TRADING, LTD. a Bermuda limited company
- Takashi Kitazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20100244209
- Publication date Sep 30, 2010
- Sanyo Electric Co., Ltd.
- Tetsuya Fukushima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME AND METHOD FOR MANUFACTURING CIRCUIT DEVICE USING THE SAME
- Publication number 20100244210
- Publication date Sep 30, 2010
- Sanyo Electric Co., Ltd.
- Tetsuya Fukushima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit device
- Publication number 20050040512
- Publication date Feb 24, 2005
- Makoto Tsubonoya
- H01 - BASIC ELECTRIC ELEMENTS