TREA

Takashi KOGA

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  • Koshi City, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Bonding system
    • Patent number 10,840,213
    • Issue date Nov 17, 2020
    • Tokyo Electron Limited
    • Masataka Matsunaga
    • B32 - LAYERED PRODUCTS
  • Information Patent Grant

    Substrate transfer device and bonding system
    • Patent number 10,424,502
    • Issue date Sep 24, 2019
    • Tokyo Electron Limited
    • Masataka Matsunaga
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Bonding systems
    • Patent number 10,340,248
    • Issue date Jul 2, 2019
    • Tokyo Electron Limited
    • Masataka Matsunaga
    • Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

  • Information Patent Application

    SEPARATING SYSTEM AND SEPARATING METHOD
    • Publication number 20230178392
    • Publication date Jun 8, 2023
    • TOKYO ELECTRON LIMITED
    • Satoshi Nishimura
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BONDING SYSTEM
    • Publication number 20180019226
    • Publication date Jan 18, 2018
    • TOKYO ELECTRON LIMITED
    • Masataka MATSUNAGA
    • B32 - LAYERED PRODUCTS
  • Information Patent Application

    SUBSTRATE TRANSFER DEVICE AND BONDING SYSTEM
    • Publication number 20180019153
    • Publication date Jan 18, 2018
    • TOKYO ELECTRON LIMITED
    • Masataka MATSUNAGA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Bonding System
    • Publication number 20180019225
    • Publication date Jan 18, 2018
    • TOKYO ELECTRON LIMITED
    • Masataka MATSUNAGA
    • H01 - BASIC ELECTRIC ELEMENTS