Membership
Tour
Register
Log in
Takashi Kouda
Follow
Person
Tokyo, JP
People
Overview
Industries
Organizations
People
Information
Impact
Patents Grants
last 30 patents
Information
Patent Grant
Machining strain removal apparatus
Patent number
6,780,091
Issue date
Aug 24, 2004
Disco Corporation
Yasutaka Mizomoto
B24 - GRINDING POLISHING
Information
Patent Grant
Semiconductor wafer grinding apparatus
Patent number
6,159,071
Issue date
Dec 12, 2000
Disco Corporation
Yutaka Koma
B24 - GRINDING POLISHING
Patents Applications
last 30 patents
Information
Patent Application
Machining strain removal apparatus
Publication number
20030036343
Publication date
Feb 20, 2003
Yasutaka Mizomoto
B24 - GRINDING POLISHING