Takashi Kurihara

Person

Nagano-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Embedded printed circuit board
- Patent number 12,185,470
- Issue date Dec 31, 2024
- Shinko Electric Industries Co., Ltd.
- Yukinori Hatori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate, semiconductor device, method of manufacturing wir...
- Patent number 9,622,347
- Issue date Apr 11, 2017
- Shinko Electric Industries Co., Ltd.
- Kiyoshi Oi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and semiconductor device
- Patent number 9,307,641
- Issue date Apr 5, 2016
- Shinko Electric Industries Co., Ltd.
- Kiyoshi Oi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic packaging apparatus and electronic packaging method
- Patent number 8,720,519
- Issue date May 13, 2014
- Shinko Electric Industries Co., Ltd.
- Takatoyo Yamakami
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor element, semiconductor element mounted board, and met...
- Patent number 8,610,268
- Issue date Dec 17, 2013
- Shinko Electric Industries Co., Ltd.
- Kazutaka Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor-device mounted board and method of manufacturing the...
- Patent number 8,232,639
- Issue date Jul 31, 2012
- Shinko Electric Industries Co., Ltd.
- Toshio Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor device having underfill resin...
- Patent number 8,138,018
- Issue date Mar 20, 2012
- Shinko Electric Industries Co., Ltd.
- Kiyoshi Oi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate and manufacturing method thereof, and semiconducto...
- Patent number 8,115,300
- Issue date Feb 14, 2012
- Shinko Electric Industries Co., Ltd.
- Shigetsugu Muramatsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming side wirings
- Patent number 7,807,561
- Issue date Oct 5, 2010
- Shinko Electric Industries Co., Ltd.
- Shigeru Mizuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus having side surface wiring
- Patent number 7,777,349
- Issue date Aug 17, 2010
- Shinko Electric Industries Co., Ltd.
- Kei Murayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with flip-chip connection that uses gallium or...
- Patent number 7,750,484
- Issue date Jul 6, 2010
- Shinko Electric Industries Co., Ltd.
- Shigeru Mizuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor package having electrodes pe...
- Patent number 7,067,353
- Issue date Jun 27, 2006
- Shinko Electric Industries Co., Ltd.
- Naoyuki Koizumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor, capacitor-embedded board, and method for manufacturing t...
- Patent number 7,054,141
- Issue date May 30, 2006
- Shinko Electric Industries Co., Ltd.
- Hideaki Sakaguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing thin semiconductor chip
- Patent number 6,974,721
- Issue date Dec 13, 2005
- Shinko Electric Industries Co., Ltd.
- Naoyuki Koizumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing micro-semiconductor element
- Patent number 6,872,634
- Issue date Mar 29, 2005
- Shinko Electric Industries Co., Ltd.
- Naoyuki Koizumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layered semiconductor device and method for producing the same
- Patent number 6,849,945
- Issue date Feb 1, 2005
- Shinko Electric Industries Co., Ltd.
- Michio Horiuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and process of production of same
- Patent number 6,774,467
- Issue date Aug 10, 2004
- Shinko Electric Industries Co., Ltd.
- Michio Horiuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin sealed stacked semiconductor packages with flat surfaces
- Patent number 6,731,010
- Issue date May 4, 2004
- Shinko Electric Industries Co., Ltd.
- Michio Horiuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with an exposed external-connection terminal
- Patent number 6,660,942
- Issue date Dec 9, 2003
- Shinko Electric Industries Co., Ltd.
- Michio Horiuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and semiconductor device
- Patent number 6,522,017
- Issue date Feb 18, 2003
- Shinko Electric Industries Co., Ltd.
- Michio Horiuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-layer wiring board substrate and semiconductor device using t...
- Patent number 6,518,672
- Issue date Feb 11, 2003
- Shinko Electric Industries Co., Ltd.
- Takashi Kurihara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring boards, semiconductor devices and their production processes
- Patent number 6,469,260
- Issue date Oct 22, 2002
- Shinko Electric Industries Co., Ltd.
- Michio Horiuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board and manufacturing method thereof and semiconductor device
- Patent number 6,455,786
- Issue date Sep 24, 2002
- Shinko Electric Industries Co., Ltd.
- Michio Horiuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process of packaging a semiconductor device with reinforced film su...
- Patent number 6,444,494
- Issue date Sep 3, 2002
- Shinko Electric Industries Co., Ltd.
- Shigetsugu Muramatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer circuit board
- Patent number 6,407,344
- Issue date Jun 18, 2002
- Shinko Electric Industries Co., Ltd.
- Michio Horiuchi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
EMBEDDED PRINTED CIRCUIT BOARD
- Publication number 20230276575
- Publication date Aug 31, 2023
- Shinko Electric Industries Co., Ltd.
- Yukinori HATORI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE, METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCT...
- Publication number 20150250053
- Publication date Sep 3, 2015
- Shinko Electric Industries Co., Ltd.
- Koyoshi OI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE, SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING WI...
- Publication number 20150223330
- Publication date Aug 6, 2015
- Shinko Electric Industries Co., Ltd.
- Kiyoshi Oi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR ELEMENT, SEMICONDUCTOR ELEMENT MOUNTED BOARD, AND MET...
- Publication number 20120074578
- Publication date Mar 29, 2012
- Shinko Electric Industries Co., Ltd.
- Kazutaka KOBAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGING APPARATUS AND ELECTRONIC PACKAGING METHOD
- Publication number 20120043005
- Publication date Feb 23, 2012
- Shinko Electric Industries Co., Ltd.
- Takatoyo YAMAKAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR-DEVICE MOUNTED BOARD AND METHOD OF MANUFACTURING THE...
- Publication number 20110127656
- Publication date Jun 2, 2011
- Shinko Electric Industries Co., Ltd.
- Toshio KOBAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20090258460
- Publication date Oct 15, 2009
- Shinko Electric Industries Co., Ltd.
- Kiyoshi Oi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20090134530
- Publication date May 28, 2009
- Shinko Electric Industries Co., Ltd.
- Takashi Kurihara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR FORMING SIDE WIRINGS
- Publication number 20090023247
- Publication date Jan 22, 2009
- Shinko Electric Industries Co., Ltd.
- Shigeru MIZUNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS AND MANUFACTURING METHOD THEREOF
- Publication number 20090020889
- Publication date Jan 22, 2009
- Shinko Electric Industries Co., Ltd.
- Kei MURAYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS AND MANUFACTURING METHOD THEREOF
- Publication number 20090020887
- Publication date Jan 22, 2009
- Shinko Electric Industries Co., Ltd.
- Shigeru MIZUNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20090001571
- Publication date Jan 1, 2009
- Shinko Electric Industries Co., Ltd.
- Shigeru Mizuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND MANUFACTURING METHOD THEREOF, AND SEMICONDUCTO...
- Publication number 20070290306
- Publication date Dec 20, 2007
- Shinko Electric Industries Co., Ltd.
- Shigetsugu Muramatsu
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Capacitor, capacitor-embedded board, and method for manufacturing t...
- Publication number 20050280978
- Publication date Dec 22, 2005
- Shinko Electric Industries Co., Ltd.
- Hideaki Sakaguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Thin semiconductor chip manufacturing method
- Publication number 20050176169
- Publication date Aug 11, 2005
- Naoyuki Koizumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for manufacturing semiconductor package
- Publication number 20040259351
- Publication date Dec 23, 2004
- Naoyuki Koizumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20040173914
- Publication date Sep 9, 2004
- Takashi Kurihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing micro-semiconductor element
- Publication number 20030228719
- Publication date Dec 11, 2003
- Shinko Electric Industries Co. Ltd
- Naoyuki Koizumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for the production thereof
- Publication number 20020070446
- Publication date Jun 13, 2002
- Michio Horiuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and process of production of same
- Publication number 20020031867
- Publication date Mar 14, 2002
- Michio Horiuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-layered semiconductor device and method for producing the same
- Publication number 20010054756
- Publication date Dec 27, 2001
- Michio Horiuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-layer wiring board substrate and semiconductor device using t...
- Publication number 20010054757
- Publication date Dec 27, 2001
- Takashi Kurihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wiring substrate, method of manufacturing the same and semiconducto...
- Publication number 20010027874
- Publication date Oct 11, 2001
- Michio Horiuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and process of production of same
- Publication number 20010026010
- Publication date Oct 4, 2001
- Michio Horiuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wiring board, semiconductor device and production methods thereof
- Publication number 20010020549
- Publication date Sep 13, 2001
- Michio Horiuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wiring boards, semiconductor devices and their production processes
- Publication number 20010017221
- Publication date Aug 30, 2001
- Michio Horiuchi
- H01 - BASIC ELECTRIC ELEMENTS

Takashi Kurihara

Person

Patents Grantslast 30 patents

Embedded printed circuit board

Wiring substrate, semiconductor device, method of manufacturing wir...

Wiring substrate and semiconductor device

Electronic packaging apparatus and electronic packaging method

Semiconductor element, semiconductor element mounted board, and met...

Semiconductor-device mounted board and method of manufacturing the...

Manufacturing method of semiconductor device having underfill resin...

Wiring substrate and manufacturing method thereof, and semiconducto...

Method for forming side wirings

Semiconductor apparatus having side surface wiring

Semiconductor device with flip-chip connection that uses gallium or...

Method for manufacturing semiconductor package having electrodes pe...

Capacitor, capacitor-embedded board, and method for manufacturing t...

Method for manufacturing thin semiconductor chip

Method of manufacturing micro-semiconductor element

Multi-layered semiconductor device and method for producing the same

Semiconductor device and process of production of same

Resin sealed stacked semiconductor packages with flat surfaces

Semiconductor device with an exposed external-connection terminal

Wiring board and semiconductor device

Multi-layer wiring board substrate and semiconductor device using t...

Wiring boards, semiconductor devices and their production processes

Wiring board and manufacturing method thereof and semiconductor device

Process of packaging a semiconductor device with reinforced film su...

Multilayer circuit board

Patents Applicationslast 30 patents

EMBEDDED PRINTED CIRCUIT BOARD

WIRING SUBSTRATE, METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCT...

WIRING SUBSTRATE, SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING WI...

SEMICONDUCTOR ELEMENT, SEMICONDUCTOR ELEMENT MOUNTED BOARD, AND MET...

ELECTRONIC PACKAGING APPARATUS AND ELECTRONIC PACKAGING METHOD

SEMICONDUCTOR-DEVICE MOUNTED BOARD AND METHOD OF MANUFACTURING THE...

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

METHOD FOR FORMING SIDE WIRINGS

SEMICONDUCTOR APPARATUS AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR APPARATUS AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

WIRING SUBSTRATE AND MANUFACTURING METHOD THEREOF, AND SEMICONDUCTO...

Capacitor, capacitor-embedded board, and method for manufacturing t...

Thin semiconductor chip manufacturing method

Method for manufacturing semiconductor package

Semiconductor device

Method of manufacturing micro-semiconductor element

Semiconductor device and method for the production thereof

Semiconductor device and process of production of same

Multi-layered semiconductor device and method for producing the same

Multi-layer wiring board substrate and semiconductor device using t...

Wiring substrate, method of manufacturing the same and semiconducto...

Semiconductor device and process of production of same

Wiring board, semiconductor device and production methods thereof

Wiring boards, semiconductor devices and their production processes