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Takashi Matsumura

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  • Kawachi-gun, JP
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    ADHESIVE COMPOSITION
    • Publication number 20190016930
    • Publication date Jan 17, 2019
    • DEXERIALS CORPORATION
    • Hidetsugu NAMIKI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20160260683
    • Publication date Sep 8, 2016
    • DEXERIALS CORPORATION
    • Kazunori HAMAZAKI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    EPOXY RESIN COMPOSITION, METHOD FOR PRODUCING COMPOSITE UNIT USING...
    • Publication number 20120281376
    • Publication date Nov 8, 2012
    • SONY CHEMICAL & INFORMATION DEVICE CORPORATION
    • Taichi Koyama
    • C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
  • Information Patent Application

    HEATING APPARATUS AND IMPLEMENTED BODY MANUFACTURING METHOD
    • Publication number 20120279653
    • Publication date Nov 8, 2012
    • SONY CHEMICAL & INFORMATION DEVICE CORPORATION
    • Takashi Matsumura
    • B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
  • Information Patent Application

    METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
    • Publication number 20110237028
    • Publication date Sep 29, 2011
    • SONY CHEMICAL & INFORMATION DEVICE CORPORATION
    • Kazunori Hamazaki
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD FOR PACKING ELECTRIC COMPONENTS ON A SUBSTRATE
    • Publication number 20100186894
    • Publication date Jul 29, 2010
    • SONY CHEMICAL & INFORMATION DEVICE CORPORATION
    • Takashi Matsumura
    • B30 - PRESSES
  • Information Patent Application

    Compression bonding device
    • Publication number 20090314437
    • Publication date Dec 24, 2009
    • SONY CHEMICAL & INFORMATION DEVICE CORPORATION
    • Takashi Matsumura
    • B30 - PRESSES
  • Information Patent Application

    DEVICE FOR MOUNTING ELECTRIC COMPONENT
    • Publication number 20090230171
    • Publication date Sep 17, 2009
    • SONY CHEMICAL & INFORMATION DEVICE CORPORATION
    • Takashi Matsumura
    • B30 - PRESSES
  • Information Patent Application

    MOUNTING METHOD
    • Publication number 20090038753
    • Publication date Feb 12, 2009
    • SONY CHEMICAL & INFORMATION DEVICE CORPORATION
    • Takashi Matsumura
    • B30 - PRESSES
  • Information Patent Application

    Compression bonding device and a mounting method
    • Publication number 20090032570
    • Publication date Feb 5, 2009
    • SONY CHEMICAL & INFORMAION DEVICE CORPORATION
    • Takashi Matsumura
    • B30 - PRESSES
  • Information Patent Application

    COMPRESSION BONDING DEVICE
    • Publication number 20090014498
    • Publication date Jan 15, 2009
    • SONY CHEMICAL & INFORMATION DEVICE CORPORATION
    • Takashi Matsumura
    • B30 - PRESSES
  • Information Patent Application

    Method and device for mounting electric component
    • Publication number 20060113356
    • Publication date Jun 1, 2006
    • Takashi Matsumura
    • B30 - PRESSES