Takashi Miwa

Person

Kanagawa, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 8,138,022
- Issue date Mar 20, 2012
- Renesas Electronics Corporation
- Michiaki Sugiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 8,084,869
- Issue date Dec 27, 2011
- Renesas Electronics Corporation
- Takashi Miwa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and a manufacturing method of the same
- Patent number 7,879,655
- Issue date Feb 1, 2011
- Renesas Electronics Corporation
- Yasumi Tsutsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a manufacturing method of the same
- Patent number 7,656,019
- Issue date Feb 2, 2010
- Renesas Technology Corp.
- Yasumi Tsutsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 7,332,800
- Issue date Feb 19, 2008
- Renesas Technology Corp.
- Takashi Kikuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 7,286,386
- Issue date Oct 23, 2007
- Renesas Technology Corp.
- Takashi Miwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked large-scale integrated circuit (LSI) semiconductor device w...
- Patent number 7,061,785
- Issue date Jun 13, 2006
- Renesas Technology Corp.
- Takashi Miwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device and a semiconductor...
- Patent number 7,015,069
- Issue date Mar 21, 2006
- Renesas Technology Corp.
- Noriyuki Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device and a semiconductor...
- Patent number 6,872,597
- Issue date Mar 29, 2005
- Renesas Technology Corp.
- Noriyuki Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device using a mold
- Patent number 6,723,583
- Issue date Apr 20, 2004
- Renesas Technology Corp.
- Noriyuki Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device using reinforcing pa...
- Patent number 6,596,561
- Issue date Jul 22, 2003
- Hitachi, Ltd.
- Noriyuki Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit device
- Patent number 5,402,318
- Issue date Mar 28, 1995
- Hitachi, Ltd.
- Kanji Otsuka
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20100330742
- Publication date Dec 30, 2010
- RENESAS ELECTRONICS CORPORATION
- Michiaki Sugiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20100314757
- Publication date Dec 16, 2010
- RENESAS ELECTRONICS CORPORATION
- Michiaki SUGIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A MANUFACTURING METHOD OF THE SAME
- Publication number 20100112761
- Publication date May 6, 2010
- RENESAS TECHNOLOGY CORP.
- Yasumi Tsutsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20100019382
- Publication date Jan 28, 2010
- RENESAS TECHNOLOGY CORP.
- Takashi MIWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and a manufacturing method of the same
- Publication number 20070075414
- Publication date Apr 5, 2007
- RENESAS TECHNOLOGY CORP.
- Yasumi Tsutsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20060180943
- Publication date Aug 17, 2006
- RENESAS TECHNOLOGY CORP.
- Takashi Miwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of surface mounting a semiconductor device
- Publication number 20050189627
- Publication date Sep 1, 2005
- Fujio Ito
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Method of manufacturing a semiconductor device and a semiconductor...
- Publication number 20050127535
- Publication date Jun 16, 2005
- RENESAS TECHNOLOGY CORP.
- Noriyuki Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20050040509
- Publication date Feb 24, 2005
- Takashi Kikuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing a semiconductor device and a semiconductor...
- Publication number 20040164428
- Publication date Aug 26, 2004
- RENESAS TECHNOLOGY CORP.
- Noriyuki Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20040027869
- Publication date Feb 12, 2004
- Hitachi, Ltd.
- Takashi Miwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing a semiconductor device and a semiconductor...
- Publication number 20030205797
- Publication date Nov 6, 2003
- Hitachi, Ltd.
- Noriyuki Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING POWER SUPPLY PADS ARRANGED BETWEEN SIGN...
- Publication number 20030080418
- Publication date May 1, 2003
- MOTOO SUWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing a semiconductor device and a semiconductor...
- Publication number 20020074650
- Publication date Jun 20, 2002
- Noriyuki Takahashi
- H01 - BASIC ELECTRIC ELEMENTS

Takashi Miwa

Person

Patents Grantslast 30 patents

Method of manufacturing semiconductor device

Semiconductor device and method for manufacturing the same

Semiconductor device and a manufacturing method of the same

Semiconductor device and a manufacturing method of the same

Semiconductor device

Semiconductor device

Stacked large-scale integrated circuit (LSI) semiconductor device w...

Method of manufacturing a semiconductor device and a semiconductor...

Method of manufacturing a semiconductor device and a semiconductor...

Method of manufacturing a semiconductor device using a mold

Method of manufacturing a semiconductor device using reinforcing pa...

Semiconductor integrated circuit device

Patents Applicationslast 30 patents

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND A MANUFACTURING METHOD OF THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

Semiconductor device and a manufacturing method of the same

Semiconductor device

Method of surface mounting a semiconductor device

Method of manufacturing a semiconductor device and a semiconductor...

Semiconductor device

Method of manufacturing a semiconductor device and a semiconductor...

Semiconductor device

Method of manufacturing a semiconductor device and a semiconductor...

SEMICONDUCTOR DEVICE HAVING POWER SUPPLY PADS ARRANGED BETWEEN SIGN...

Method of manufacturing a semiconductor device and a semiconductor...