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Takashi Murase
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Yokohama, JP
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last 30 patents
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Patent Grant
Electrically insulated heat pipe type cooling apparatus for semicon...
Patent number
5,283,464
Issue date
Feb 1, 1994
The Furukawa Electric Co., Ltd.
Takashi Murase
F28 - HEAT EXCHANGE IN GENERAL
Information
Patent Grant
Method of manufacturing heat pipe semiconductor cooling apparatus
Patent number
5,084,966
Issue date
Feb 4, 1992
The Furukawa Electric Co., Ltd.
Takashi Murase
F28 - HEAT EXCHANGE IN GENERAL
Information
Patent Grant
Heat pipe type cooling apparatus for semiconductor
Patent number
4,982,274
Issue date
Jan 1, 1991
The Furukawa Electric Co., Ltd.
Takashi Murase
F28 - HEAT EXCHANGE IN GENERAL
Information
Patent Grant
Heat pipe heat sink for semiconductor devices
Patent number
4,675,783
Issue date
Jun 23, 1987
The Furukawa Electric Co., Ltd.
Takashi Murase
F28 - HEAT EXCHANGE IN GENERAL