Takashi MURAYAMA

Follow

Person

Kanagawa, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Substrate plating jig
- Patent number 9,865,493
- Issue date Jan 9, 2018
- JCU CORPORATION
- Junichiro Yoshioka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
PACKING FOR SUBSTRATE PLATING JIG AND SUBSTRATE PLATING JIG USING T...
- Publication number 20170096744
- Publication date Apr 6, 2017
- JCU CORPORATION
- Takashi MURAYAMA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SUBSTRATE PLATING DEVICE
- Publication number 20160138181
- Publication date May 19, 2016
- JCU CORPORATION
- Junichiro Yoshioka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SUBSTRATE PLATING JIG
- Publication number 20150294894
- Publication date Oct 15, 2015
- JCU CORPORATION
- Junichiro Yoshioka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SUBSTRATE PLATING JIG AND PLATING DEVICE USING SAME
- Publication number 20150068890
- Publication date Mar 12, 2015
- JCU CORPORATION
- Junichiro Yoshioka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SUBSTRATE ELECTROPLATING JIG
- Publication number 20140251798
- Publication date Sep 11, 2014
- JCU CORPORATION
- Junichiro Yoshioka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR