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Takashi NAKAMITSU
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Koshi City, JP
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last 30 patents
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Patent Grant
Bonding apparatus, bonding system, bonding method, and recording me...
Patent number
11,658,146
Issue date
May 23, 2023
Tokyo Electron Limited
Takashi Nakamitsu
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Bonding apparatus, bonding system, bonding method, and recording me...
Patent number
11,488,929
Issue date
Nov 1, 2022
Tokyo Electron Limited
Takashi Nakamitsu
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Bonding apparatus, bonding system, bonding method, and recording me...
Patent number
11,094,667
Issue date
Aug 17, 2021
Tokyo Electron Limited
Takashi Nakamitsu
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Bonding apparatus, bonding system, bonding method and storage medium
Patent number
10,985,132
Issue date
Apr 20, 2021
Tokyo Electron Limited
Yoshitaka Otsuka
B32 - LAYERED PRODUCTS
Information
Patent Grant
Bonding apparatus, bonding system, bonding method and storage medium
Patent number
10,756,046
Issue date
Aug 25, 2020
Tokyo Electron Limited
Yoshitaka Otsuka
B32 - LAYERED PRODUCTS
Information
Patent Grant
Bonding apparatus, bonding system, bonding method and storage medium
Patent number
10,438,920
Issue date
Oct 8, 2019
Tokyo Electron Limited
Yoshitaka Otsuka
B32 - LAYERED PRODUCTS
Patents Applications
last 30 patents
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Patent Application
BONDING APPARATUS, BONDING SYSTEM, BONDING METHOD, AND RECORDING ME...
Publication number
20230026661
Publication date
Jan 26, 2023
TOKYO ELECTRON LIMITED
Takashi Nakamitsu
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
BONDING APPARATUS, BONDING SYSTEM, BONDING METHOD, AND RECORDING ME...
Publication number
20210343678
Publication date
Nov 4, 2021
TOKYO ELECTRON LIMITED
Takashi Nakamitsu
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Bonding Apparatus, Bonding System, Bonding Method and Storage Medium
Publication number
20200343216
Publication date
Oct 29, 2020
TOKYO ELECTRON LIMITED
Yoshitaka OTSUKA
B32 - LAYERED PRODUCTS
Information
Patent Application
Bonding Apparatus, Bonding System, Bonding Method and Storage Medium
Publication number
20190385973
Publication date
Dec 19, 2019
TOKYO ELECTRON LIMITED
Yoshitaka OTSUKA
B32 - LAYERED PRODUCTS
Information
Patent Application
BONDING APPARATUS, BONDING SYSTEM, BONDING METHOD, AND RECORDING ME...
Publication number
20190312006
Publication date
Oct 10, 2019
TOKYO ELECTRON LIMITED
Takashi Nakamitsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDING APPARATUS, BONDING SYSTEM, BONDING METHOD, AND RECORDING ME...
Publication number
20190273063
Publication date
Sep 5, 2019
TOKYO ELECTRON LIMITED
Takashi Nakamitsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDING APPARATUS, BONDING SYSTEM, BONDING METHOD AND STORAGE MEDIUM
Publication number
20180158796
Publication date
Jun 7, 2018
TOKYO ELECTRON LIMITED
Yoshitaka OTSUKA
B32 - LAYERED PRODUCTS