Takashi NOGAWA

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Heat-dissipating structure and semiconductor module using same
- Patent number 10,177,069
- Issue date Jan 8, 2019
- Hitachi Ltd.
- Takashi Naito
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR MANUFACTURING THERMOELECTRIC CONVERSION MODULE
- Publication number 20220320413
- Publication date Oct 6, 2022
- Hitachi Metals, Ltd.
- Tomotake TOHEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT-DISSIPATING STRUCTURE AND SEMICONDUCTOR MODULE USING SAME
- Publication number 20170236768
- Publication date Aug 17, 2017
- Hitachi, Ltd
- Takashi NAITO
- C03 - GLASS MINERAL OR SLAG WOOL