Takashi Noma

Person

Ota, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Fan-out wafer level packaging of semiconductor devices
- Patent number 12,261,084
- Issue date Mar 25, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- George Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package stress balance structures and related methods
- Patent number 12,230,502
- Issue date Feb 18, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yusheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thinned semiconductor package and related methods
- Patent number 12,199,041
- Issue date Jan 14, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yusheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer and method of ball drop on thin wafer with edge...
- Patent number 12,154,877
- Issue date Nov 26, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device with backmetal and related methods
- Patent number 12,040,295
- Issue date Jul 16, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated passive device and fabrication method using a last throu...
- Patent number 11,735,497
- Issue date Aug 22, 2023
- Semiconductor Components Industries, LLC
- Takashi Noma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolation in a semiconductor device
- Patent number 11,728,424
- Issue date Aug 15, 2023
- Semiconductor Components Industries, LLC
- Takashi Noma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures for aligning a semiconductor wafer for singulation
- Patent number 11,676,863
- Issue date Jun 13, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thinned semiconductor package and related methods
- Patent number 11,646,267
- Issue date May 9, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yusheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside metal photolithographic patterning die singulation systems...
- Patent number 11,508,579
- Issue date Nov 22, 2022
- Semiconductor Components Industries, LLC
- Takashi Noma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package electrical contact structures and related met...
- Patent number 11,393,692
- Issue date Jul 19, 2022
- Semiconductor Components Industries, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate alignment systems and related methods
- Patent number 11,387,130
- Issue date Jul 12, 2022
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package electrical contacts and related methods
- Patent number 11,367,619
- Issue date Jun 21, 2022
- Semiconductor Components Industries, LLC
- Yusheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of aligning a semiconductor wafer for singulation
- Patent number 11,289,381
- Issue date Mar 29, 2022
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder bump formation using wafer with ring
- Patent number 11,264,264
- Issue date Mar 1, 2022
- Semiconductor Components Industries, LLC
- Takashi Noma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolation in a semiconductor device
- Patent number 11,257,759
- Issue date Feb 22, 2022
- Semiconductor Components Industries, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer and method of ball drop on thin wafer with edge...
- Patent number 11,164,835
- Issue date Nov 2, 2021
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device with backmetal and related methods
- Patent number 11,114,402
- Issue date Sep 7, 2021
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside wafer alignment methods
- Patent number 11,075,103
- Issue date Jul 27, 2021
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out wafer level packaging of semiconductor devices
- Patent number 11,043,420
- Issue date Jun 22, 2021
- Semiconductor Components Industries, LLC
- George Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer substrate and circuit module
- Patent number 11,032,904
- Issue date Jun 8, 2021
- Murata Manufacturing Co., Ltd.
- Hirokazu Yazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside metal photolithographic patterning die singulation systems...
- Patent number 10,896,819
- Issue date Jan 19, 2021
- Semiconductor Components Industries, LLC
- Takashi Noma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of aligning a semiconductor wafer for singulation
- Patent number 10,825,731
- Issue date Nov 3, 2020
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside wafer alignment methods
- Patent number 10,755,956
- Issue date Aug 25, 2020
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thinned semiconductor package and related methods
- Patent number 10,748,850
- Issue date Aug 18, 2020
- Semiconductor Components Industries, LLC
- Yusheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
ESD protection device and method for manufacturing the same
- Patent number 10,680,415
- Issue date Jun 9, 2020
- Murata Manufacturing Co., Ltd.
- Hiromitsu Hongo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor backmetal (BM) and over pad metallization (OPM) struc...
- Patent number 10,600,736
- Issue date Mar 24, 2020
- Semiconductor Components Industries, LLC
- Yusheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated passive device and fabrication method using a last throu...
- Patent number 10,535,585
- Issue date Jan 14, 2020
- Semiconductor Components Industries, LLC
- Takashi Noma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power supply module and mounting structure therefor
- Patent number 10,158,293
- Issue date Dec 18, 2018
- Murata Manufacturing Co., Ltd.
- Takashi Noma
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Coil antenna and communication terminal device
- Patent number 10,020,582
- Issue date Jul 10, 2018
- Murata Manufacturing Co., Ltd.
- Nobuhito Tsubaki
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR WAFER AND METHOD OF BALL DROP ON THIN WAFER WITH EDGE...
- Publication number 20250062263
- Publication date Feb 20, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. SEDDON
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTROLESS PLATING METHODS
- Publication number 20240404879
- Publication date Dec 5, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Takashi NOMA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MOLDED THIN SEMICONDUCTOR DIE PACKAGES AND RELATED METHODS
- Publication number 20240290736
- Publication date Aug 29, 2024
- Semiconductor Components Industries, LLC
- Shinzo ISHIBE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH STACKED CONDUCTIVE LAYERS AND RELATED MET...
- Publication number 20240128215
- Publication date Apr 18, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Takashi NOMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THINNED SEMICONDUCTOR PACKAGE AND RELATED METHODS
- Publication number 20230238327
- Publication date Jul 27, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yusheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE ELECTRICAL CONTACT STRUCTURES AND RELATED MET...
- Publication number 20220384204
- Publication date Dec 1, 2022
- Semiconductor Components Industries, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP SYSTEM-IN-PACKAGE
- Publication number 20220359360
- Publication date Nov 10, 2022
- Semiconductor Components Industries, LLC
- Yusheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE ALIGNMENT SYSTEMS AND RELATED METHODS
- Publication number 20220319894
- Publication date Oct 6, 2022
- Semiconductor Components Industries, LLC
- Michael J. SEDDON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT WAFER LEVEL PACKAGING OF SEMICONDUCTOR DEVICES
- Publication number 20220285267
- Publication date Sep 8, 2022
- Semiconductor Components Industries, LLC
- Takashi NOMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE ELECTRICAL CONTACTS AND RELATED METHODS
- Publication number 20220270884
- Publication date Aug 25, 2022
- Semiconductor Components Industries, LLC
- Yusheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER BUMP FORMATION USING WAFER WITH RING
- Publication number 20220181192
- Publication date Jun 9, 2022
- Semiconductor Components Industries, LLC
- Takashi NOMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATION IN A SEMICONDUCTOR DEVICE
- Publication number 20220131002
- Publication date Apr 28, 2022
- Semiconductor Components Industries, LLC
- Takashi NOMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT WAFER LEVEL PACKAGING OF SEMICONDUCTOR DEVICES
- Publication number 20210305096
- Publication date Sep 30, 2021
- Semiconductor Components Industries, LLC
- George CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH BACKMETAL AND RELATED METHODS
- Publication number 20210272920
- Publication date Sep 2, 2021
- Semiconductor Components Industries, LLC
- Michael J. SEDDON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FANOUT WAFER LEVEL PACKAGE FOR OPTICAL DEVICES AND RELATED METHODS
- Publication number 20210167112
- Publication date Jun 3, 2021
- Semiconductor Components Industries, LLC
- Yusheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE METAL PHOTOLITHOGRAPHIC PATTERNING DIE SINGULATION SYSTEMS...
- Publication number 20210118675
- Publication date Apr 22, 2021
- Semiconductor Components Industries, LLC
- Takashi NOMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRESS BALANCE STRUCTURES AND RELATED METHODS
- Publication number 20210035807
- Publication date Feb 4, 2021
- Semiconductor Components Industries, LLC
- Yusheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER BUMP FORMATION USING WAFER WITH RING
- Publication number 20210028051
- Publication date Jan 28, 2021
- Semiconductor Components Industries, LLC
- Takashi NOMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF ALIGNING A SEMICONDUCTOR WAFER FOR SINGULATION
- Publication number 20210028064
- Publication date Jan 28, 2021
- Semiconductor Components Industries, LLC
- Michael J. SEDDON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE ELECTRICAL CONTACT STRUCTURES AND RELATED MET...
- Publication number 20200395217
- Publication date Dec 17, 2020
- Semiconductor Components Industries, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE WAFER ALIGNMENT METHODS
- Publication number 20200365440
- Publication date Nov 19, 2020
- Semiconductor Components Industries, LLC
- Michael J. SEDDON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THINNED SEMICONDUCTOR PACKAGE AND RELATED METHODS
- Publication number 20200357751
- Publication date Nov 12, 2020
- Semiconductor Components Industries, LLC
- Yusheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE ELECTRICAL CONTACTS AND RELATED METHODS
- Publication number 20200258752
- Publication date Aug 13, 2020
- Semiconductor Components Industries, LLC
- Yusheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE ALIGNMENT SYSTEMS AND RELATED METHODS
- Publication number 20200243366
- Publication date Jul 30, 2020
- Semiconductor Components Industries, LLC
- Michael J. SEDDON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE METAL PHOTOLITHOGRAPHIC PATTERNING DIE SINGULATION SYSTEMS...
- Publication number 20200243329
- Publication date Jul 30, 2020
- Semiconductor Components Industries, LLC
- Takashi NOMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE WAFER ALIGNMENT METHODS
- Publication number 20200243367
- Publication date Jul 30, 2020
- Semiconductor Components Industries, LLC
- Michael J. SEDDON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF ALIGNING A SEMICONDUCTOR WAFER FOR SINGULATION
- Publication number 20200243392
- Publication date Jul 30, 2020
- Semiconductor Components Industries, LLC
- Michael J. SEDDON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED PASSIVE DEVICE AND FABRICATION METHOD USING A LAST THROU...
- Publication number 20200126894
- Publication date Apr 23, 2020
- Semiconductor Components Industries, LLC
- Takashi NOMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT WAFER LEVEL PACKAGING OF SEMICONDUCTOR DEVICES
- Publication number 20200105700
- Publication date Apr 2, 2020
- Semiconductor Components Industries, LLC
- George CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER SUBSTRATE AND CIRCUIT MODULE
- Publication number 20190297726
- Publication date Sep 26, 2019
- Murata Manufacturing Co., Ltd.
- Hirokazu YAZAKI
- H01 - BASIC ELECTRIC ELEMENTS

Takashi Noma

Person

Patents Grantslast 30 patents

Fan-out wafer level packaging of semiconductor devices

Semiconductor package stress balance structures and related methods

Thinned semiconductor package and related methods

Semiconductor wafer and method of ball drop on thin wafer with edge...

Semiconductor device with backmetal and related methods

Integrated passive device and fabrication method using a last throu...

Isolation in a semiconductor device

Structures for aligning a semiconductor wafer for singulation

Thinned semiconductor package and related methods

Backside metal photolithographic patterning die singulation systems...

Semiconductor package electrical contact structures and related met...

Substrate alignment systems and related methods

Semiconductor package electrical contacts and related methods

Methods of aligning a semiconductor wafer for singulation

Solder bump formation using wafer with ring

Isolation in a semiconductor device

Semiconductor wafer and method of ball drop on thin wafer with edge...

Semiconductor device with backmetal and related methods

Backside wafer alignment methods

Fan-out wafer level packaging of semiconductor devices

Interposer substrate and circuit module

Backside metal photolithographic patterning die singulation systems...

Methods of aligning a semiconductor wafer for singulation

Backside wafer alignment methods

Thinned semiconductor package and related methods

ESD protection device and method for manufacturing the same

Semiconductor backmetal (BM) and over pad metallization (OPM) struc...

Integrated passive device and fabrication method using a last throu...

Power supply module and mounting structure therefor

Coil antenna and communication terminal device

Patents Applicationslast 30 patents

SEMICONDUCTOR WAFER AND METHOD OF BALL DROP ON THIN WAFER WITH EDGE...

ELECTROLESS PLATING METHODS

MOLDED THIN SEMICONDUCTOR DIE PACKAGES AND RELATED METHODS

SEMICONDUCTOR DEVICE WITH STACKED CONDUCTIVE LAYERS AND RELATED MET...

THINNED SEMICONDUCTOR PACKAGE AND RELATED METHODS

SEMICONDUCTOR PACKAGE ELECTRICAL CONTACT STRUCTURES AND RELATED MET...

MULTI-CHIP SYSTEM-IN-PACKAGE

SUBSTRATE ALIGNMENT SYSTEMS AND RELATED METHODS

FAN-OUT WAFER LEVEL PACKAGING OF SEMICONDUCTOR DEVICES

SEMICONDUCTOR PACKAGE ELECTRICAL CONTACTS AND RELATED METHODS

SOLDER BUMP FORMATION USING WAFER WITH RING

ISOLATION IN A SEMICONDUCTOR DEVICE

FAN-OUT WAFER LEVEL PACKAGING OF SEMICONDUCTOR DEVICES

SEMICONDUCTOR DEVICE WITH BACKMETAL AND RELATED METHODS

FANOUT WAFER LEVEL PACKAGE FOR OPTICAL DEVICES AND RELATED METHODS

BACKSIDE METAL PHOTOLITHOGRAPHIC PATTERNING DIE SINGULATION SYSTEMS...

SEMICONDUCTOR PACKAGE STRESS BALANCE STRUCTURES AND RELATED METHODS

SOLDER BUMP FORMATION USING WAFER WITH RING

METHODS OF ALIGNING A SEMICONDUCTOR WAFER FOR SINGULATION

SEMICONDUCTOR PACKAGE ELECTRICAL CONTACT STRUCTURES AND RELATED MET...

BACKSIDE WAFER ALIGNMENT METHODS

THINNED SEMICONDUCTOR PACKAGE AND RELATED METHODS

SEMICONDUCTOR PACKAGE ELECTRICAL CONTACTS AND RELATED METHODS

SUBSTRATE ALIGNMENT SYSTEMS AND RELATED METHODS

BACKSIDE METAL PHOTOLITHOGRAPHIC PATTERNING DIE SINGULATION SYSTEMS...

BACKSIDE WAFER ALIGNMENT METHODS

METHODS OF ALIGNING A SEMICONDUCTOR WAFER FOR SINGULATION

INTEGRATED PASSIVE DEVICE AND FABRICATION METHOD USING A LAST THROU...

FAN-OUT WAFER LEVEL PACKAGING OF SEMICONDUCTOR DEVICES

INTERPOSER SUBSTRATE AND CIRCUIT MODULE