Takashi Oda

Person

Ibaraki-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Wireless power transmission system and sheet coil
- Patent number 11,171,514
- Issue date Nov 9, 2021
- Nitto Denko Corporation
- Taiki Sueyoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing semiconductor device with film for forming protective...
- Patent number 9,279,064
- Issue date Mar 8, 2016
- Nitto Denko Corporation
- Takashi Oda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Laminated film and use thereof
- Patent number 9,202,795
- Issue date Dec 1, 2015
- Nitto Denko Corporation
- Takashi Oda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
LED mounting substrate
- Patent number 8,985,818
- Issue date Mar 24, 2015
- Nitto Denko Corporation
- Daisuke Kitagawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing semiconductor device
- Patent number 8,906,746
- Issue date Dec 9, 2014
- Nitto Denko Corporation
- Takashi Oda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Acrylic adhesive composition, and pressure-sensitive adhesive sheet...
- Patent number 8,895,653
- Issue date Nov 25, 2014
- National Institute for Materials Science
- Takashi Oda
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Method for producing semiconductor device
- Patent number 8,580,619
- Issue date Nov 12, 2013
- Nitto Denko Corporation
- Takashi Oda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a printed circuit board
- Patent number 8,522,427
- Issue date Sep 3, 2013
- Nitto Denko Corporation
- Tadao Ookawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing semiconductor device having a bumped wafer...
- Patent number 8,518,745
- Issue date Aug 27, 2013
- Nitto Denko Corporation
- Takashi Oda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 8,420,510
- Issue date Apr 16, 2013
- Nitto Denko Corporation
- Takashi Oda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for semiconductor device
- Patent number 8,298,872
- Issue date Oct 30, 2012
- Nitto Denko Corporation
- Takashi Oda
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Wiring circuit structure and manufacturing method for semiconductor...
- Patent number 8,247,890
- Issue date Aug 21, 2012
- Nitto Denko Corporation
- Takashi Oda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device by lamination
- Patent number 8,183,093
- Issue date May 22, 2012
- Nitto Denko Corporation
- Naoko Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of transferring a wiring circuit layer on a me...
- Patent number 8,124,457
- Issue date Feb 28, 2012
- Nitto Denko Corporation
- Takashi Oda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing a wired circuit board
- Patent number 7,937,832
- Issue date May 10, 2011
- Nitto Denko Corporation
- Takashi Oda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Roughened printed circuit board
- Patent number 7,521,779
- Issue date Apr 21, 2009
- Nitto Denko Corporation
- Tadao Ookawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing printed circuit board
- Patent number 7,476,328
- Issue date Jan 13, 2009
- Nitto Denko Corporation
- Takashi Oda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wired circuit board
- Patent number 7,355,128
- Issue date Apr 8, 2008
- Nitto Denko Corporation
- Takashi Oda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wired circuit board
- Patent number 7,154,045
- Issue date Dec 26, 2006
- Nitto Denko Corporation
- Yasunari Ooyabu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Portable power source
- Patent number 5,314,762
- Issue date May 24, 1994
- Sanyo Electric Co., Ltd.
- Akira Hamada
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
OPTO-ELECTRIC HYBRID BOARD, OPTICAL COMMUNICATION MODULE USING SAME...
- Publication number 20230280554
- Publication date Sep 7, 2023
- NITTO DENKO CORPORATION
- Tadao Okawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
OPTO-ELECTRIC HYBRID BOARD
- Publication number 20230258893
- Publication date Aug 17, 2023
- NITTO DENKO CORPORATION
- Tadao Okawa
- G02 - OPTICS
Information Patent Application
OPTICAL COMMUNICATION MODULE SUBSTRATE
- Publication number 20230254973
- Publication date Aug 10, 2023
- NITTO DENKO CORPORATION
- Tadao Okawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BATTERY PACK, WIRELESS POWER TRANSMISSION SYSTEM, AND HEARING AID
- Publication number 20210135300
- Publication date May 6, 2021
- NITTO DENKO CORPORATION
- Taiki SUEYOSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRODE MATERIAL FOR SENSOR, ELECTRODE FOR SENSOR, SENSOR, AND BI...
- Publication number 20210055249
- Publication date Feb 25, 2021
- NITTO DENKO CORPORATION
- Takashi ODA
- B82 - NANO-TECHNOLOGY
Information Patent Application
WIRELESS POWER TRANSMISSION SYSTEM AND SHEET COIL
- Publication number 20200014246
- Publication date Jan 9, 2020
- NITTO DENKO CORPORATION
- Taiki SUEYOSHI
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
THERMALLY-DETACHABLE SHEET
- Publication number 20140249269
- Publication date Sep 4, 2014
- Daisuke Uenda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
- Publication number 20130288428
- Publication date Oct 31, 2013
- Takashi Oda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM FOR FORMING PROTECTIVE LAYER
- Publication number 20130217187
- Publication date Aug 22, 2013
- Nitto Denko Corporation
- Takashi Oda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20130157419
- Publication date Jun 20, 2013
- Nitto Denko Corporation
- Yusaku Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
- Publication number 20130078769
- Publication date Mar 28, 2013
- Nitto Denko Corporation
- Takashi Oda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
- Publication number 20130078770
- Publication date Mar 28, 2013
- Nitto Denko Corporation
- Takashi Oda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAMINATED FILM AND USE THEREOF
- Publication number 20120326280
- Publication date Dec 27, 2012
- Nitto Denko Corporation
- Takashi Oda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20120329250
- Publication date Dec 27, 2012
- Nitto Denko Corporation
- Takashi Oda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LED MOUNTING SUBSTRATE
- Publication number 20120230043
- Publication date Sep 13, 2012
- NITTO DENKO CORPORATION
- Daisuke Kitagawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
FILM FOR FORMING PROTECTIVE LAYER
- Publication number 20120208009
- Publication date Aug 16, 2012
- Nitto Denko Corporation
- Takashi Oda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20120208350
- Publication date Aug 16, 2012
- Nitto Denko Corporation
- Takashi Oda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULATING RESIN SHEET AND SEMICONDUCTOR DEVICE USING THE SAME,...
- Publication number 20120205820
- Publication date Aug 16, 2012
- Nitto Denko Corporation
- Takashi Oda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ACRYLIC ADHESIVE COMPOSITION, AND PRESSURE-SENSITIVE ADHESIVE SHEET...
- Publication number 20110190436
- Publication date Aug 4, 2011
- National Institute for Materials Science
- Takashi Oda
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20110143501
- Publication date Jun 16, 2011
- Nitto Denko Corporation
- Takashi ODA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
WIRING CIRCUIT STRUCTURE AND MANUFACTURING METHOD FOR SEMICONDUCTOR...
- Publication number 20110127657
- Publication date Jun 2, 2011
- Nitto Denko Corporation
- Takashi ODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOOKLET
- Publication number 20110101666
- Publication date May 5, 2011
- Tetsurou Tamaki
- B42 - BOOKBINDING ALBUMS FILES SPECIAL PRINTED MATTER
Information Patent Application
MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20100248428
- Publication date Sep 30, 2010
- Nitto Denko Corporation
- Naoko YOSHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICES
- Publication number 20100151629
- Publication date Jun 17, 2010
- Nitto Denko Corporation
- Takashi ODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pressure-Sensitive Adhesive Tape
- Publication number 20100092714
- Publication date Apr 15, 2010
- Nitto Denko Corporation
- Yuki Sugo
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD
- Publication number 20090280239
- Publication date Nov 12, 2009
- Nitto Denko Corporation
- Shigenori MORITA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Roughened Printed Circuit Board And Manufacturing Method Thereof
- Publication number 20090106975
- Publication date Apr 30, 2009
- Nitto Denko Corporation
- Tadao Ookawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wired circuit board
- Publication number 20080135280
- Publication date Jun 12, 2008
- Nitto Denko Corporation
- Takashi Oda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of manufacturing printed circuit board
- Publication number 20060157351
- Publication date Jul 20, 2006
- NITTO DENKO CORPORATION
- Takashi Oda
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Printed circuit board and manufacturing method thereof
- Publication number 20060113669
- Publication date Jun 1, 2006
- NITTO DENKO CORPORATION
- Tadao Ookawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Takashi Oda

Person

Patents Grantslast 30 patents

Wireless power transmission system and sheet coil

Manufacturing semiconductor device with film for forming protective...

Laminated film and use thereof

LED mounting substrate

Method for producing semiconductor device

Acrylic adhesive composition, and pressure-sensitive adhesive sheet...

Method for producing semiconductor device

Method of manufacturing a printed circuit board

Method of manufacturing semiconductor device having a bumped wafer...

Method of manufacturing semiconductor device

Manufacturing method for semiconductor device

Wiring circuit structure and manufacturing method for semiconductor...

Method of manufacturing a semiconductor device by lamination

Manufacturing method of transferring a wiring circuit layer on a me...

Method of producing a wired circuit board

Roughened printed circuit board

Method of manufacturing printed circuit board

Wired circuit board

Wired circuit board

Portable power source

Patents Applicationslast 30 patents

OPTO-ELECTRIC HYBRID BOARD, OPTICAL COMMUNICATION MODULE USING SAME...

OPTO-ELECTRIC HYBRID BOARD

OPTICAL COMMUNICATION MODULE SUBSTRATE

BATTERY PACK, WIRELESS POWER TRANSMISSION SYSTEM, AND HEARING AID

ELECTRODE MATERIAL FOR SENSOR, ELECTRODE FOR SENSOR, SENSOR, AND BI...

WIRELESS POWER TRANSMISSION SYSTEM AND SHEET COIL

THERMALLY-DETACHABLE SHEET

METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

FILM FOR FORMING PROTECTIVE LAYER

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

LAMINATED FILM AND USE THEREOF

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

LED MOUNTING SUBSTRATE

FILM FOR FORMING PROTECTIVE LAYER

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

ENCAPSULATING RESIN SHEET AND SEMICONDUCTOR DEVICE USING THE SAME,...

ACRYLIC ADHESIVE COMPOSITION, AND PRESSURE-SENSITIVE ADHESIVE SHEET...

MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE

WIRING CIRCUIT STRUCTURE AND MANUFACTURING METHOD FOR SEMICONDUCTOR...

BOOKLET

MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE

MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICES

Pressure-Sensitive Adhesive Tape

METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD

Roughened Printed Circuit Board And Manufacturing Method Thereof

Wired circuit board

Method of manufacturing printed circuit board

Printed circuit board and manufacturing method thereof