Takashi Ohsumi

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device comprising light-emitting element and light-re...
- Patent number 8,211,750
- Issue date Jul 3, 2012
- Oki Semiconductor Co., Ltd.
- Takashi Ohsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer, and semiconductor device formed therefrom
- Patent number 8,164,164
- Issue date Apr 24, 2012
- Oki Semiconductor Co., Ltd.
- Takashi Ohsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer, and semiconductor device formed therefrom
- Patent number 7,915,746
- Issue date Mar 29, 2011
- Oki Semiconductor Co., Ltd.
- Takashi Ohsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a frame portion and an opening portion...
- Patent number 7,667,315
- Issue date Feb 23, 2010
- Oki Semiconductor Co., Ltd.
- Takashi Ohsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing chip size package semiconductor device with...
- Patent number 7,528,005
- Issue date May 5, 2009
- Oki Semiconductor Co., Ltd.
- Yoshikazu Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having chip size package with improved strength
- Patent number 7,358,608
- Issue date Apr 15, 2008
- Oki Electric Industry Co., Ltd.
- Takashi Ohsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with connections for bump electrodes
- Patent number 7,180,185
- Issue date Feb 20, 2007
- Oki Electric Industry Co., Ltd.
- Takashi Ohsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus and method for fabricating the same
- Patent number 7,129,579
- Issue date Oct 31, 2006
- Oki Electric Industry Co., Ltd.
- Takashi Ohsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 7,045,908
- Issue date May 16, 2006
- Oki Electric Industry Co., Ltd.
- Takashi Ohsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a semiconductor apparatus including a sealin...
- Patent number 6,979,592
- Issue date Dec 27, 2005
- Oki Electric Industry Co., Ltd.
- Takashi Ohsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of dividing a semiconductor wafer
- Patent number 6,893,943
- Issue date May 17, 2005
- Oki Electric Industry Co., Ltd.
- Takashi Ohsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device fabrication method
- Patent number 6,852,617
- Issue date Feb 8, 2005
- Oki Electric Industry Co., Ltd.
- Yoshinori Shizuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 6,841,875
- Issue date Jan 11, 2005
- Oki Electric Industry Co., Ltd.
- Takashi Ohsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and the method for manufacturing the same
- Patent number 6,765,299
- Issue date Jul 20, 2004
- Oki Electric Industry Co., Ltd.
- Yoshikazu Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a semiconductor apparatus including a sealin...
- Patent number 6,713,319
- Issue date Mar 30, 2004
- Oki Electric Industry Co., Ltd.
- Takashi Ohsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer and method for manufacturing semiconductor devices
- Patent number 6,590,274
- Issue date Jul 8, 2003
- Oki Electric Industry Co., Ltd.
- Takashi Ohsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a dicing area of a semicondutor substrate
- Patent number 6,331,449
- Issue date Dec 18, 2001
- Oki Electric Industry Co., Ltd.
- Takashi Ohsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer and method for manufacturing semiconductor devices
- Patent number 6,303,470
- Issue date Oct 16, 2001
- Oki Electric Industry Co., Ltd.
- Takashi Ohsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus and method for fabricating the same
- Patent number 6,281,111
- Issue date Aug 28, 2001
- Oki Electric Industry Co., Ltd.
- Takashi Ohsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus having an insulating layer of varying heigh...
- Patent number 6,097,091
- Issue date Aug 1, 2000
- Oki Electric Industry Co., Ltd.
- Takashi Ohsumi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR WAFER, AND SEMICONDUCTOR DEVICE FORMED THEREFROM
- Publication number 20110006438
- Publication date Jan 13, 2011
- OKI SEMICONDUCTOR CO., LTD.
- Takashi Ohsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE COMPRISING LIGHT-EMITTING ELEMENT AND LIGHT-RE...
- Publication number 20090053856
- Publication date Feb 26, 2009
- Takashi Ohsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor wafer, and semiconductor device formed therefrom
- Publication number 20060267155
- Publication date Nov 30, 2006
- Takashi Ohsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20060214288
- Publication date Sep 28, 2006
- Takashi Ohsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device comprising light-emitting element and light-re...
- Publication number 20060065964
- Publication date Mar 30, 2006
- Takashi Ohsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor apparatus and method for fabricating the same
- Publication number 20050059200
- Publication date Mar 17, 2005
- Takashi Ohsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20050017356
- Publication date Jan 27, 2005
- Takashi Ohsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20050012210
- Publication date Jan 20, 2005
- Takashi Ohsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing chip size package semiconductor device with...
- Publication number 20040219717
- Publication date Nov 4, 2004
- Yoshikazu Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for manufacturing the same
- Publication number 20040201097
- Publication date Oct 14, 2004
- Takashi Ohsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device fabrication method
- Publication number 20040175914
- Publication date Sep 9, 2004
- Yoshinori Shizuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20040099950
- Publication date May 27, 2004
- Takashi Ohsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for fabricating a semiconductor apparatus including a sealin...
- Publication number 20040084767
- Publication date May 6, 2004
- Takashi Ohsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor wafer and method for manufacturing semiconductor devices
- Publication number 20030211709
- Publication date Nov 13, 2003
- Takashi Ohsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor apparatus and method for fabricating the same
- Publication number 20030168735
- Publication date Sep 11, 2003
- Takashi Ohsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor apparatus and method for fabricating the same
- Publication number 20010045664
- Publication date Nov 29, 2001
- Takashi Ohsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor wafer and method for manufacturing semiconductor devices
- Publication number 20010041425
- Publication date Nov 15, 2001
- Takashi Ohsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and the method for manufacturing the same
- Publication number 20010038151
- Publication date Nov 8, 2001
- Yoshikazu Takahashi
- H01 - BASIC ELECTRIC ELEMENTS

Takashi Ohsumi

Person

Patents Grantslast 30 patents

Semiconductor device comprising light-emitting element and light-re...

Semiconductor wafer, and semiconductor device formed therefrom

Semiconductor wafer, and semiconductor device formed therefrom

Semiconductor device having a frame portion and an opening portion...

Method of manufacturing chip size package semiconductor device with...

Semiconductor device having chip size package with improved strength

Semiconductor device with connections for bump electrodes

Semiconductor apparatus and method for fabricating the same

Semiconductor device and method for manufacturing the same

Method for fabricating a semiconductor apparatus including a sealin...

Method of dividing a semiconductor wafer

Semiconductor device fabrication method

Semiconductor device

Semiconductor device and the method for manufacturing the same

Method for fabricating a semiconductor apparatus including a sealin...

Semiconductor wafer and method for manufacturing semiconductor devices

Method of forming a dicing area of a semicondutor substrate

Semiconductor wafer and method for manufacturing semiconductor devices

Semiconductor apparatus and method for fabricating the same

Semiconductor apparatus having an insulating layer of varying heigh...

Patents Applicationslast 30 patents

SEMICONDUCTOR WAFER, AND SEMICONDUCTOR DEVICE FORMED THEREFROM

SEMICONDUCTOR DEVICE COMPRISING LIGHT-EMITTING ELEMENT AND LIGHT-RE...

Semiconductor wafer, and semiconductor device formed therefrom

Semiconductor device

Semiconductor device comprising light-emitting element and light-re...

Semiconductor apparatus and method for fabricating the same

Semiconductor device

Semiconductor device

Method of manufacturing chip size package semiconductor device with...

Semiconductor device and method for manufacturing the same

Semiconductor device fabrication method

Semiconductor device

Method for fabricating a semiconductor apparatus including a sealin...

Semiconductor wafer and method for manufacturing semiconductor devices

Semiconductor apparatus and method for fabricating the same

Semiconductor apparatus and method for fabricating the same

Semiconductor wafer and method for manufacturing semiconductor devices

Semiconductor device and the method for manufacturing the same