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Takashi Oobayashi
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Osaka, JP
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last 30 patents
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Patent Grant
Conductive paste for filling via-hole, double-sided and multilayer...
Patent number
6,139,777
Issue date
Oct 31, 2000
Matsushita Electric Industrial Co., Ltd.
Kazunori Omoya
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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Patent Grant
Semiconductor unit package, semiconductor unit packaging method, an...
Patent number
5,641,996
Issue date
Jun 24, 1997
Matsushita Electric Industrial Co., Ltd.
Kazunori Omoya
H01 - BASIC ELECTRIC ELEMENTS