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Takashi Saijo
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Kawanishi-shi, JP
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Patents Grants
last 30 patents
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Patent Grant
Wafer level package structure and production method therefor
Patent number
8,080,869
Issue date
Dec 20, 2011
Panasonic Electric Works Co., Ltd.
Takafumi Okudo
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Wafer level package structure, and sensor device obtained from the...
Patent number
8,067,769
Issue date
Nov 29, 2011
Panasonic Electric Works Co., Ltd.
Takafumi Okudo
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Sensor device and production method therefor
Patent number
8,026,594
Issue date
Sep 27, 2011
Panasonic Electric Works Co., Ltd.
Takafumi Okudo
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Sensor device and production method therefor
Patent number
7,674,638
Issue date
Mar 9, 2010
Panasonic Electric Works Co., Ltd.
Takafumi Okudo
B81 - MICRO-STRUCTURAL TECHNOLOGY
Patents Applications
last 30 patents
Information
Patent Application
WAFER LEVEL PACKAGE STRUCTURE, AND SENSOR DEVICE OBTAINED FROM THE...
Publication number
20090267165
Publication date
Oct 29, 2009
Takafumi Okudo
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
SENSOR DEVICE AND PRODUCTION METHOD THEREFOR
Publication number
20090236678
Publication date
Sep 24, 2009
Takafumi Okudo
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
WAFER LEVEL PACKAGE STRUCTURE AND PRODUCTION METHOD THEREFOR
Publication number
20090159997
Publication date
Jun 25, 2009
Takafumi Okudo
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
SENSOR DEVICE AND PRODUCTION METHOD THEREFOR
Publication number
20090152656
Publication date
Jun 18, 2009
Takafumi Okudo
B81 - MICRO-STRUCTURAL TECHNOLOGY