Takashi SAITO

Person

Nagano, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Manufacturing method of semiconductor device
- Patent number 12,062,552
- Issue date Aug 13, 2024
- Fuji Electric Co., Ltd.
- Yuma Murata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding apparatus
- Patent number 10,896,892
- Issue date Jan 19, 2021
- Fuji Electric Co., Ltd.
- Fumihiko Momose
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and semiconductor device manufacturing method
- Patent number 10,355,089
- Issue date Jul 16, 2019
- Fuji Electric Co., Ltd.
- Takashi Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,297,527
- Issue date May 21, 2019
- Fuji Electric Co., Ltd.
- Takashi Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,276,474
- Issue date Apr 30, 2019
- Fuji Electric Co., Ltd.
- Takashi Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 10,199,305
- Issue date Feb 5, 2019
- Fuji Electric Co., Ltd.
- Fumihiko Momose
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 10,098,254
- Issue date Oct 9, 2018
- Fuji Electric Co., Ltd.
- Takeshi Yokoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,978,701
- Issue date May 22, 2018
- Fuji Electric Co., Ltd.
- Takashi Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the semiconductor...
- Patent number 9,748,186
- Issue date Aug 29, 2017
- Fuji Electric Co., Ltd.
- Fumihiko Momose
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component and method of manufacturing electronic component
- Patent number 9,627,342
- Issue date Apr 18, 2017
- Fuji Electric Co., Ltd.
- Takashi Saito
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electronic component and manufacturing method for electronic component
- Patent number 9,355,987
- Issue date May 31, 2016
- Fuji Electric Co., Ltd.
- Takashi Saito
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
RESIN SEALING DEVICE, SEALING MOLD, AND RESIN SEALING METHOD
- Publication number 20250014920
- Publication date Jan 9, 2025
- Apic Yamada Corporation
- TAKASHI SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
- Publication number 20230142695
- Publication date May 11, 2023
- Fuji Electric Co., Ltd.
- Yuichiro HINATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ELEMENT BONDING PORTION AND SEMICONDUCTOR DEVICE
- Publication number 20220310548
- Publication date Sep 29, 2022
- Fuji Electric Co., Ltd.
- Masaaki TACHIOKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20220157623
- Publication date May 19, 2022
- Fuji Electric Co., Ltd.
- Yuma MURATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20180190570
- Publication date Jul 5, 2018
- Fuji Electric Co., Ltd.
- Fumihiko MOMOSE
- C21 - METALLURGY OF IRON
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20170367213
- Publication date Dec 21, 2017
- Fuji Electric Co., Ltd.
- Takeshi YOKOYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20170077009
- Publication date Mar 16, 2017
- Fuji Electric Co., Ltd.
- Takashi SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20160225688
- Publication date Aug 4, 2016
- Fuji Electric Co., Ltd.
- Takashi SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20160035683
- Publication date Feb 4, 2016
- Fuji Electric Co., Ltd.
- Takashi SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20150380368
- Publication date Dec 31, 2015
- Fuji Electric Co., Ltd.
- Fumihiko MOMOSE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20150372095
- Publication date Dec 24, 2015
- Fuji Electric Co., Ltd.
- Takashi SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20150303166
- Publication date Oct 22, 2015
- Fuji Electric Co., Ltd.
- Fumihiko MOMOSE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT AND MANUFACTURING METHOD FOR ELECTRONIC COMPONENT
- Publication number 20140374775
- Publication date Dec 25, 2014
- Takashi SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING ELECTRONIC COMPONENT
- Publication number 20140001636
- Publication date Jan 2, 2014
- Fuji Electric Co., Ltd.
- Takashi SAITO
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Takashi SAITO

Person

Patents Grantslast 30 patents

Manufacturing method of semiconductor device

Wire bonding apparatus

Semiconductor device and semiconductor device manufacturing method

Semiconductor device

Semiconductor device

Semiconductor device and method of manufacturing semiconductor device

Method of manufacturing semiconductor device

Semiconductor device

Semiconductor device and method for manufacturing the semiconductor...

Electronic component and method of manufacturing electronic component

Electronic component and manufacturing method for electronic component

Patents Applicationslast 30 patents

RESIN SEALING DEVICE, SEALING MOLD, AND RESIN SEALING METHOD

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR

SEMICONDUCTOR ELEMENT BONDING PORTION AND SEMICONDUCTOR DEVICE

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR...

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

SEMICONDUCTOR DEVICE

ELECTRONIC COMPONENT AND MANUFACTURING METHOD FOR ELECTRONIC COMPONENT

ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING ELECTRONIC COMPONENT