Takashi Sakaki

Person

Kanagawa, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing printed circuit board, printed circuit boa...
- Patent number 11,382,209
- Issue date Jul 5, 2022
- Canon Kabushiki Kaisha
- Mitsutoshi Hasegawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module, electronic device, manufacturing method for elec...
- Patent number 11,342,259
- Issue date May 24, 2022
- Canon Kabushiki Kaisha
- Shingo Ishiguri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image pickup module, method for manufacturing image pickup module,...
- Patent number 10,980,160
- Issue date Apr 13, 2021
- Canon Kabushiki Kaisha
- Mitsutoshi Hasegawa
- G02 - OPTICS
Information Patent Grant
Electronic module, electronic device, manufacturing method for elec...
- Patent number 10,861,785
- Issue date Dec 8, 2020
- Canon Kabushiki Kaisha
- Shingo Ishiguri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and electronic device
- Patent number 10,398,037
- Issue date Aug 27, 2019
- Canon Kabushiki Kaisha
- Kunihiko Minegishi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming conductive layer and semiconductor device
- Patent number 8,273,656
- Issue date Sep 25, 2012
- Canon Kabushiki Kaisha
- Takashi Sakaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming conductive layer and semiconductor device
- Patent number 8,173,542
- Issue date May 8, 2012
- Canon Kabushiki Kaisha
- Takashi Sakaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device for pressure bonding an integrated circuit to a printed circ...
- Patent number 6,978,534
- Issue date Dec 27, 2005
- Canon Kabushiki Kaisha
- Takashi Sakaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making an electrical connecting member
- Patent number 6,511,607
- Issue date Jan 28, 2003
- Canon Kabushiki Kaisha
- Takashi Sakaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical connections using deforming compression
- Patent number 6,015,081
- Issue date Jan 18, 2000
- Canon Kabushiki Kaisha
- Takahiro Okabayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit member and electric circuit device with the connecting member
- Patent number 5,967,804
- Issue date Oct 19, 1999
- Canon Kabushiki Kaisha
- Tetsuo Yoshizawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a developing agent bearing member
- Patent number 5,965,329
- Issue date Oct 12, 1999
- Canon Kabushiki Kaisha
- Takashi Sakaki
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Electrical connecting member
- Patent number 5,860,818
- Issue date Jan 19, 1999
- Canon Kabushiki Kaisha
- Takashi Sakaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming an electrical circuit member
- Patent number 5,819,406
- Issue date Oct 13, 1998
- Canon Kabushiki Kaisha
- Tetsuo Yoshizawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Probe method for measuring part to be measured by use thereof and e...
- Patent number 5,606,263
- Issue date Feb 25, 1997
- Canon Kabushiki Kaisha
- Tetsuo Yoshizawa
- G01 - MEASURING TESTING
Information Patent Grant
Method of manufacturing electrical connecting member
- Patent number 5,600,884
- Issue date Feb 11, 1997
- Canon Kabushiki Kaisha
- Hiroshi Kondo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for checking parts to be measured using a belt...
- Patent number 5,521,520
- Issue date May 28, 1996
- Canon Kabushiki Kaisha
- Tetsuo Yoshizawa
- G01 - MEASURING TESTING
Information Patent Grant
Process for preparing electrical connecting member
- Patent number 5,379,515
- Issue date Jan 10, 1995
- Canon Kabushiki Kaisha
- Hiroshi Kondo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical connecting member and method of manufacturing the same
- Patent number 5,323,535
- Issue date Jun 28, 1994
- Canon Kabushiki Kaisha
- Takashi Sakaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electric circuit apparatus
- Patent number 5,283,468
- Issue date Feb 1, 1994
- Canon Kabushiki Kaisha
- Hiroshi Kondo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing electrical connection members
- Patent number 5,216,807
- Issue date Jun 8, 1993
- Canon Kabushiki Kaisha
- Tetsuo Yoshizawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electric circuit device having an electric connecting member and el...
- Patent number 5,197,892
- Issue date Mar 30, 1993
- Canon Kabushiki Kaisha
- Tetsuo Yoshizawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for preparing electrical connecting member
- Patent number 5,145,552
- Issue date Sep 8, 1992
- Canon Kabushiki Kaisha
- Tetsuo Yoshizawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for preparing electrical connecting member
- Patent number 5,135,606
- Issue date Aug 4, 1992
- Canon Kabushiki Kaisha
- Tomoaki Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making electric circuit device
- Patent number 5,058,800
- Issue date Oct 22, 1991
- Canon Kabushiki Kaisha
- Tetsuo Yoshizawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing electrical connection members
- Patent number 4,926,549
- Issue date May 22, 1990
- Canon Kabushiki Kaisha
- Tetsuo Yoshizawa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC MODULE, ELECTRONIC DEVICE, MANUFACTURING METHOD FOR ELEC...
- Publication number 20210074626
- Publication date Mar 11, 2021
- Canon Kabushiki Kaisha
- Shingo Ishiguri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE PICKUP MODULE, METHOD FOR MANUFACTURING IMAGE PICKUP MODULE,...
- Publication number 20200100408
- Publication date Mar 26, 2020
- Canon Kabushiki Kaisha
- Mitsutoshi Hasegawa
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
ELECTRONIC MODULE, ELECTRONIC DEVICE, MANUFACTURING METHOD FOR ELEC...
- Publication number 20190385940
- Publication date Dec 19, 2019
- Canon Kabushiki Kaisha
- Shingo Ishiguri
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOA...
- Publication number 20190342991
- Publication date Nov 7, 2019
- Canon Kabushiki Kaisha
- Mitsutoshi Hasegawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOAR...
- Publication number 20180242462
- Publication date Aug 23, 2018
- Canon Kabushiki Kaisha
- Kunihiko Minegishi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF FORMING CONDUCTIVE LAYER AND SEMICONDUCTOR DEVICE
- Publication number 20120189781
- Publication date Jul 26, 2012
- Canon Kabushiki Kaisha
- Takashi Sakaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING CONDUCTIVE LAYER AND SEMICONDUCTOR DEVICE
- Publication number 20100164122
- Publication date Jul 1, 2010
- Canon Kabushiki Kaisha
- Takashi Sakaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device for pressure bonding an integrated circuit to a printed circ...
- Publication number 20030140484
- Publication date Jul 31, 2003
- Takashi Sakaki
- H01 - BASIC ELECTRIC ELEMENTS

Takashi Sakaki

Person

Patents Grantslast 30 patents

Method for manufacturing printed circuit board, printed circuit boa...

Electronic module, electronic device, manufacturing method for elec...

Image pickup module, method for manufacturing image pickup module,...

Electronic module, electronic device, manufacturing method for elec...

Printed circuit board and electronic device

Method of forming conductive layer and semiconductor device

Method of forming conductive layer and semiconductor device

Device for pressure bonding an integrated circuit to a printed circ...

Method of making an electrical connecting member

Electrical connections using deforming compression

Circuit member and electric circuit device with the connecting member

Method of manufacturing a developing agent bearing member

Electrical connecting member

Method for forming an electrical circuit member

Probe method for measuring part to be measured by use thereof and e...

Method of manufacturing electrical connecting member

Method and apparatus for checking parts to be measured using a belt...

Process for preparing electrical connecting member

Electrical connecting member and method of manufacturing the same

Electric circuit apparatus

Method of producing electrical connection members

Electric circuit device having an electric connecting member and el...

Process for preparing electrical connecting member

Process for preparing electrical connecting member

Method of making electric circuit device

Method of producing electrical connection members

Patents Applicationslast 30 patents

ELECTRONIC MODULE, ELECTRONIC DEVICE, MANUFACTURING METHOD FOR ELEC...

IMAGE PICKUP MODULE, METHOD FOR MANUFACTURING IMAGE PICKUP MODULE,...

ELECTRONIC MODULE, ELECTRONIC DEVICE, MANUFACTURING METHOD FOR ELEC...

METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOA...

METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOAR...

METHOD OF FORMING CONDUCTIVE LAYER AND SEMICONDUCTOR DEVICE

METHOD OF FORMING CONDUCTIVE LAYER AND SEMICONDUCTOR DEVICE

Device for pressure bonding an integrated circuit to a printed circ...