Takashi SAKUMA

Person

Nirasaki City, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Substrate processing method and substrate processing system
- Patent number 12,347,676
- Issue date Jul 1, 2025
- Tokyo Electron Limited
- Yuichiro Wagatsuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing method and substrate processing apparatus
- Patent number 11,993,841
- Issue date May 28, 2024
- Tokyo Electron Limited
- Masato Araki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method, device, and system for etching silicon oxide film
- Patent number 11,626,290
- Issue date Apr 11, 2023
- Tokyo Electron Limited
- Osamu Yokoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing method and recording medium
- Patent number 10,242,878
- Issue date Mar 26, 2019
- Tokyo Electron Limited
- Tomonari Urano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing Cu wiring
- Patent number 10,096,548
- Issue date Oct 9, 2018
- Tokyo Electron Limited
- Kenji Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Oxide film removing method, oxide film removing apparatus, contact...
- Patent number 9,984,892
- Issue date May 29, 2018
- Tokyo Electron Limited
- Takashi Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper wiring forming method, film forming system, and storage medium
- Patent number 9,425,093
- Issue date Aug 23, 2016
- Tokyo Electron Limited
- Tadahiro Ishizaka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Copper wiring forming method with Ru liner and Cu alloy fill
- Patent number 9,406,557
- Issue date Aug 2, 2016
- Tokyo Electron Limited
- Osamu Yokoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cu wiring fabrication method and storage medium
- Patent number 9,406,558
- Issue date Aug 2, 2016
- Tokyo Electron Limited
- Tadahiro Ishizaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming copper wiring
- Patent number 9,362,166
- Issue date Jun 7, 2016
- Tokyo Electron Limited
- Tadahiro Ishizaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma processing method and plasma processing apparatus
- Patent number 9,253,862
- Issue date Feb 2, 2016
- Tokyo Electron Limited
- Tatsuo Hirasawa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Sputtering method and sputtering apparatus
- Patent number 9,121,094
- Issue date Sep 1, 2015
- Tokyo Electron Limited
- Kaoru Maekawa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of forming copper wiring and method and system for forming c...
- Patent number 8,859,422
- Issue date Oct 14, 2014
- Tokyo Electron Limited
- Tadahiro Ishizaka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods of forming copper wiring and copper film, and film forming...
- Patent number 8,399,353
- Issue date Mar 19, 2013
- Tokyo Electron Limited
- Tadahiro Ishizaka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Film deposition method and film deposition apparatus of metal film
- Patent number 8,029,873
- Issue date Oct 4, 2011
- Tokyo Electron Limited
- Taro Ikeda
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Film forming method, plasma film forming apparatus and storage medium
- Patent number 8,026,176
- Issue date Sep 27, 2011
- Tokyo Electron Limited
- Takashi Sakuma
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and system for improving sidewall coverage in a deposition s...
- Patent number 7,935,393
- Issue date May 3, 2011
- Tokyo Electron Limited
- Shigeru Mizuno
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FILM FORMING APPARATUS AND FILM FORMING METHOD
- Publication number 20240337022
- Publication date Oct 10, 2024
- TOKYO ELECTRON LIMITED
- Kensaku NARUSHIMA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
- Publication number 20240290609
- Publication date Aug 29, 2024
- Tokyo Electron Limited
- Tadahiro ISHIZAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING SYSTEM
- Publication number 20230094053
- Publication date Mar 30, 2023
- TOKYO ELECTRON LIMITED
- Yuichiro WAGATSUMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD, DEVICE, AND SYSTEM FOR ETCHING SILICON OXIDE FILM
- Publication number 20220051901
- Publication date Feb 17, 2022
- TOKYO ELECTRON LIMITED
- Osamu YOKOYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD
- Publication number 20220020568
- Publication date Jan 20, 2022
- TOKYO ELECTRON LIMITED
- Takahiro SHINDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
- Publication number 20210054503
- Publication date Feb 25, 2021
- TOKYO ELECTRON LIMITED
- Masato ARAKI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
OXIDE FILM REMOVING METHOD, OXIDE FILM REMOVING APPARATUS, CONTACT...
- Publication number 20180261464
- Publication date Sep 13, 2018
- TOKYO ELECTRON LIMITED
- Takashi Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OXIDE FILM REMOVING METHOD, OXIDE FILM REMOVING APPARATUS, CONTACT...
- Publication number 20170338120
- Publication date Nov 23, 2017
- TOKYO ELECTRON LIMITED
- Takashi Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING METHOD AND RECORDING MEDIUM
- Publication number 20170250086
- Publication date Aug 31, 2017
- Tomonari URANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING Cu WIRING
- Publication number 20160276218
- Publication date Sep 22, 2016
- TOKYO ELECTRON LIMITED
- Kenji MATSUMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER WIRING FORMING METHOD, FILM FORMING SYSTEM, AND STORAGE MEDIUM
- Publication number 20160163591
- Publication date Jun 9, 2016
- TOKYO ELECTRON LIMITED
- Tadahiro ISHIZAKA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Cu Wiring Fabrication Method and Storage Medium
- Publication number 20150332961
- Publication date Nov 19, 2015
- TOKYO ELECTRON LIMITED
- Tadahiro ISHIZAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING COPPER WIRING
- Publication number 20150262872
- Publication date Sep 17, 2015
- TOKYO ELECTRON LIMITED
- Tadahiro ISHIZAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RUTHENIUM FILM FORMING METHOD, RUTHENIUM FILM FORMING APPARATUS, AN...
- Publication number 20150240344
- Publication date Aug 27, 2015
- TOKYO ELECTRON LIMITED
- Tadahiro ISHIZAKA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Copper Wiring Forming Method
- Publication number 20150004784
- Publication date Jan 1, 2015
- TOKYO ELECTRON LIMITED
- Osamu YOKOYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING COPPER WIRING AND METHOD AND SYSTEM FOR FORMING C...
- Publication number 20140287163
- Publication date Sep 25, 2014
- Tadahiro ISHIZAKA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS
- Publication number 20140090597
- Publication date Apr 3, 2014
- TOKYO ELECTRON LIMITED
- Tatsuo HIRASAWA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PLASMA PROCESSING APPARATUS AND CLEANING METHOD FOR REMOVING METAL...
- Publication number 20140060572
- Publication date Mar 6, 2014
- TOKYO ELECTRON LIMITED
- Chiaki YASUMURO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM FORMING METHOD AND FILM FORMING APPARATUS
- Publication number 20130237053
- Publication date Sep 12, 2013
- TOKYO ELECTRON LIMITED
- Tadahiro Ishizaka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
FILM FORMING METHOD, RESPUTTERING METHOD, AND FILM FORMING APPARATUS
- Publication number 20120247949
- Publication date Oct 4, 2012
- Takashi SAKUMA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF FORMING COPPER WIRING AND METHOD AND SYSTEM FOR FORMING C...
- Publication number 20120196052
- Publication date Aug 2, 2012
- TOKYO ELECTRON LIMITED
- Tadahiro ISHIZAKA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS OF FORMING COPPER WIRING AND COPPER FILM, AND FILM FORMING...
- Publication number 20120196437
- Publication date Aug 2, 2012
- TOKYO ELECTRON LIMITED
- Tadahiro ISHIZAKA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Film Forming Method, Plasma Film Forming Apparatus and Storage Medium
- Publication number 20100167540
- Publication date Jul 1, 2010
- Takashi Sakuma
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Film Deposition Method and Film Deposition Apparatus of Metal Film
- Publication number 20090227104
- Publication date Sep 10, 2009
- Taro Ikeda
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Seed Film Forming Method, Plasma-Assisted Film Forming System and S...
- Publication number 20090183984
- Publication date Jul 23, 2009
- Takashi Sakuma
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Film Deposition Method, Film Deposition Apparatus, and Storage Medium
- Publication number 20090087583
- Publication date Apr 2, 2009
- Takashi Sakuma
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD AND SYSTEM FOR IMPROVING SIDEWALL COVERAGE IN A DEPOSITION S...
- Publication number 20090041950
- Publication date Feb 12, 2009
- TOKYO ELECTRON LIMITED
- SHIGERU MIZUNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Sputtering method and sputtering apparatus
- Publication number 20080230375
- Publication date Sep 25, 2008
- TOKYO ELECTRON LIMITED
- Kaoru Maekawa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Takashi SAKUMA

Person

Patents Grantslast 30 patents

Substrate processing method and substrate processing system

Substrate processing method and substrate processing apparatus

Method, device, and system for etching silicon oxide film

Substrate processing method and recording medium

Method of manufacturing Cu wiring

Oxide film removing method, oxide film removing apparatus, contact...

Copper wiring forming method, film forming system, and storage medium

Copper wiring forming method with Ru liner and Cu alloy fill

Cu wiring fabrication method and storage medium

Method of forming copper wiring

Plasma processing method and plasma processing apparatus

Sputtering method and sputtering apparatus

Method of forming copper wiring and method and system for forming c...

Methods of forming copper wiring and copper film, and film forming...

Film deposition method and film deposition apparatus of metal film

Film forming method, plasma film forming apparatus and storage medium

Method and system for improving sidewall coverage in a deposition s...

Patents Applicationslast 30 patents

FILM FORMING APPARATUS AND FILM FORMING METHOD

SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS

SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING SYSTEM

METHOD, DEVICE, AND SYSTEM FOR ETCHING SILICON OXIDE FILM

PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD

SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS

OXIDE FILM REMOVING METHOD, OXIDE FILM REMOVING APPARATUS, CONTACT...

OXIDE FILM REMOVING METHOD, OXIDE FILM REMOVING APPARATUS, CONTACT...

SUBSTRATE PROCESSING METHOD AND RECORDING MEDIUM

METHOD OF MANUFACTURING Cu WIRING

COPPER WIRING FORMING METHOD, FILM FORMING SYSTEM, AND STORAGE MEDIUM

Cu Wiring Fabrication Method and Storage Medium

METHOD OF FORMING COPPER WIRING

RUTHENIUM FILM FORMING METHOD, RUTHENIUM FILM FORMING APPARATUS, AN...

Copper Wiring Forming Method

METHOD OF FORMING COPPER WIRING AND METHOD AND SYSTEM FOR FORMING C...

PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS

PLASMA PROCESSING APPARATUS AND CLEANING METHOD FOR REMOVING METAL...

FILM FORMING METHOD AND FILM FORMING APPARATUS

FILM FORMING METHOD, RESPUTTERING METHOD, AND FILM FORMING APPARATUS

METHOD OF FORMING COPPER WIRING AND METHOD AND SYSTEM FOR FORMING C...

METHODS OF FORMING COPPER WIRING AND COPPER FILM, AND FILM FORMING...

Film Forming Method, Plasma Film Forming Apparatus and Storage Medium

Film Deposition Method and Film Deposition Apparatus of Metal Film

Seed Film Forming Method, Plasma-Assisted Film Forming System and S...

Film Deposition Method, Film Deposition Apparatus, and Storage Medium

METHOD AND SYSTEM FOR IMPROVING SIDEWALL COVERAGE IN A DEPOSITION S...

Sputtering method and sputtering apparatus