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Takashi Sampei
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Tokyo, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Laser machining apparatus
Patent number
10,532,430
Issue date
Jan 14, 2020
Disco Corporation
Takashi Sampei
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Laser processing apparatus and laser processing method
Patent number
10,406,631
Issue date
Sep 10, 2019
Disco Corporation
Takashi Sampei
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Laser processing apparatus
Patent number
9,724,783
Issue date
Aug 8, 2017
Disco Corporation
Wataru Odagiri
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of dividing plate-shaped workpieces
Patent number
9,685,378
Issue date
Jun 20, 2017
Disco Corporation
Toshiyuki Yoshikawa
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method for applying resin film to face of semiconductor wafer
Patent number
7,799,700
Issue date
Sep 21, 2010
Disco Corporation
Kentaro Iizuka
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Patents Applications
last 30 patents
Information
Patent Application
LASER PROCESSING APPARATUS AND LASER PROCESSING METHOD
Publication number
20180339365
Publication date
Nov 29, 2018
Disco Corporation
Takashi Sampei
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHOD OF DIVIDING PLATE-SHAPED WORKPIECES
Publication number
20170076985
Publication date
Mar 16, 2017
Disco Corporation
Toshiyuki Yoshikawa
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
LASER MACHINING APPARATUS
Publication number
20160207145
Publication date
Jul 21, 2016
Disco Corporation
Takashi Sampei
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
LASER PROCESSING APPARATUS
Publication number
20160151857
Publication date
Jun 2, 2016
Disco Corporation
Wataru Odagiri
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Method for applying resin film to face of semiconductor wafer
Publication number
20070054498
Publication date
Mar 8, 2007
DISCO CORPORATION
Kentaro Iizuka
H01 - BASIC ELECTRIC ELEMENTS