Takashi Sato

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Hamamatsu, JP

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor element and wafer level chip size package therefor
- Patent number 7,830,011
- Issue date Nov 9, 2010
- Yamaha Corporation
- Kentaro Nomoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and lead frame therefor
- Patent number 7,397,112
- Issue date Jul 8, 2008
- Yamaha Corporation
- Takashi Sato
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ILLUMINATION SWITCH DEVICE
- Publication number 20100038224
- Publication date Feb 18, 2010
- Takashi Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
- Publication number 20080241999
- Publication date Oct 2, 2008
- Yamaha Corporation
- Takashi Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package and lead frame therefor
- Publication number 20060138615
- Publication date Jun 29, 2006
- Yamaha Corporation
- Takashi Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method therefor
- Publication number 20050280129
- Publication date Dec 22, 2005
- Yamaha Corporation
- Takashi Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor element and wafer level chip size package therefor
- Publication number 20050199995
- Publication date Sep 15, 2005
- Kentaro Nomoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method therefor
- Publication number 20030129836
- Publication date Jul 10, 2003
- Takashi Sato
- H01 - BASIC ELECTRIC ELEMENTS