Takashi Shuto

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Kawasaki, JP

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Patents Grantslast 30 patents

Information Patent Grant
Wiring board manufacturing method
- Patent number 7,935,891
- Issue date May 3, 2011
- Fujitsu Limited
- Takashi Shuto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board manufacturing method
- Patent number 7,377,030
- Issue date May 27, 2008
- Fujitsu Limited
- Takashi Shuto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing circuit board
- Patent number 7,152,314
- Issue date Dec 26, 2006
- Fujitsu Limited
- Takashi Shuto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer wiring board
- Patent number 7,002,080
- Issue date Feb 21, 2006
- Fujitsu Limited
- Motoaki Tani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Wiring board manufacturing method
- Publication number 20080142256
- Publication date Jun 19, 2008
- FUJITSU LIMITED
- Takashi Shuto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wiring board manufacturing method
- Publication number 20060112544
- Publication date Jun 1, 2006
- FUJITSU LIMITED
- Takashi Shuto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of manufacturing circuit board
- Publication number 20040211751
- Publication date Oct 28, 2004
- Takashi Shuto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayer wiring board
- Publication number 20040040738
- Publication date Mar 4, 2004
- FUJITSU LIMITED
- Motoaki Tani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR