Takashi SUGINO

Person

Kawaguchi-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Electrically peelable adhesive composition and electrically peelabl...
- Patent number 10,604,684
- Issue date Mar 31, 2020
- Lintec Corporation
- Haruya Yamada
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Anti-fouling composition, and anti-fouling sheet
- Patent number 10,273,382
- Issue date Apr 30, 2019
- Lintec Corporation
- Maki Hironaga
- B32 - LAYERED PRODUCTS
Information Patent Grant
Antifouling sheet and method for producing same
- Patent number 9,873,801
- Issue date Jan 23, 2018
- Lintec Corporation
- Maki Hironaga
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Sheet to form a protective film for chips
- Patent number 7,408,259
- Issue date Aug 5, 2008
- Lintec Corporation
- Hideo Senoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for producing semiconductor chips having a protective film...
- Patent number 7,235,465
- Issue date Jun 26, 2007
- Lintec Corporation
- Hideo Senoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive tape
- Patent number 7,135,224
- Issue date Nov 14, 2006
- Lintec Corporation
- Takaji Sumi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Process for producing semiconductor chips
- Patent number 6,919,262
- Issue date Jul 19, 2005
- Lintec Corporation
- Hideo Senoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for producing semiconductor device
- Patent number 6,656,819
- Issue date Dec 2, 2003
- Lintec Corporation
- Takashi Sugino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for producing semiconductor device
- Patent number 6,558,975
- Issue date May 6, 2003
- Lintec Corporation
- Takashi Sugino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive composition and adhesive sheet
- Patent number 6,277,481
- Issue date Aug 21, 2001
- Lintec Corporation
- Takashi Sugino
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Adhesive sheet for wafer setting and process for producing electron...
- Patent number 6,042,922
- Issue date Mar 28, 2000
- Lintec Corporation
- Hideo Senoo
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Patents Applicationslast 30 patents

Information Patent Application
SEALING SHEET AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
- Publication number 20200006167
- Publication date Jan 2, 2020
- LINTEC CORPORATION
- Yusuke NEZU
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ADHESIVE AGENT COMPOSITION AND ADHESIVE SHEET
- Publication number 20180244963
- Publication date Aug 30, 2018
- LINTEC CORPORATION
- Ken TAKANO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ANTI-FOULING COMPOSITION, AND ANTI-FOULING SHEET
- Publication number 20170369738
- Publication date Dec 28, 2017
- Lintec Corporation
- Maki HIRONAGA
- B32 - LAYERED PRODUCTS
Information Patent Application
ANTIFOULING SHEET
- Publication number 20170107381
- Publication date Apr 20, 2017
- Lintec Corporation
- Maki HIRONAGA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ANTIFOULING SHEET AND METHOD FOR PRODUCING SAME
- Publication number 20170101543
- Publication date Apr 13, 2017
- Lintec Corporation
- Maki HIRONAGA
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
ELECTRICALLY PEELABLE ADHESIVE COMPOSITION AND ELECTRICALLY PEELABL...
- Publication number 20160009960
- Publication date Jan 14, 2016
- Lintec Corporation
- Haruya YAMADA
- B32 - LAYERED PRODUCTS
Information Patent Application
ELECTRICALLY PEELABLE ADHESIVE COMPOSITION AND ELECTRICALLY PEELABL...
- Publication number 20160009961
- Publication date Jan 14, 2016
- Lintec Corporation
- Haruya YAMADA
- B32 - LAYERED PRODUCTS
Information Patent Application
Sheet to Form a Protective Shield for Chips
- Publication number 20080260982
- Publication date Oct 23, 2008
- LINTEC CORPORATION
- Hideo Senoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process for producing semiconductor chips having a protective film...
- Publication number 20050186762
- Publication date Aug 25, 2005
- LINTEC CORPORATION
- Hideo Senoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Sheet to form a protective film for chips
- Publication number 20050184402
- Publication date Aug 25, 2005
- LINTEC CORPORATION
- Hideo Senoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Adhesive tape
- Publication number 20040232563
- Publication date Nov 25, 2004
- Takaji Sumi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Sheet to form a protective film for chips and process for producing...
- Publication number 20020137309
- Publication date Sep 26, 2002
- LINTEC CORPORATION
- Hideo Senoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process for producing semiconductor device
- Publication number 20020055238
- Publication date May 9, 2002
- LINTEC CORPORATION
- Takashi Sugino
- H01 - BASIC ELECTRIC ELEMENTS

Takashi SUGINO

Person

Patents Grantslast 30 patents

Electrically peelable adhesive composition and electrically peelabl...

Anti-fouling composition, and anti-fouling sheet

Antifouling sheet and method for producing same

Sheet to form a protective film for chips

Process for producing semiconductor chips having a protective film...

Adhesive tape

Process for producing semiconductor chips

Process for producing semiconductor device

Process for producing semiconductor device

Adhesive composition and adhesive sheet

Adhesive sheet for wafer setting and process for producing electron...

Patents Applicationslast 30 patents

SEALING SHEET AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

ADHESIVE AGENT COMPOSITION AND ADHESIVE SHEET

ANTI-FOULING COMPOSITION, AND ANTI-FOULING SHEET

ANTIFOULING SHEET

ANTIFOULING SHEET AND METHOD FOR PRODUCING SAME

ELECTRICALLY PEELABLE ADHESIVE COMPOSITION AND ELECTRICALLY PEELABL...

ELECTRICALLY PEELABLE ADHESIVE COMPOSITION AND ELECTRICALLY PEELABL...

Sheet to Form a Protective Shield for Chips

Process for producing semiconductor chips having a protective film...

Sheet to form a protective film for chips

Adhesive tape

Sheet to form a protective film for chips and process for producing...

Process for producing semiconductor device