Takashi Suzumura

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Hitachi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method for sticking an insulating film to a lead frame
- Patent number RE37323
- Issue date Aug 14, 2001
- Hitachi Cable Ltd.
- Toshio Kawamura
- 156 - Adhesive bonding and miscellaneous chemical manufacture
Information Patent Grant
Method of applying adhesive to lead of lead frame and method of mak...
- Patent number 5,846,851
- Issue date Dec 8, 1998
- Hitachi Cable, Ltd.
- Toshi Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for sticking an insulating film to a lead frame
- Patent number 5,635,009
- Issue date Jun 3, 1997
- Hitachi Cable Ltd.
- Toshio Kawamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite superconductors
- Patent number 4,371,741
- Issue date Feb 1, 1983
- Japan Atomic Energy Research Institute
- Toshinari Ando
- H01 - BASIC ELECTRIC ELEMENTS