Takashi Takahama

Person

Hyogo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Composition of phenolic resin-modified epoxy resin and straight cha...
- Patent number 5,661,223
- Issue date Aug 26, 1997
- Mitsubishi Denki Kabushiki Kaisha
- Seiji Oka
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Epoxy resin composition, epoxy resin cured material, and laminated...
- Patent number 5,278,259
- Issue date Jan 11, 1994
- Mitsubishi Denki Kabushiki Kaisha
- Michio Futakuchi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Composition of polyepoxy compounds, linear polymer and aromatic dia...
- Patent number 5,091,481
- Issue date Feb 25, 1992
- Mitsubishi Denki Kabushiki Kaisha
- Hiroyuki Nakajima
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Printed circuit board with busbar interconnections
- Patent number 5,065,283
- Issue date Nov 12, 1991
- Mitsubishi Denki Kabushiki Kaisha
- Einosuke Adachi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing a semiconductor device having a light transpare...
- Patent number 4,812,420
- Issue date Mar 14, 1989
- Mitsubishi Denki Kabushiki Kaisha
- Sadamu Matsuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of resin encapsulating a semiconductor device
- Patent number 4,769,344
- Issue date Sep 6, 1988
- Mitsubishi Denki Kabushiki Kaisha
- Kunito Sakai
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device
- Patent number 4,717,948
- Issue date Jan 5, 1988
- Mitsubishi Denki Kabushiki Kaisha
- Kunito Sakai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method therefor
- Patent number 4,697,203
- Issue date Sep 29, 1987
- Mitsubishi Denki Kabushiki Kaisha
- Kunito Sakai
- G11 - INFORMATION STORAGE

Takashi Takahama

Person

Patents Grantslast 30 patents

Composition of phenolic resin-modified epoxy resin and straight cha...

Epoxy resin composition, epoxy resin cured material, and laminated...

Composition of polyepoxy compounds, linear polymer and aromatic dia...

Printed circuit board with busbar interconnections

Method of producing a semiconductor device having a light transpare...

Method of resin encapsulating a semiconductor device

Semiconductor device

Semiconductor device and manufacturing method therefor