Takashi Tanaka

Person

Nirasaki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Substrate liquid processing apparatus, substrate liquid processing...
- Patent number 11,795,546
- Issue date Oct 24, 2023
- Tokyo Electron Limited
- Takashi Tanaka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plating method and recording medium
- Patent number 11,519,074
- Issue date Dec 6, 2022
- Tokyo Electron Limited
- Kazutoshi Iwai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plating method, plating apparatus and recording medium
- Patent number 11,230,767
- Issue date Jan 25, 2022
- Tokyo Electron Limited
- Yuichiro Inatomi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for manufacturing a contact pad, method for manufacturing a...
- Patent number 11,171,050
- Issue date Nov 9, 2021
- Tokyo Electron Limited
- Koichi Yatsuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plating method, plating apparatus and recording medium
- Patent number 11,028,483
- Issue date Jun 8, 2021
- Tokyo Electron Limited
- Yuichiro Inatomi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Forming method of hard mask
- Patent number 11,004,684
- Issue date May 11, 2021
- Tokyo Electron Limited
- Mitsuaki Iwashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plating method, plating apparatus and recording medium
- Patent number 10,784,111
- Issue date Sep 22, 2020
- Tokyo Electron Limited
- Yuichiro Inatomi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plating apparatus, plating method, and recording medium
- Patent number 10,731,256
- Issue date Aug 4, 2020
- Tokyo Electron Limited
- Kazutoshi Iwai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Adhesion layer forming method, adhesion layer forming system and re...
- Patent number 10,354,915
- Issue date Jul 16, 2019
- Tokyo Electron Limited
- Tomohisa Hoshino
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Forming method of hard mask, forming apparatus of hard mask and rec...
- Patent number 10,224,202
- Issue date Mar 5, 2019
- Tokyo Electron Limited
- Mitsuaki Iwashita
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plating method and recording medium
- Patent number 10,224,208
- Issue date Mar 5, 2019
- Tokyo Electron Limited
- Nobutaka Mizutani
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plating method, plated component, and plating system
- Patent number 10,179,950
- Issue date Jan 15, 2019
- Tokyo Electron Limited
- Yuichiro Inatomi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plating method, plating apparatus, and storage medium
- Patent number 10,138,556
- Issue date Nov 27, 2018
- Tokyo Electron Limited
- Nobutaka Mizutani
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plating method, plating system and storage medium
- Patent number 10,030,308
- Issue date Jul 24, 2018
- Tokyo Electron Limited
- Takashi Tanaka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Catalyst layer forming method, catalyst layer forming system and re...
- Patent number 9,966,306
- Issue date May 8, 2018
- Tokyo Electron Limited
- Yuichiro Inatomi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plating method, plating apparatus, and storage medium
- Patent number 9,922,835
- Issue date Mar 20, 2018
- Tokyo Electron Limited
- Yuichiro Inatomi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plating method, plating system and storage medium
- Patent number 9,837,308
- Issue date Dec 5, 2017
- Tokyo Electron Limited
- Nobutaka Mizutani
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plating apparatus, plating method and storage medium
- Patent number 9,777,379
- Issue date Oct 3, 2017
- Tokyo Electron Limited
- Yuichiro Inatomi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Catalyst layer forming method, catalyst layer forming system, and r...
- Patent number 9,761,485
- Issue date Sep 12, 2017
- Tokyo Electron Limited
- Yuichiro Inatomi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plating apparatus, plating method and storage medium having plating...
- Patent number 9,731,322
- Issue date Aug 15, 2017
- Tokyo Electron Limited
- Takashi Tanaka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plating method, plating apparatus and storage medium
- Patent number 9,725,810
- Issue date Aug 8, 2017
- Tokyo Electron Limited
- Nobutaka Mizutani
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plating method, recording medium and plating system
- Patent number 9,711,363
- Issue date Jul 18, 2017
- Tokyo Electron Limited
- Nobutaka Mizutani
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Metal wiring layer forming method, metal wiring layer forming appar...
- Patent number 9,653,354
- Issue date May 16, 2017
- Tokyo Electron Limited
- Takashi Tanaka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Pre-treatment method for plating and storage medium
- Patent number 9,653,350
- Issue date May 16, 2017
- Tokyo Electron Limited
- Takashi Tanaka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plating apparatus, plating method, and storage medium
- Patent number 9,552,994
- Issue date Jan 24, 2017
- Tokyo Electron Limited
- Yuichiro Inatomi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Pre-treatment method for plating and storage medium
- Patent number 9,523,153
- Issue date Dec 20, 2016
- Tokyo Electron Limited
- Takashi Tanaka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plating apparatus, plating method and storage medium
- Patent number 9,505,019
- Issue date Nov 29, 2016
- Toyko Electron Limited
- Yuichiro Inatomi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plating apparatus, plating method and storage medium
- Patent number 9,487,865
- Issue date Nov 8, 2016
- Tokyo Electron Limited
- Yuichiro Inatomi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plating apparatus, plating method and storage medium
- Patent number 9,421,569
- Issue date Aug 23, 2016
- Tokyo Electron Limited
- Takashi Tanaka
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Apparatus for plating process
- Patent number 9,255,331
- Issue date Feb 9, 2016
- Tokyo Electron Limited
- Takashi Tanaka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE LIQUID PROCESSING METHOD, AND RECORDING MEDIUM
- Publication number 20240213090
- Publication date Jun 27, 2024
- TOKYO ELECTRON LIMITED
- Keiichi Fujita
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MULTILAYER WIRING FORMING METHOD AND RECORDING MEDIUM
- Publication number 20210358767
- Publication date Nov 18, 2021
- TOKYO ELECTRON LIMITED
- Takashi Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE LIQUID PROCESSING APPARATUS, SUBSTRATE LIQUID PROCESSING...
- Publication number 20210002770
- Publication date Jan 7, 2021
- TOKYO ELECTRON LIMITED
- Takashi Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLATING METHOD AND RECORDING MEDIUM
- Publication number 20200325581
- Publication date Oct 15, 2020
- TOKYO ELECTRON LIMITED
- Kazutoshi Iwai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR MANUFACTURING A CONTACT PAD, METHOD FOR MANUFACTURING A...
- Publication number 20200035553
- Publication date Jan 30, 2020
- TOKYO ELECTRON LIMITED
- Koichi YATSUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLATING METHOD, PLATING APPARATUS AND RECORDING MEDIUM
- Publication number 20190271084
- Publication date Sep 5, 2019
- TOKYO ELECTRON LIMITED
- Yuichiro Inatomi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PLATING METHOD, PLATING APPARATUS AND RECORDING MEDIUM
- Publication number 20190267242
- Publication date Aug 29, 2019
- TOKYO ELECTRON LIMITED
- Yuichiro Inatomi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PLATING METHOD, PLATING APPARATUS AND RECORDING MEDIUM
- Publication number 20190256980
- Publication date Aug 22, 2019
- TOKYO ELECTRON LIMITED
- Yuichiro Inatomi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
FORMING METHOD OF HARD MASK
- Publication number 20190157083
- Publication date May 23, 2019
- TOKYO ELECTRON LIMITED
- Mitsuaki Iwashita
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PLATING APPARATUS, PLATING METHOD, AND RECORDING MEDIUM
- Publication number 20170292192
- Publication date Oct 12, 2017
- TOKYO ELECTRON LIMITED
- Kazutoshi Iwai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
FORMING METHOD OF HARD MASK, FORMING APPARATUS OF HARD MASK AND REC...
- Publication number 20170287713
- Publication date Oct 5, 2017
- TOKYO ELECTRON LIMITED
- Mitsuaki Iwashita
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD AND REC...
- Publication number 20170084480
- Publication date Mar 23, 2017
- TOKYO ELECTRON LIMITED
- Nobutaka Mizutani
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PLATING METHOD, PLATED COMPONENT, AND PLATING SYSTEM
- Publication number 20160372367
- Publication date Dec 22, 2016
- TOKYO ELECTRON LIMITED
- Yuichiro Inatomi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PLATING METHOD AND RECORDING MEDIUM
- Publication number 20160336179
- Publication date Nov 17, 2016
- TOKYO ELECTRON LIMITED
- Nobutaka Mizutani
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING METHOD, RECORDING MEDIUM AND PLATING SYSTEM
- Publication number 20160307759
- Publication date Oct 20, 2016
- TOKYO ELECTRON LIMITED
- Nobutaka Mizutani
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ADHESION LAYER FORMING METHOD, ADHESION LAYER FORMING SYSTEM AND RE...
- Publication number 20160284592
- Publication date Sep 29, 2016
- TOKYO ELECTRON LIMITED
- Tomohisa Hoshino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, PLATING METHOD, PLATING SYSTEM AND RECORDING...
- Publication number 20160247765
- Publication date Aug 25, 2016
- TOKYO ELECTRON LIMITED
- Yuichiro Inatomi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CATALYST LAYER FORMING METHOD, CATALYST LAYER FORMING SYSTEM AND RE...
- Publication number 20160247683
- Publication date Aug 25, 2016
- TOKYO ELECTRON LIMITED
- Yuichiro Inatomi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METAL WIRING LAYER FORMING METHOD, METAL WIRING LAYER FORMING APPAR...
- Publication number 20160240436
- Publication date Aug 18, 2016
- TOKYO ELECTRON LIMITED
- Takashi Tanaka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
WIRING LAYER FORMING METHOD, WIRING LAYER FORMING SYSTEM AND RECORD...
- Publication number 20160190040
- Publication date Jun 30, 2016
- TOKYO ELECTRON LIMITED
- Mitsuaki Iwashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLATING METHOD, PLATING APPARATUS, AND STORAGE MEDIUM
- Publication number 20160053378
- Publication date Feb 25, 2016
- TOKYO ELECTRON LIMITED
- Yuichiro Inatomi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PRE-TREATMENT METHOD OF PLATING, PLATING SYSTEM, AND RECORDING MEDIUM
- Publication number 20160013101
- Publication date Jan 14, 2016
- TOKYO ELECTRON LIMITED
- Yuichiro Inatomi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CATALYST LAYER FORMING METHOD, CATALYST LAYER FORMING SYSTEM, AND R...
- Publication number 20160013102
- Publication date Jan 14, 2016
- TOKYO ELECTRON LIMITED
- Yuichiro Inatomi
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
CATALYST ADSORPTION METHOD AND CATALYST ADSORPTION DEVICE
- Publication number 20150303103
- Publication date Oct 22, 2015
- TOKYO ELECTRON LIMITED
- Shoso Shinguhara
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PLATING APPARATUS, PLATING METHOD AND STORAGE MEDIUM
- Publication number 20150232994
- Publication date Aug 20, 2015
- TOKYO ELECTRON LIMITED
- Yuichiro Inatomi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ELECTROLESS PLATING METHOD, ELECTROLESS PLATING APPARATUS AND STORA...
- Publication number 20150218702
- Publication date Aug 6, 2015
- TOKYO ELECTRON LIMITED
- Nobutaka Mizutani
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PLATING APPARATUS, PLATING METHOD, AND STORAGE MEDIUM
- Publication number 20150167174
- Publication date Jun 18, 2015
- TOKYO ELECTRON LIMITED
- Nobutaka Mizutani
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PLATING METHOD, PLATING APPARATUS, AND STORAGE MEDIUM
- Publication number 20150147476
- Publication date May 28, 2015
- TOKYO ELECTRON LIMITED
- Nobutaka Mizutani
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PRE-TREATMENT METHOD FOR PLATING AND STORAGE MEDIUM
- Publication number 20150140209
- Publication date May 21, 2015
- TOKYO ELECTRON LIMITED
- Takashi Tanaka
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
PRE-TREATMENT METHOD FOR PLATING AND STORAGE MEDIUM
- Publication number 20150140816
- Publication date May 21, 2015
- TOKYO ELECTRON LIMITED
- Takashi Tanaka
- H01 - BASIC ELECTRIC ELEMENTS

Takashi Tanaka

Person

Patents Grantslast 30 patents

Substrate liquid processing apparatus, substrate liquid processing...

Plating method and recording medium

Plating method, plating apparatus and recording medium

Method for manufacturing a contact pad, method for manufacturing a...

Plating method, plating apparatus and recording medium

Forming method of hard mask

Plating method, plating apparatus and recording medium

Plating apparatus, plating method, and recording medium

Adhesion layer forming method, adhesion layer forming system and re...

Forming method of hard mask, forming apparatus of hard mask and rec...

Plating method and recording medium

Plating method, plated component, and plating system

Plating method, plating apparatus, and storage medium

Plating method, plating system and storage medium

Catalyst layer forming method, catalyst layer forming system and re...

Plating method, plating apparatus, and storage medium

Plating method, plating system and storage medium

Plating apparatus, plating method and storage medium

Catalyst layer forming method, catalyst layer forming system, and r...

Plating apparatus, plating method and storage medium having plating...

Plating method, plating apparatus and storage medium

Plating method, recording medium and plating system

Metal wiring layer forming method, metal wiring layer forming appar...

Pre-treatment method for plating and storage medium

Plating apparatus, plating method, and storage medium

Pre-treatment method for plating and storage medium

Plating apparatus, plating method and storage medium

Plating apparatus, plating method and storage medium

Plating apparatus, plating method and storage medium

Apparatus for plating process

Patents Applicationslast 30 patents

SUBSTRATE LIQUID PROCESSING METHOD, AND RECORDING MEDIUM

MULTILAYER WIRING FORMING METHOD AND RECORDING MEDIUM

SUBSTRATE LIQUID PROCESSING APPARATUS, SUBSTRATE LIQUID PROCESSING...

PLATING METHOD AND RECORDING MEDIUM

METHOD FOR MANUFACTURING A CONTACT PAD, METHOD FOR MANUFACTURING A...

PLATING METHOD, PLATING APPARATUS AND RECORDING MEDIUM

PLATING METHOD, PLATING APPARATUS AND RECORDING MEDIUM

PLATING METHOD, PLATING APPARATUS AND RECORDING MEDIUM

FORMING METHOD OF HARD MASK

PLATING APPARATUS, PLATING METHOD, AND RECORDING MEDIUM

FORMING METHOD OF HARD MASK, FORMING APPARATUS OF HARD MASK AND REC...

SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD AND REC...

PLATING METHOD, PLATED COMPONENT, AND PLATING SYSTEM

PLATING METHOD AND RECORDING MEDIUM

PLATING METHOD, RECORDING MEDIUM AND PLATING SYSTEM

ADHESION LAYER FORMING METHOD, ADHESION LAYER FORMING SYSTEM AND RE...

SEMICONDUCTOR DEVICE, PLATING METHOD, PLATING SYSTEM AND RECORDING...

CATALYST LAYER FORMING METHOD, CATALYST LAYER FORMING SYSTEM AND RE...

METAL WIRING LAYER FORMING METHOD, METAL WIRING LAYER FORMING APPAR...

WIRING LAYER FORMING METHOD, WIRING LAYER FORMING SYSTEM AND RECORD...

PLATING METHOD, PLATING APPARATUS, AND STORAGE MEDIUM

PRE-TREATMENT METHOD OF PLATING, PLATING SYSTEM, AND RECORDING MEDIUM

CATALYST LAYER FORMING METHOD, CATALYST LAYER FORMING SYSTEM, AND R...

CATALYST ADSORPTION METHOD AND CATALYST ADSORPTION DEVICE

PLATING APPARATUS, PLATING METHOD AND STORAGE MEDIUM

ELECTROLESS PLATING METHOD, ELECTROLESS PLATING APPARATUS AND STORA...

PLATING APPARATUS, PLATING METHOD, AND STORAGE MEDIUM

PLATING METHOD, PLATING APPARATUS, AND STORAGE MEDIUM

PRE-TREATMENT METHOD FOR PLATING AND STORAGE MEDIUM

PRE-TREATMENT METHOD FOR PLATING AND STORAGE MEDIUM