Takashi Tanakajima

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Gunma, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method for handling or processing semiconductor wafers
- Patent number 5,547,515
- Issue date Aug 20, 1996
- Shin-Etsu Handotai Co., Ltd.
- Hideo Kudo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Automatic cleaning apparatus for wafers
- Patent number 5,317,778
- Issue date Jun 7, 1994
- Shin-Etsu Handotai Co., Ltd.
- Hideo Kudo
- H01 - BASIC ELECTRIC ELEMENTS