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Takashi Yamada

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Patents Grantslast 30 patents

  • Information Patent Grant

    Bonding wire
    • Patent number 12,132,025
    • Issue date Oct 29, 2024
    • Nippon Micrometal Corporation
    • Takashi Yamada
    • C21 - METALLURGY OF IRON
  • Information Patent Grant

    Al bonding wire
    • Patent number 12,090,578
    • Issue date Sep 17, 2024
    • Nippon Micrometal Corporation
    • Takashi Yamada
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Video display system, video conversion device, and video display me...
    • Patent number 12,058,475
    • Issue date Aug 6, 2024
    • PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    • Yoshinori Okazaki
    • H04 - ELECTRIC COMMUNICATION TECHNIQUE
  • Information Patent Grant

    Bonding wire for semiconductor devices
    • Patent number 11,929,343
    • Issue date Mar 12, 2024
    • Nippon Micrometal Corporation
    • Daizo Oda
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Image display system and image display method
    • Patent number 11,803,347
    • Issue date Oct 31, 2023
    • PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    • Yoshito Tanaka
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Grant

    Bonding wire for semiconductor devices
    • Patent number 11,721,660
    • Issue date Aug 8, 2023
    • Nippon Micrometal Corporation
    • Daizo Oda
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Body structure for automobiles
    • Patent number 11,524,726
    • Issue date Dec 13, 2022
    • Honda Motor Co., Ltd.
    • Kota Fujisawa
    • B60 - VEHICLES IN GENERAL
  • Information Patent Grant

    Bonding wire for semiconductor device
    • Patent number 11,373,934
    • Issue date Jun 28, 2022
    • Nippon Micrometal Corporation
    • Daizo Oda
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Bonding wire for semiconductor devices
    • Patent number 11,342,299
    • Issue date May 24, 2022
    • Nippon Micrometal Corporation
    • Daizo Oda
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Grant

    Vehicle rear structure
    • Patent number 11,220,292
    • Issue date Jan 11, 2022
    • Honda Motor Co., Ltd.
    • Ukyo Watanabe
    • B62 - LAND VEHICLES FOR TRAVELLING OTHERWISE THAN ON RAILS
  • Information Patent Grant

    Vehicle body rear structure
    • Patent number 11,161,549
    • Issue date Nov 2, 2021
    • Honda Motor Co., Ltd.
    • Kazuhiro Sakai
    • B60 - VEHICLES IN GENERAL
  • Information Patent Grant

    Cu pillar cylindrical preform for semiconductor connection
    • Patent number 11,101,234
    • Issue date Aug 24, 2021
    • Nippon Micrometal Corporation
    • Takashi Yamada
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Vehicle body rear structure
    • Patent number 11,097,679
    • Issue date Aug 24, 2021
    • Honda Motor Co., Ltd.
    • Kazuhiro Sakai
    • B60 - VEHICLES IN GENERAL
  • Information Patent Grant

    Video display system
    • Patent number 11,019,315
    • Issue date May 25, 2021
    • PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    • Daizaburo Matsuki
    • G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
  • Information Patent Grant

    Cu alloy bonding wire for semiconductor device
    • Patent number 10,991,672
    • Issue date Apr 27, 2021
    • NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
    • Tetsuya Oyamada
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Cu alloy bonding wire for semiconductor device
    • Patent number 10,985,130
    • Issue date Apr 20, 2021
    • NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
    • Tetsuya Oyamada
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Grant

    Bonding wire for semiconductor device
    • Patent number 10,950,571
    • Issue date Mar 16, 2021
    • NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
    • Tetsuya Oyamada
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Mirror panel, mirror film and display system
    • Patent number 10,877,189
    • Issue date Dec 29, 2020
    • PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    • Takashi Yamada
    • G02 - OPTICS
  • Information Patent Grant

    Bonding wire for semiconductor device
    • Patent number 10,840,208
    • Issue date Nov 17, 2020
    • NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
    • Tetsuya Oyamada
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Cu alloy bonding wire for semiconductor device
    • Patent number 10,790,259
    • Issue date Sep 29, 2020
    • NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
    • Tetsuya Oyamada
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Grant

    Bonding wire for semiconductor device
    • Patent number 10,737,356
    • Issue date Aug 11, 2020
    • Nippon Micrometal Corporation
    • Takashi Yamada
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Cu alloy core bonding wire with Pd coating for semiconductor device
    • Patent number 10,672,733
    • Issue date Jun 2, 2020
    • Nippon Micrometal Corporation
    • Takashi Yamada
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Transparent screen and image display system
    • Patent number 10,634,989
    • Issue date Apr 28, 2020
    • PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    • Hiroshi Yamaguchi
    • G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
  • Information Patent Grant

    Bonding wire for semiconductor device
    • Patent number 10,610,976
    • Issue date Apr 7, 2020
    • Nippon Micrometal Corporation
    • Takashi Yamada
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Vehicle rear structure
    • Patent number 10,583,865
    • Issue date Mar 10, 2020
    • Honda Motor Co., Ltd.
    • Kota Fujisawa
    • B60 - VEHICLES IN GENERAL
  • Information Patent Grant

    Bonding wire for semiconductor device
    • Patent number 10,529,683
    • Issue date Jan 7, 2020
    • NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
    • Tetsuya Oyamada
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Bonding wire for semiconductor device
    • Patent number 10,525,555
    • Issue date Jan 7, 2020
    • Nippon Micrometal Corporation
    • Takashi Yamada
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Vehicle rear structure
    • Patent number 10,518,621
    • Issue date Dec 31, 2019
    • Honda Motor Co., Ltd.
    • Takashi Nitta
    • B60 - VEHICLES IN GENERAL
  • Information Patent Grant

    Cu alloy core bonding wire with Pd coating for semiconductor device
    • Patent number 10,497,663
    • Issue date Dec 3, 2019
    • Nippon Micrometal Corporation
    • Takashi Yamada
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Bonding wire for semiconductor device
    • Patent number 10,468,370
    • Issue date Nov 5, 2019
    • Nippon Micrometal Corporation
    • Takashi Yamada
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

  • Information Patent Application

    BONDING WIRE FOR SEMICONDUCTOR DEVICES
    • Publication number 20240297142
    • Publication date Sep 5, 2024
    • NIPPON MICROMETAL CORPORATION
    • Daizo ODA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BONDING WIRE FOR SEMICONDUCTOR DEVICES
    • Publication number 20240290743
    • Publication date Aug 29, 2024
    • NIPPON MICROMETAL CORPORATION
    • Daizo ODA
    • G01 - MEASURING TESTING
  • Information Patent Application

    BONDING WIRE FOR SEMICONDUCTOR DEVICES
    • Publication number 20240290745
    • Publication date Aug 29, 2024
    • NIPPON MICROMETAL CORPORATION
    • Daizo ODA
    • G01 - MEASURING TESTING
  • Information Patent Application

    BONDING WIRE FOR SEMICONDUCTOR DEVICES
    • Publication number 20240290744
    • Publication date Aug 29, 2024
    • NIPPON MICROMETAL CORPORATION
    • Daizo ODA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BONDING WIRE FOR SEMICONDUCTOR DEVICES
    • Publication number 20230387066
    • Publication date Nov 30, 2023
    • NIPPON MICROMETAL CORPORATION
    • Daizo ODA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BONDING WIRE FOR SEMICONDUCTOR DEVICES
    • Publication number 20230335528
    • Publication date Oct 19, 2023
    • NIPPON MICROMETAL COPORATION
    • Daizo ODA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BONDING WIRE FOR SEMICONDUCTOR DEVICES
    • Publication number 20230245995
    • Publication date Aug 3, 2023
    • NIPPON MICROMETAL CORPORATION
    • Daizo ODA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BONDING WIRE FOR SEMICONDUCTOR DEVICES
    • Publication number 20230215834
    • Publication date Jul 6, 2023
    • Daizo ODA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    AL BONDING WIRE
    • Publication number 20230142531
    • Publication date May 11, 2023
    • NIPPON MICROMETAL CORPORATION
    • Takashi YAMADA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    AL BONDING WIRE
    • Publication number 20230146315
    • Publication date May 11, 2023
    • NIPPON MICROMETAL CORPORATION
    • Takashi YAMADA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    COPPER ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICES
    • Publication number 20230018430
    • Publication date Jan 19, 2023
    • NIPPON MICROMETAL CORPORATION
    • Daizo ODA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    AL BONDING WIRE
    • Publication number 20220152749
    • Publication date May 19, 2022
    • NIPPON MICROMETAL CORPORATION
    • Takashi YAMADA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    BONDING WIRE
    • Publication number 20220157766
    • Publication date May 19, 2022
    • NIPPON MICROMETAL CORPORATION
    • Takashi YAMADA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BONDING WIRE FOR SEMICONDUCTOR DEVICES
    • Publication number 20220108971
    • Publication date Apr 7, 2022
    • NIPPON MICROMETAL CORPORATION
    • Daizo ODA
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Application

    IMAGE DISPLAY SYSTEM AND IMAGE DISPLAY METHOD
    • Publication number 20210397400
    • Publication date Dec 23, 2021
    • Panasonic Intellectual Property Management Co., Ltd.
    • Yoshito TANAKA
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    VIDEO DISPLAY SYSTEM, VIDEO CONVERSION DEVICE, AND VIDEO DISPLAY ME...
    • Publication number 20210400230
    • Publication date Dec 23, 2021
    • Panasonic Intellectual Property Management Co., Ltd.
    • Yoshinori OKAZAKI
    • H04 - ELECTRIC COMMUNICATION TECHNIQUE
  • Information Patent Application

    BODY STRUCTURE FOR AUTOMOBILES
    • Publication number 20210107571
    • Publication date Apr 15, 2021
    • Honda Motor Co., Ltd.
    • Kota Fujisawa
    • B60 - VEHICLES IN GENERAL
  • Information Patent Application

    Cu ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICE
    • Publication number 20210043599
    • Publication date Feb 11, 2021
    • NIPPON STREET CHEMICAL & MATERTIAL CORPORATION CO., LTD.
    • Tetsuya Oyamada
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BONDING WIRE FOR SEMICONDUCTOR DEVICE
    • Publication number 20200373226
    • Publication date Nov 26, 2020
    • NIPPON MICROMETAL CORPORATION
    • Daizo ODA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    VIDEO DISPLAY SYSTEM
    • Publication number 20200322583
    • Publication date Oct 8, 2020
    • Panasonic Intellectual Property Management Co., Ltd.
    • Daizaburo MATSUKI
    • G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
  • Information Patent Application

    COPPER ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICES
    • Publication number 20200312808
    • Publication date Oct 1, 2020
    • NIPPON MICROMETAL CORPORATION
    • Daizo ODA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Cu ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICE
    • Publication number 20200279824
    • Publication date Sep 3, 2020
    • NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
    • Tetsuya OYAMADA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    VEHICLE REAR STRUCTURE
    • Publication number 20200172167
    • Publication date Jun 4, 2020
    • Honda Motor Co., Ltd.
    • Ukyo WATANABE
    • B62 - LAND VEHICLES FOR TRAVELLING OTHERWISE THAN ON RAILS
  • Information Patent Application

    Cu ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICE
    • Publication number 20200168578
    • Publication date May 28, 2020
    • NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
    • Tetsuya OYAMADA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    VEHICLE BODY REAR STRUCTURE
    • Publication number 20200102014
    • Publication date Apr 2, 2020
    • Honda Motor Co., Ltd.
    • Kazuhiro SAKAI
    • B60 - VEHICLES IN GENERAL
  • Information Patent Application

    VEHICLE BODY REAR STRUCTURE
    • Publication number 20200101914
    • Publication date Apr 2, 2020
    • Honda Motor Co., Ltd.
    • Kazuhiro SAKAI
    • B60 - VEHICLES IN GENERAL
  • Information Patent Application

    Cu ALLOY CORE BONDING WIRE WITH Pd COATING FOR SEMICONDUCTOR DEVICE
    • Publication number 20200013747
    • Publication date Jan 9, 2020
    • NIPPON MICROMETAL CORPORATION
    • Takashi YAMADA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BONDING WIRE FOR SEMICONDUCTOR DEVICE
    • Publication number 20200013748
    • Publication date Jan 9, 2020
    • NIPPON MICROMETAL CORPORATION
    • Takashi YAMADA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    TRANSPARENT SCREEN AND IMAGE DISPLAY SYSTEM
    • Publication number 20190332001
    • Publication date Oct 31, 2019
    • HIROSHI YAMAGUCHI
    • G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
  • Information Patent Application

    BONDING WIRE FOR SEMICONDUCTOR DEVICE
    • Publication number 20190326246
    • Publication date Oct 24, 2019
    • NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
    • Tetsuya OYAMADA
    • H01 - BASIC ELECTRIC ELEMENTS