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Takashi Yamasaki
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Kokubu, JP
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last 30 patents
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Patent Grant
Wiring board for flip-chip-mounting
Patent number
6,288,347
Issue date
Sep 11, 2001
Kyocera Corporation
Shoichi Nakagawa
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Method for manufacturing ceramic laminated substrate
Patent number
6,048,424
Issue date
Apr 11, 2000
Denso Corporation
Yasutomi Asai
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Surface mount type package unit and method for manufacturing the same
Patent number
5,901,046
Issue date
May 4, 1999
Denso Corporation
Tameharu Ohta
H01 - BASIC ELECTRIC ELEMENTS