Takashi Yui

Person

Otsu, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Power amplifier semiconductor device
- Patent number 12,278,601
- Issue date Apr 15, 2025
- NUVOTON TECHNOLOGY CORPORATION JAPAN
- Akihiko Nishio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 10,847,702
- Issue date Nov 24, 2020
- PANASONIC SEMICONDUCTOR SOLUTIONS CO., LTD.
- Takeshi Kawabata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module and method for manufacturing the same
- Patent number 10,305,008
- Issue date May 28, 2019
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Takeshi Kawabata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having stacked chips, a re-distribution layer,...
- Patent number 9,917,066
- Issue date Mar 13, 2018
- Panasonic Corporation
- Nobuo Aoi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,443,793
- Issue date Sep 13, 2016
- Panasonic Corporation
- Hiroki Yamashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device comprising an extended semiconductor chip havi...
- Patent number 8,866,284
- Issue date Oct 21, 2014
- Panasonic Corporation
- Shouichi Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 8,766,418
- Issue date Jul 1, 2014
- Panasonic Corporation
- Teppei Iwase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module for stacking and stacked semiconductor module
- Patent number 8,716,868
- Issue date May 6, 2014
- Panasonic Corporation
- Takeshi Kawabata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 8,330,266
- Issue date Dec 11, 2012
- Panasonic Corporation
- Takashi Yui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a wiring board having an angled linear part
- Patent number 8,022,305
- Issue date Sep 20, 2011
- Panasonic Corporation
- Takashi Yui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor wafer, method of manufacturing the same and semicondu...
- Patent number 7,964,475
- Issue date Jun 21, 2011
- Panasonic Corporation
- Yukiko Haraguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked chip semiconductor device and method for manufacturing the...
- Patent number 7,521,288
- Issue date Apr 21, 2009
- Panasonic Corporation
- Yoshiyuki Arai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 7,298,043
- Issue date Nov 20, 2007
- Matsushita Electric Industrial Co., Ltd.
- Takashi Yui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked chip semiconductor device and method for manufacturing the...
- Patent number 7,239,021
- Issue date Jul 3, 2007
- Matsushita Electric Industrial Co., Ltd.
- Yoshiyuki Arai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 7,138,706
- Issue date Nov 21, 2006
- Matsushita Electric Industrial Co., Ltd.
- Yoshiyuki Arai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method for the same
- Patent number 7,087,455
- Issue date Aug 8, 2006
- Matsushita Electric Industrial Co., Ltd.
- Toshiyuki Fukuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 7,078,818
- Issue date Jul 18, 2006
- Matsushita Electric Industrial Co., Ltd.
- Hiroaki Fujimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 6,992,396
- Issue date Jan 31, 2006
- Matsushita Electric Industrial Co., Ltd.
- Yoshiyuki Arai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor chips on a wiring board
- Patent number 6,777,796
- Issue date Aug 17, 2004
- Matsushita Electric Industrial Co., Ltd.
- Hiroaki Fujimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor chips attached to a wiring board
- Patent number 6,707,143
- Issue date Mar 16, 2004
- Matsushita Electric Industrial Co., Ltd.
- Hiroaki Fujimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 6,693,347
- Issue date Feb 17, 2004
- Matsushita Electric Industrial Co., Ltd.
- Hiroaki Fujimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a plurality of stacked semiconductor ch...
- Patent number 6,509,638
- Issue date Jan 21, 2003
- Matsushita Electric Industrial Co., Ltd.
- Hiroaki Fujimoto
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250070063
- Publication date Feb 27, 2025
- NUVOTON TECHNOLOGY CORPORATION JAPAN
- Hironao NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER AMPLIFIER SEMICONDUCTOR DEVICE
- Publication number 20250015768
- Publication date Jan 9, 2025
- NUVOTON TECHNOLOGY CORPORATION JAPAN
- Akihiko NISHIO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20190189881
- Publication date Jun 20, 2019
- Panasonic Intellectual Property Management Co., Ltd.
- Takeshi KAWABATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20180040792
- Publication date Feb 8, 2018
- Panasonic Intellectual Property Management Co., Ltd.
- Takeshi KAWABATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20150371971
- Publication date Dec 24, 2015
- PANASONIC CORPORATION
- KENJI YOKOYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20140327157
- Publication date Nov 6, 2014
- NOBUO AOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140124911
- Publication date May 8, 2014
- PANASONIC CORPORATION
- TEPPEI IWASE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140103504
- Publication date Apr 17, 2014
- PANASONIC CORPORATION
- HIROKI YAMASHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20130299957
- Publication date Nov 14, 2013
- SHOUICHI KOBAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE FOR STACKING AND STACKED SEMICONDUCTOR MODULE
- Publication number 20100295186
- Publication date Nov 25, 2010
- PANASONIC CORPORATION
- Takeshi Kawabata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20100283129
- Publication date Nov 11, 2010
- Michinari TETANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20100230801
- Publication date Sep 16, 2010
- Takashi YUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE
- Publication number 20100044880
- Publication date Feb 25, 2010
- Isamu AOKURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF
- Publication number 20090284942
- Publication date Nov 19, 2009
- Takashi YUI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR WAFER, METHOD OF MANUFACTURING THE SAME AND SEMICONDU...
- Publication number 20080135975
- Publication date Jun 12, 2008
- Matsushita Electric Industrial Co., Ltd.
- Yukiko Haraguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked chip semiconductor device and method for manufacturing the...
- Publication number 20070187811
- Publication date Aug 16, 2007
- Matsushita Electric Industrial Co., Ltd.
- Yoshiyuki Arai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20060209517
- Publication date Sep 21, 2006
- Matsushita Electric Industrial Co., Ltd.
- Takashi Yui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method for the same
- Publication number 20060208349
- Publication date Sep 21, 2006
- Matsushita Electric Industrial Co., Ltd.
- Toshiyuki Fukuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for fabricating the same
- Publication number 20060091563
- Publication date May 4, 2006
- Matsushita Electric Industrial Co., Ltd.
- Yoshiyuki Arai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method for the same
- Publication number 20060079023
- Publication date Apr 13, 2006
- Matsushita Electric Industrial Co., Ltd.
- Toshiyuki Fukuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked chip semiconductor device and method for manufacturing the...
- Publication number 20050003580
- Publication date Jan 6, 2005
- Matsushita Electric Industrial Co., Ltd.
- Yoshiyuki Arai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20040183173
- Publication date Sep 23, 2004
- Matsushita Electric Industrial Co., Ltd.
- Hiroaka Fujimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method for the same
- Publication number 20040145040
- Publication date Jul 29, 2004
- Toshiyuki Fukuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for fabricating the same
- Publication number 20040126926
- Publication date Jul 1, 2004
- MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- Yoshiyuki Arai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for manufacturing the same
- Publication number 20040051168
- Publication date Mar 18, 2004
- Matsushita Electric Industrial Co., Ltd.
- Yoshiyuki Arai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20030089972
- Publication date May 15, 2003
- Matsushita Electric Industrial Co., Ltd.
- Hiroaki Fujimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20030085457
- Publication date May 8, 2003
- Matsushita Electric Industrial Co., Ltd.
- Hiroaki Fujimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20030085458
- Publication date May 8, 2003
- Matsushita Electric Industrial Co., Ltd.
- Hiroaki Fujimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20020027275
- Publication date Mar 7, 2002
- Hiroaki Fujimoto
- H01 - BASIC ELECTRIC ELEMENTS

Takashi Yui

Person

Patents Grantslast 30 patents

Power amplifier semiconductor device

Semiconductor module

Semiconductor module and method for manufacturing the same

Semiconductor device having stacked chips, a re-distribution layer,...

Semiconductor device

Semiconductor device comprising an extended semiconductor chip havi...

Semiconductor device

Semiconductor module for stacking and stacked semiconductor module

Semiconductor device

Semiconductor device with a wiring board having an angled linear part

Semiconductor wafer, method of manufacturing the same and semicondu...

Stacked chip semiconductor device and method for manufacturing the...

Semiconductor device

Stacked chip semiconductor device and method for manufacturing the...

Semiconductor device and method for manufacturing the same

Semiconductor device and manufacturing method for the same

Semiconductor device

Semiconductor device and method for fabricating the same

Stacked semiconductor chips on a wiring board

Stacked semiconductor chips attached to a wiring board

Semiconductor device

Semiconductor device having a plurality of stacked semiconductor ch...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

POWER AMPLIFIER SEMICONDUCTOR DEVICE

SEMICONDUCTOR MODULE

SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR MODULE FOR STACKING AND STACKED SEMICONDUCTOR MODULE

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE

SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF

SEMICONDUCTOR WAFER, METHOD OF MANUFACTURING THE SAME AND SEMICONDU...

Stacked chip semiconductor device and method for manufacturing the...

Semiconductor device

Semiconductor device and manufacturing method for the same

Semiconductor device and method for fabricating the same

Semiconductor device and manufacturing method for the same

Stacked chip semiconductor device and method for manufacturing the...

Semiconductor device

Semiconductor device and manufacturing method for the same

Semiconductor device and method for fabricating the same

Semiconductor device and method for manufacturing the same

Semiconductor device

Semiconductor device

Semiconductor device

Semiconductor device